Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package, in which a sensing chip is packaged by using PCBs stacked on top of one another, whereby the thickness of the package slim can be kept slim, and at the same time, it can be manufactured at a low cost and can be easily manufactured.

Abstract: The present invention relates to a micro LED grip body for vacuum-sucking micro LEDs. More particularly, the present invention relates to a micro LED grip body provided with a mask below a porous member to increase vacuum pressure for vacuum-sucking micro LEDs such that the micro LEDs are transferred without deviation.

Abstract: The present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED and transferring the micro LED to a display substrate. In particular, the present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED in a state where a grip surface of the transfer head and an upper surface of the micro LED are not in contact with each other when transferring the micro LED. Accordingly, it is possible to prevent positional error which may occur when transferring the micro LED and prevent damage of the micro LED.

Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.

Abstract: A fluid permeable anodic oxide film includes a plurality of regularly-disposed pores formed by anodizing metal and a plurality of permeation holes having an inner width larger than an inner width of the pores and extending through the fluid permeable anodic oxide film. Also provided is a fluid permeable body which makes use of the fluid permeable anodic oxide film.

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

Abstract: The present invention relates to an air quality measuring apparatus. The air quality measuring apparatus measures air quality using air flow generated therein using a variable and restorable pumping means, thereby reducing power consumption and a volume of the air quality measuring apparatus so as to be portable.

Abstract: A micro heater includes a heater electrode formed on a first supporting portion. A micro sensor further includes a sensor electrode formed on the first supporting portion. In the micro heater and the micro sensor an anti-etching dam is formed on the supporting portion. The dam protects the shape of the first supporting portion during etching.

Abstract: A micro heater includes a substrate formed of an anodized film and a heater electrode formed on the substrate and provided with a heat generation wiring line. The heat generation wiring line is formed in a laminated state. Also disclosed are a micro sensor and a micro sensor manufacturing method.

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

Abstract: The present invention relates to a substrate for supporting an antenna pattern. The substrate includes a porous anodic oxide layer having a plurality of pores formed by anodizing metal. A metallic material is filled in at least a part of the pores.

Abstract: A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.

Abstract: The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al2O3 insulation layer is formed by anodizing the aluminum layer without forming an extra insulation layer after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-layered capacitor having a high capacitance and a high reliability can be provided by stacking capacitors comprising a plurality of aluminum oxide layers using a more simplified process according to the present invention.

Abstract: A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.

Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.

Abstract: A micro heater and a micro sensor is capable of providing a heater having a small thermal capacity by forming an air gap which surrounds the heater wire, and forming the heater wire on a porous substrate.

Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.

Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.

Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.