Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: A processing solution containing solvent and solute is supplied onto a substrate (9). The processing solution transforms into a particle retention layer as a result of at least part of the solvent being volatilized from the processing solution and causing the processing solution to solidify or harden. The particle retention layer is removed from the substrate (9) by supplying a removal liquid onto the substrate (9). A solute component contained in the particle retention layer is insoluble or poorly soluble in the removal liquid, whereas the solvent is soluble. The solute component contained in the particle retention layer has the property of being altered to become soluble in the removal liquid when heated to a temperature higher than or equal to an alteration temperature. The removal liquid is supplied after the formation of the particle retention layer, without undergoing a process of alternating the solute component.

Abstract: A substrate processing method for removing an organic film on a substrate includes a) carrying out introduction of ozone-containing gas into a substrate processing chamber to fill at least a space above the substrate in the substrate processing chamber with ozone-containing gas, b) starting spraying through the space a heated chemical liquid containing sulfuric acid onto the substrate after the a), c) continuing the spraying started in the b), and d) stopping the spraying continued in the c).

Abstract: A substrate processing method is provided for removing a resist having a hardened layer from a front surface of a substrate. The substrate processing method includes a hardened-layer removing step and a wet processing step. The hardened-layer removing step includes a heating step of heating the substrate to 150° C. or more and an ozone-gas supplying step of supplying an ozone gas to the front surface of the substrate being heated by the heating step, and the hardened-layer removing step removes the hardened layer by generating an oxygen radical near the front surface of the substrate. The wet processing step removes the resist from the front surface of the substrate by supplying a processing liquid including a sulfuric acid to the front surface of the substrate after the hardened-layer removing step.

Abstract: An ink is circulated in a circulation path including a supply sub-tank, a discharge head and a collection sub-tank in a head unit. If the amount of the ink in the head unit decreases, the ink stored in the buffer tank is replenished to the head unit. On the other hand, in a first non-replenishment time during which the ink is not replenished, the ink is circulated through the buffer tank, the collection sub-tank and the supply sub-tank in this order. Thus, a temperature fluctuation of the replenishment ink stored in the buffer tank is suppressed. As a result, even if the ink is replenished to the head unit from the buffer tank, physical properties, particularly a viscosity, of the ink do not largely vary.

Abstract: There is provided an inspection device, an inkjet printing apparatus, and an inspection method capable of accurately inspecting a printed image printed on a surface of a transparent base material. A first light-emitting unit (61) emits light from one side of a transparent base material (9) toward the transparent base material (9). An imaging unit (63) images the transparent base material (9) from the other side of the transparent base material (9). As described, the first light-emitting unit (61) and the imaging unit (63) are disposed on the opposite sides of the transparent base material (9). As a result, it is possible to suppress generation of the shadow of a printed image itself in a captured image (D1). Therefore, the printed image can be accurately inspected based on the captured image (D1) obtained.

Abstract: In a substrate processing apparatus (1), above a plurality of processing parts (31) arrayed in an up-and-down direction, arranged are a plurality of collecting pipes (61a to 61c). The plurality of collecting pipes (61a to 61c) correspond to a plurality of fluid classifications, respectively. Further, provided are a plurality of exhaust pipes (4) extending upward from the plurality of processing parts (31), into which exhaust gases from the processing parts (31) flow, respectively. At an upper end portion of each of the exhaust pipes (4), provided is a flow path switching part (5) which connects the upper end portion to the plurality of collecting pipes (61a to 61c) and switches a flow path of the exhaust gas flowing in the exhaust pipe (4) among the plurality of collecting pipes (61a to 61c). In the substrate processing apparatus (1), it is possible to reduce a pressure loss in the exhaust pipe (4) and reduce a footprint.

Abstract: A thickness evaluation method of the cell sheet according to the invention includes tomographically imaging a cell sheet by optical coherence tomography and obtaining a thickness distribution of the cell sheet based on a result of the tomography imaging. A tomographic image corresponding to one cross section of the cell sheet is obtained by tomography imaging while scanning the light in a main scanning direction. The tomography imaging is performed in every time while moving an incident position of the light at a predetermined feed pitch in a sub-scanning direction, thereby a plurality of the tomographic images corresponding to a plurality of cross-sections are obtained. One-dimensional thickness distributions of the cell sheet in the corresponding cross-sections are obtained based on each of the plurality of tomographic images, and a two-dimensional thickness distribution of the cell sheet is obtained by interpolating the one-dimensional thickness distributions.

