Abstract: A heat conducting composition including: a polymer component (A); a surface-treated filler (B) obtained by surface-treating a filler with ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, with the ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having an adhesion percentage to the filler of from 20.0 to 50.0% by mass; and a silicon-containing oxide-coated nitride (C) having a nitride and a silicon-containing oxide coating that coats the nitride.

Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.

Abstract: The composition comprises a compound (A) represented by general formula (1) and a compound (B) represented by general formula (2), and comprises 0.00002 to 2.0 parts by mass of the compound (B) with respect to 100 parts by mass of the compound (A), (R1—COO)n—R2—(NCO)m??(1) (R1—COO)n—R2—NHC(?O)NH—R2—(OCO—R1)m??(2) wherein in general formulae (1) and (2), R1 is an ethylenically unsaturated group having 2 to 7 carbon atoms; R2 is a (m+n)-valent hydrocarbon group having 1 to 7 carbon atoms and optionally contain an ether group; R1 and R2 in the general formula (1) are the same as R1 and R2 in the general formula (2); and n and m each represent an integer of one or two.

Abstract: A method for producing a chloroprene-based polymer latex which can efficiently remove a residual volatile organic substance from the chloroprene-based polymer latex while suppressing the deposition of agglomerates is provided. In the method for producing a chloroprene-based polymer latex of the present invention, when the residual volatile organic substance comprised in the latex is volatilized and removed, a mixed fluid of one or more gases selected from the group consisting of inert gases and air, and water is contacted with the latex at a gas pressure higher than the saturated water vapor pressure, and a temperature of the mixed fluid is a temperature lower than a boiling point of water at the gas pressure.

Abstract: A method for producing the silica carrier which includes kneading fumed silica obtained by a combustion method, silica gel obtained by a gel method, and colloidal silica obtained by a sol-gel method or a water glass method, molding the resulting kneaded product, and calcining the resulting molded body. The silica carrier has, in the measurement of pore size distribution, mesopores with a pore size of 2 to 50 nm and macropores with a pore size of more than 50 nm and 1,000 nm or less.

Abstract: A resin composition for molding and an electronic component device are provided. The resin composition for molding includes: a curable resin; and an inorganic filler including a calcium titanate particle.

Abstract: A fluorine-containing ether compound represented by the following formula (1) is provided. R2—CH2—R1—CH2OCH2CH(OH)—(CH2)n—CH(OH)CH2OCH2—R1—CH2—R2??(1) (in the formula (1), n is an integer of 2 to 6, R1 is a perfluoropolyether chain, R2 is —OCH2CH(OH)CH2O(CH2)mOH (m in the formula is an integer of 2 to 4)).

Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.

Abstract: Provided is a method for decomposing a flavonoid glycoside, wherein a flavonoid glycoside-containing raw material is hydrothermally treated to decompose a flavonoid glycoside into a flavonoid.

Abstract: A molding resin composition includes: an epoxy resin; a curing agent; and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 60% by volume to 80% by volume with respect to a total amount of the inorganic filler.

Abstract: A surface-treated filler obtained by surface-treating a surface of a filler with ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, wherein an adhesion percentage of the ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane to the filler is from 20.0 to 50.0% by mass.

Abstract: A fluorine-containing ether compound represented by the following formula (1). R1—R2—CH2—R3—CH2—R4??(1) (R1 is an organic group having an alicyclic structure having 3 to 13 carbon atoms; R2 is represented by the following formula (2), and a in the formula (2) is an integer of 1 to 3; R3 is a perfluoropolyether chain; and R4 is a terminal group having two or three polar groups, in which individual polar groups bond to different carbon atoms and the carbon atoms to which the polar groups bond are bonded to each other through a linking group having a carbon atom to which the polar groups do not bond.

Abstract: A method of producing boron trichloride, which includes: a metal chlorination step of bringing a gas containing chlorine gas into contact with raw boron carbide as boron carbide including, as an impurity, a metal other than boron, and allowing the metal to react with the chlorine gas in the gas containing the chlorine gas, to form a metal chloride and to obtain boron carbide containing the metal chloride; a removal step of removing the metal chloride from the boron carbide containing the metal chloride, obtained in the metal chlorination step; and a generation step of bringing a gas containing chlorine gas into contact with the boron carbide from which the metal chloride has been removed in the removal step, and allowing the boron carbide and the chlorine gas in the gas containing the chlorine gas to react with each other to generate boron trichloride.

Abstract: Provided is a method for storing a fluorobutene by which polymerization is unlikely to proceed during storage. A fluorobutene represented by general formula C4HxFy where x is 0 or more and 7 or less, y is 1 or more and 8 or less, and x+y is 8 contains or does not contain at least one of sodium, potassium, magnesium, and calcium as a metal impurity. The fluorobutene is stored in a container in which the total concentration of sodium, potassium, magnesium, and calcium is 1,000 ppb by mass or less when containing at least one of sodium, potassium, magnesium, and calcium.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more.

Abstract: Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).

Abstract: A SiC epitaxial wafer includes a SiC substrate and an epitaxial layer laminated on the SiC substrate, wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and the concentration of boron is less than 1.0×1014 cm?3 at any position in the plane of the epitaxial layer.

Abstract: Provided are: a lightweight bumper reinforcement which, with respect to the load during a collision, exhibits high rigidity against a light load and, against a heavy load, is capable of plastic deformation to absorb collision energy while effectively transferring unabsorbed energy to a crash box; a method for manufacturing the same; and a resin reinforcement member for a bumper reinforcement. The bumper reinforcement of the present disclosure comprises a body portion extending along a vehicle width direction, and a resin reinforcement portion extending along the vehicle width direction and disposed on the vehicle body side relative to the body portion. The body portion has at least one first joint portion on the vehicle body side. The resin reinforcement portion has at least one second joint portion joined to the first joint portion, and one or more reinforcement ribs projecting on the vehicle body side and extending along the vehicle width direction.

Abstract: In a SiC substrate of the present invention, in a case where a point 10 mm inside from an outer peripheral edge in a [11-20] direction from a center is defined as a first outer peripheral point and any point within a circle having a diameter of 10 mm from the center is defined as a first center point, the tensile stress of the first outer peripheral point in a <1-100> direction, which is a circumferential direction of the first outer peripheral point, is larger than the tensile stress of the first center point in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral point.

Abstract: In a SiC substrate of the present invention, in a case where the SiC substrate is supported on an inner periphery by an inner peripheral support surface positioned to overlap a circumference having a radius of 17.5 mm from a center, in a case where a plane connecting first points of an upper surface overlapping the inner peripheral support surface when seen in a thickness direction is defined as a first reference plane, and an upper side of the first reference plane is defined as a positive side, a bow is less than 40 ?m.