Abstract: Semiconductor substrates, particularly metallized substrates such as partially processed wafers, are rinsed with an aqueous medium, preferably deionized water, which further contains an anti-corrosive chemical agent or agents selected so as to minimize corrosion of metals resulting from contact with the water. The amount of anti-corrosive chemical agent is maintained in a controlled manner at a predetermined level or within a predetermined range preferably the rinsing with aqueous medium containing anticorrosive chemical agent is also carried out for a specified time, followed by further rinsing with deionized water alone. The rinsing may be combined, either in the same vessel or in a different vessel, with a subsequent drying step, such as a drying process utilizing a drying vapor introduced into the rinse tank or into a downstream vessel.

Abstract: A compliant door assembly for use in sealing an opening in a vessel bottom includes a door having a sealing wall, the sealing wall having a contact face moveable into contact with a wall surrounding the vessel bottom. A reinforcing member is moveable into contact with the back face of the sealing wall, thereby reinforcing sealing contact between the contact face and the wall surrounding the opening.

Abstract: A method for exposing an object to fluid using principles of the present invention includes the steps of introducing the object into a coanda flow forming passage and directing a coanda jet onto a coanda profile that surrounds the object to cause amplified flow to surround the object and move axially through the passage. An apparatus for exposing an object to fluid utilizing principles of the present invention includes a chamber having an enclosed coanda profile and a fluid inlet such as a coanda slot fluidly coupled to the passage. The passage is proportioned to receive an object to be treated. In one embodiment of the method and apparatus, fluid apertures for focusing an additional fluid onto the object may be positioned within the chamber, and a fluid may be directed from the apertures onto the object to clean the object before the object is dried using the amplified flow through the chamber.

Abstract: In a method for treating a semiconductor substrate, a single substrate is positioned in a single-substrate process chamber and subjected to wet etching, cleaning and/or drying steps. The single substrate may be exposed to etch or clean chemistry in the single-substrate processing chamber as turbulence is induced in the etch or clean chemistry to thin the boundary layer of fluid attached to the substrate. Megasonic energy and/or disturbances in the chamber surfaces may provide the turbulence for boundary layer thinning. According to another aspect of a method according to the present invention, megasonic energy may be directed into a region within the single-substrate process chamber to create a zone of boundary layer thinning across the substrate surface, and a single substrate may be translated through the zone during a rinsing or cleaning process within the chamber to optimize cleaning/rinsing performance within the zone.

Abstract: A method of removing photoresist and/or resist residue from a substrate includes exposing the substrate to a supercritical fluid in combination with a co-solvent mixture comprising an organic solvent and an oxidizer. In one embodiment, the supercritical fluid is supercritical carbon dioxide and the co-solvent mixture includes 1,2-Butylene Carbonate, Dimethyl Sulfoxide and hydrogen peroxide. If desired, supercritical carbon dioxide in combination with a second co-solvent mixture may be subsequently applied to the substrate to rinse and dry the substrate. In one embodiment, the second co-solvent mixture includes isopropyl alcohol.

Abstract: A storage system is disclosed which utilizes an array of at least three storage columns, each including a plurality of storage spaces. A primary automation system, which includes a robotic end effector for engaging objects to be stored, carrying objects into and removing objects from the storage spaces. A secondary automation system moves at least one of the storage columns as needed to create a travel space for the robotic end effector, thereby permitting ready access to all of the storage locations in the system.

Abstract: The present apparatus is a method and system for treating and drying the surface of an object. According to the described method, with a wet object positioned in a vessel, a drying vapor is introduced into the vessel. The drying vapor condenses on the surface of the object and reduces the surface tension of the residual process fluid, causing the residual process fluid to flow off of the surface. In one embodiment, wet processing of the object and a subsequent evacuation of process fluid is carried out in the vessel prior to introduction of the drying vapor.

Abstract: A compliant wafer comb assembly for use in transferring semiconductor wafers between wafer cassettes, wafer carriers, or other wafer holding devices. The compliant wafer comb includes a plurality of slots in which wafer(s) can be held while being transported. The slots are parallel to each other and downward sloping from one end of the comb to the other. The sloped arrangement causes a single wafer at a time to become engaged with the comb when a batch of wafers is transferred from a cassette or wafer holding device to the comb, allowing the compliant features of the comb to compensate for the misalignment of each wafer individually. The comb is coupled to a static base structure by a set of independent column springs which permit motion of the comb slots in any direction necessary to compensate for a wafer's misalignment. This permits transfer of a misaligned wafer or wafers from a cassette or other carrier to the comb without damaging the wafer(s).

Abstract: A cassette for carrying substantially planar objects. The cassette is formed of only two substantially parallel rods, each rod having spaced apart notches for receiving objects to be carried, together with a pair of end members extending between the rods. The rods and end members are joined to form a substantially rectangular loop.

Abstract: A process vessel which may be utilized in wet processing of semiconductor wafers includes a tank having one or more fluid displacers attachable to the tank. The one or more fluid displacer(s) have position in which they extend into the interior of the tank. The fluid displacers may be carried by a lid moveable into a closed position covering the opening in the tank. Movement of the lid into the closed position causes the fluid displacers to extend into the tank.

Abstract: Described herein is a chemical injection system and method utilizing a chemical storage vessel coupled to a bulk source of chemical and proportioned to contain a volume of chemical useful for multiple applications for which the chemical is to be utilized. A dispense vessel proportioned to contain a volume of chemical useful for a single application is fluidly coupled to the chemical storage vessel. A controller controls operation of a system of valves and sensors, which operate to fill the chemical storage vessel, and to precisely dispense the volume required for a single application from the storage vessel into the dispense vessel and then ultimately into the vessel in which the chemical is needed.