Abstract: A system and method is provided for determining a voltage output of a programmable power converter based on programming voltage data received from one of a variety of alternate sources. Specifically, in one embodiment of the present invention, a control unit is adapted to monitor a digital data serial interface, a digital data parallel interface, and an analog data interface to determine whether programming voltage data has been received. If programming voltage data has been received, the data is used to determine an output voltage for the programmable power converter. If more than one set of programming voltage data has been received, a determination is made as to which set of data takes priority. The selected set of data is then used to determine an output voltage for the programmable power converter.

Abstract: A DC-DC power converter has a transformer with a primary side and secondary side. A first power transistor is coupled between a first end of a first winding of the secondary side and a ground terminal. A second power transistor is coupled between a second end of the first winding and the ground terminal. A first driver transistor is coupled to a gate of the first power transistor, and a second driver transistor is coupled to a gate of the second power transistor. A separate driver winding taken off the secondary side of the transformer controls the gates of the first and second driver transistors. First and second inductors are coupled between the opposite ends of the first winding and an output of the power supply. First and second resistors are coupled between the gates of the first and second driver transistors and the ground terminal, respectively.

Abstract: A system and method is provided for utilizing output-timing data to control at least one output timing parameter of a point-of-load (“POL”) regulator. Specifically, a power supply controller (“controller”) is adapted to transmit output-timing data to at least one POL regulator. In one embodiment of the present invention, each POL regulator includes an output builder, a control unit and a storage device. The control unit is adapted to store the output-timing data in the storage device. The control unit and the output builder are then adapted to produce an output having at least one output timing parameter in accordance with the output-timing data. Examples of output-timing data include sequencing data, turn-on data, turn-off data, termination data, slew-rate data, etc. For example, a POL regulator may be adapted to utilize output-timing data, or a portion thereof (e.g., slew-rate data), to generate an output having a particular slew rate.

Abstract: A pulse width modulation system for use in a switching power supply circuit provides high-resolution pulse width modulated signals. The pulse width modulation system is configured to receive a control signal comprising a (m+n)-bit binary word and to provide a pulse width modulated signal with a predetermined average duty cycle having a resolution of substantially 2?(m+n). The pulse width modulation system includes a timing circuit for providing 2m timing signals, a dithering circuit, and a signal generator. Upon receiving the control signal, the dithering circuit is configured to provide a modified control signal, which comprises a series of up to 2n m-bit binary words. The signal generator is configured to receive the timing signals and the modified control signal and to provide the pulse width modulated signal having a duty cycle, which, when averaged over 2n timing cycles, is approximately equal to the predetermined average duty cycle.

Abstract: A system and method is provided for using a point-on-load (“POL”) control unit to program and/or monitor a POL regulator. Specifically, in one embodiment of the present invention, a power supply controller is adapted to provide initial-configuration data to at least one POL regulator. A POL control unit (located within the POL regulator) then stores at least a portion of the initial-configuration data in a storage device and uses at least a portion of the initial-configuration data to produce an output. The POL control unit is further adapted to store fault-monitoring data in the storage device and provide at least a portion of the fault-monitoring data to the controller. If the provided portion violates a known parameter, the controller (or POL control unit) may respond by perform a particular action (e.g., disable the POL regulator, etc.).

Abstract: A semiconductor device has a driver device (10) in proximity to a power device (12). In making the semiconductor device, an N+ layer (24) is formed on a substrate (22). A portion of the N+ layer is removed, substantially down to the substrate, to provide a layer offset (28) between the driver device area and power device area. An epi region of uniform thickness is formed over the driver device and power device areas. A portion of the epi layer is removed to provide another layer offset (70). An oxide layer (68) of uniform thickness is formed over the epi region. The oxide layer is planarized to remove oxide layer over the N+ layer. An oxide-filled trench (80) is formed between the driver device and the power device. The oxide-filled trench extends down to the oxide layer to isolate the driver device from the power device.

Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

Abstract: A power supply comprises at least one power switch adapted to convey power between input and output terminals of the power supply, and a digital controller adapted to control operation of the at least one power switch responsive to an output measurement of the power supply. The digital controller comprises an analog-to-digital converter providing a digital error signal representing a voltage difference between the output measurement and a reference value, a digital filter providing a digital control output based on a sum of previous error signals and previous control outputs, an error controller adapted to modify operation of the digital filter upon an error condition, and a digital pulse width modulator providing a control signal to the power switch having a pulse width corresponding to the digital control output.

Abstract: A power control system comprises a plurality of POL regulators, at least one serial data bus operatively connecting the plurality of POL regulators, and a system controller connected to the serial data bus and adapted to send and receive digital data to and from the plurality of POL regulators. The serial data bus further comprises a first data bus carrying programming and control information between the system controller and the plurality of POL regulators. The serial data bus may also include a second data bus carrying fault management information between the system controller and the plurality of POL regulators. The power control may also include a front-end regulator providing an intermediate voltage to the plurality of POL regulators on an intermediate voltage bus.

