Abstract: A band pass filter includes a resonator including a first inductor and a first capacitor coupled in series between a first port and a second port, a second inductor coupled in parallel with the resonator, a second capacitor coupled in parallel with the resonator, and a third capacitor coupled between one end of the second capacitor and the ground to perform a low pass filter function.

Abstract: A circuit board including: an insulation layer having a first surface and a second surface facing each other; a first pad layer including a first connection pad and a first conductive layer stacked on the first connection pad, a portion of the first pad layer buried in the insulation layer, and another portion of the first pad layer protruding from a first surface of the insulation layer; and a second conductive layer disposed on the first conductive layer.

Abstract: A manufacturing method for a printed circuit board includes: forming a first substrate portion; forming an intermediate insulating layer on the first substrate portion; forming a temporary layer on a surface opposite to a surface on which the intermediate insulating layer of the first substrate portion is formed; flattening the temporary layer; forming a second substrate portion on the intermediate insulating layer; and removing the temporary layer.

Abstract: A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers respectively disposed on or in the one or more second insulating layers; and a first passive device embedded in at least one of the first and second board units. The second board unit is disposed on the first board unit, and the first board unit has a second cavity passing through at least a portion of the plurality of first insulating layers on the first passive device based on a stacking direction of the plurality of first wiring layers.

Abstract: A substrate includes: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a via hole including a lower hole formed in the first insulating layer, and an upper hole formed in the second insulating layer and connected to the lower hole, in which a width of an upper side of the lower hole is larger than a width of a lower side of the lower hole, and a width of an upper side of the upper hole is larger than a width of a lower side of the upper hole.

Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1??L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1? indicates a second-directional size of the conductive resin layer in the band portion.

Abstract: An actuator for optical image stabilization includes a fixed frame having an internal space; a moving frame disposed in the fixed frame and configured to be movable relative to the fixed frame; a first driving unit including a plurality of magnets disposed on the fixed frame, and a plurality of coils disposed on the moving frame and configured to be movable together with the moving frame relative to the fixed frame; and a sensor substrate including a moving part coupled to the moving frame and configured to be movable together with the moving frame relative to the fixed frame; and an extension substrate extending from one side of the sensor substrate and covering a portion of at least one surface of the fixed frame, wherein an image sensor is disposed on the moving part of the sensor substrate, and a control unit is disposed on the extension substrate.

Abstract: An imaging lens system is provided. The imaging lens system includes a lens group including a plurality of lenses; and an optical path folding member disposed between the lens group and an imaging plane. The lens group may include three or more lenses sequentially arranged from an object side. The optical path folding member may include a first prism and a second prism. At least one of the first prism and the second prism may include a visor that prevents a flare.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed outside the body and connected to the internal electrode, in which the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains includes a core-shell structure including an inner core area and a shell area covering at least a portion of the core area, and 90% or more of the plurality of dielectric crystal grains satisfy an average size of 170.0 nm to 190.0 nm, and a maximum deviation of sizes of the dielectric crystal grains satisfies ±60.0 nm compared to an average size of the dielectric crystal grains.

Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.

Abstract: An optical imaging system includes an optical system including at least six lenses, sequentially disposed from an object side toward an image side, an image sensor configured to convert light incident through the optical system into an electronic signal, and a variable stop configured to change an incident hole diameter and disposed toward the object side of a lens of the optical system closest to the object side, wherein TTL is a distance to an imaging plane of the image sensor from an object-side surface of the lens closest to the object side and 4.7 mm <TTL <6.00 mm, and wherein Ri is a radius of curvature of an object-side surface of a lens of the optical system second closest to the image sensor, Rj is a radius of curvature of an image-side surface of the lens that is second closest to the image sensor, and ?0.5<(|Ri|?|Rj|)/(|Ri|?|Rj|)/(|Ri|+|Rj|)<0.5.

Abstract: An optical system includes: a first lens having negative refractive power; a second lens; a third lens; a fourth lens; a fifth lens; a sixth lens; and an image sensor configured to convert an image of a subject incident through the first to sixth lenses into electrical signals, wherein the first to sixth lenses are sequentially disposed from an object side of the optical system, and wherein TTL/(ImgH*2)?0.75 is satisfied, with TTL being a distance from an object-side surface of the first lens to an image plane of the image sensor and ImgH being half of a diagonal length of the image plane of the image sensor.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens having a convex image-side surface, a sixth lens, and a seventh lens disposed in order from an object side, and a distance from the image-side surface of the fifth lens to an object-side surface of the sixth lens is shorter than a distance from an image-side surface of the sixth lens to an object-side surface of the seventh lens.

Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, disposed in order from an object side, and a first reflection member and a second reflection member, disposed on an object side of the first lens, each having a freeform surface.

Abstract: A substrate including: an insulation layer; a conductive layer disposed on the insulation layer; and a via hole configured to include a lower hole disposed in a first portion of the insulation layer and an upper hole disposed in a second portion of the insulating layer and connected to the lower hole, wherein a width of the upper hole is greater than that of the lower hole, at least a portion of the upper hole of the insulation layer has a width that is substantially equal to that of the upper hole of the conductive layer, and a first angle formed between a first direction that is parallel to a lower surface of the insulating layer and a sidewall of the lower hole and a second angle formed between the first direction and a sidewall of the upper hole are different from each other.

Abstract: A lens driving apparatus includes a lens holder having a central opening so as to accommodate a lens, a carrier configured to accommodate the lens holder, an optical image stabilization (OIS) driving magnet holder having an OIS driving magnet mounted thereon, supported by the carrier, coupled to the lens holder, and configured to be driven in a direction perpendicular to an optical axis, and an OIS driving coil facing the OIS driving magnet at an interval, in a direction perpendicular to the optical axis and to a direction in which the OIS driving magnet is driven.

Abstract: An optical imaging system includes: a first lens group including a plurality of lenses; a second lens group including a plurality of lenses; a first reflecting member disposed on an object side of the first lens group; and a plurality of second reflecting members arranged between the second lens group and an image sensor. One or both of the first lens group and the second lens group is movable along an optical axis, an interval along the optical axis between the first lens group and the second lens group is varied between a first interval and a second interval smaller than the first interval, and as at least one of the first lens group and the second lens group is moved, one or more of the second reflecting members are moved.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)?0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15<v1-v3<45 is satisfied, where v1 is an Abbe number of the first lens, and v3 is an Abbe number of the third lens.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.