Abstract: A pulse width modulation system for use in a switching power supply circuit provides high-resolution pulse width modulated signals. The pulse width modulation system is configured to receive a control signal comprising a (m+n)-bit binary word and to provide a pulse width modulated signal with a predetermined average duty cycle having a resolution of substantially 2?(m+n). The pulse width modulation system includes a timing circuit for providing 2m timing signals, a dithering circuit, and a signal generator. Upon receiving the control signal, the dithering circuit is configured to provide a modified control signal, which comprises a series of up to 2n m-bit binary words. The signal generator is configured to receive the timing signals and the modified control signal and to provide the pulse width modulated signal having a duty cycle, which, when averaged over 2n timing cycles, is approximately equal to the predetermined average duty cycle.

Abstract: A system and method is provided for dynamically controlling output voltage slew rate in a power converter. Preferred embodiments of the present invention operate in accordance with a power converter including at least a slew-rate control lead (a trim lead, a control lead, etc.), an error-amplifier circuit located therein, a slew-rate circuit, and a controller electrically connected to the power converter and adapted to dynamically control the converter's output voltage slew rate through the transmission of a slew-rate signal. In one embodiment of the present invention, the slew-rate circuit is external to the power converter and electrically connected to both a trim lead of the power converter and to the controller. In another embodiment of the present invention, the slew-rate circuit is internal to the power converter and electrically connected to both a control lead of the power converter and to the error-amplifier circuit.

Abstract: The invention is related to methods and apparatus for inserting and/or holding electronic modules into equipment racks. For example, the electronic module can correspond to a power supply, and the equipment rack can correspond to a shelf for a standardized equipment rack. One embodiment includes a handle that is movable from a first position to a second position. A power supply is inserted into an equipment rack with a handle in a first position. The first position of the handle permits partial insertion of the power supply, thereby permitting electrical connection of pre-charge contacts. The handle is then moved to a second position, thereby pulling in the power supply and permitting regular power contacts to make an electrical connection. One embodiment further includes a tongue and groove arrangement to prevent vertical displacement of an electronic module.

Abstract: A switched mode power supply comprises a first switch coupled to an input power source, a second switch coupled to ground, and an output filter coupled to a phase node defined between the first and second switches. The first and second switches are responsive to a pulse width modulated signal to thereby regulate power provided to the output filter. A controller is provided in a feedback loop that monitors operation of the first and second switches and delays activation of one of the first and second switches to preclude simultaneous conduction. The controller comprises at least one delay control circuit adapted to delay delivery of the pulse width modulated signal to at least one of the first and second switches. The delay control circuit detects a phase difference between state transitions of the first and second switches and provides a delay corresponding to a magnitude of the phase difference.

Abstract: The invention is related to methods and apparatus for inserting and/or holding electronic modules into equipment racks. For example, the electronic module can correspond to a power supply, and the equipment rack can correspond to a shelf for a standardized equipment rack. One embodiment includes a handle that is movable from a first position to a second position. A power supply is inserted into an equipment rack with a handle in a first position. The first position of the handle permits partial insertion of the power supply, thereby permitting electrical connection of pre-charge contacts. The handle is then moved to a second position, thereby pulling in the power supply and permitting regular power contacts to make an electrical connection. One embodiment further includes a tongue and groove arrangement to prevent vertical displacement of an electronic module.

Abstract: The invention is related to methods and apparatus for inserting and/or holding electronic modules into equipment racks. For example, the electronic module can correspond to a power supply, and the equipment rack can correspond to a shelf for a standardized equipment rack. One embodiment includes a handle that is movable from a first position to a second position. A power supply is inserted into an equipment rack with a handle in a first position. The first position of the handle permits partial insertion of the power supply, thereby permitting electrical connection of pre-charge contacts. The handle is then moved to a second position, thereby pulling in the power supply and permitting regular power contacts to make an electrical connection. One embodiment further includes a tongue and groove arrangement to prevent vertical displacement of an electronic module.

Abstract: A multiple output voltage power supply includes a transformer having a primary winding and a plurality of secondary windings. The primary winding is adapted to have an input voltage coupled thereto. A primary side switch is coupled to the primary winding and is adapted to control power applied to the transformer in a power cycle responsive to a peak current mode control signal. A plurality of output circuits are coupled to respective ones of the plurality of secondary windings and provide respective output voltages. The plurality of output circuits each further includes a forward rectifier adapted to rectify power during a positive portion of the power cycle and a free-wheeling rectifier adapted to rectify power during a negative portion of the power cycle. One of the plurality of output circuits further includes a bypass switch adapted to interrupt operation of the respective forward rectifier. A secondary side post regulation circuit controls operation of the bypass switch.

Abstract: A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and a plurality of leads to a heat sink comprising a sheet of thermally conductive material. The mounting system comprises two primary elements: a rigid retainer and a pressure clamp. The rigid retainer comprises a block of non-conductive material having recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the recess with the plurality of leads extending from the retainer. The pressure clamp is configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the heat sink.

Abstract: A coil element with no solder joints is made of a continuous conductive strip includes a first terminal, a second terminal, a conductive path between the first terminal and the second terminal. The conductive path has curved regions and foldable hinge regions shaped such that the coil element may be folded into single or multi-turn coils for use in transformers and other electronic devices.