Abstract: Heating treatment is performed on multiple dummy wafers to preheat in-chamber structures including a susceptor and the like prior to the treatment of a semiconductor wafer to be treated. The first few ones of the multiple dummy wafers are heated to a first heating temperature by light irradiation from halogen lamps, and are thereafter irradiated with a flash of light. The subsequent few ones of the multiple dummy wafers are heated to a second heating temperature lower than the first heating temperature by light irradiation from the halogen lamps, and are thereafter irradiated with a flash of light. This stabilizes the temperature of the in-chamber structures in a shorter time with fewer dummy wafers because the dummy wafers are heated to the high temperature and thereafter heated to the low temperature.

Abstract: A substrate processing apparatus that includes a substrate holder, a cup member, an elevating mechanism, a first nozzle, and a camera. The substrate holder holds a substrate and rotates the substrate. The cup member surrounds the outer circumference of the substrate holder. The elevating mechanism moves up the cup member so that the upper end portion of the cup member is located at the upper end position higher than the substrate held by the substrate holder. The first nozzle has a discharge port at a position lower than the upper end position, and discharges first processing liquid from the discharge port to an end portion of the substrate. The camera images an imaging region that includes the first processing liquid discharged from the discharge port of the first nozzle and is viewed from an imaging position above the substrate.

Abstract: A substrate processing liquid is used to etch a substrate in which at least either a bottom wall or a side wall forming a trench structure is an etched layer made of metal or a metal compound. The substrate processing liquid includes a chemical liquid containing H2O2 molecules or HO2? functioning as an etchant for etching the metal, and a complex forming agent containing NH4+ and forming a complex with ions of the metal and is adjusted to a pH of 5 or more.

Abstract: A silicon semiconductor wafer is transported into a chamber, and preheating of the semiconductor wafer is started in a nitrogen atmosphere by irradiation with light from halogen lamps. When the temperature of the semiconductor wafer reaches a predetermined switching temperature in the course of the preheating, oxygen gas is supplied into the chamber to change the atmosphere within the chamber from the nitrogen atmosphere to an oxygen atmosphere. Thereafter, a front surface of the semiconductor wafer is heated for an extremely short time period by flash irradiation. Oxidation is suppressed when the temperature of the semiconductor wafer is relatively low below the switching temperature, and is caused after the temperature of the semiconductor wafer becomes relatively high. As a result, a dense, thin oxide film having good properties with fewer defects at an interface with a silicon base layer is formed on the front surface of the semiconductor wafer.

Abstract: A technique capable of providing a user with information obtained by OCT imaging in a useful way, particularly for assisting in assessment of an embryo effectively. The image processing method includes acquiring original signal data indicating an intensity distribution of signal light from each position in three-dimensional space including a cultured embryo obtained by optical coherence tomography imaging, generating spherical coordinate data based on the original signal data, the spherical coordinate data indicating a relationship between each position in the three-dimensional space represented using spherical coordinates having an origin set inside the embryo and the intensity of the signal light from the position, and outputting the intensity distribution of the signal light as a two-dimensional map based on the spherical coordinate data using two deflection angles of the spherical coordinates as coordinate axes.

Abstract: In the invention, pipes and the like are guided in parallel to a second horizontal direction according to collective movements of printing bar units while being stored and protected by a protecting/guiding member arranged outside and adjacent to a body frame. In this way, breakage of the pipes and the like during the collective movements of printing bar units is reliably prevented. Moreover, the pipes and the like stored in the protecting/guiding member move outside the body frame and are not present inside the body frame. As a result, a work space can be secured without being limited by the collective movements of the printing bar units to the maintenance space.

Abstract: A printing device includes: a substrate feed-out section; a substrate transport section; a storage which stores the width size of the substrate; a skew correction section including a skew sensor which detects the skew of the substrate, and adapted to correct the skew of the substrate with reference to an output of the skew sensor and the substrate width size stored in the storage; an image recording section which performs an image recording operation on the substrate; a first sensor which detects a width size-changed portion of the substrate upstream of the skew correction section with respect to the transport direction; and a controller. Upon the detection of the width size-changed portion, the controller stops the substrate skew correction while continuously transporting the substrate. After the width size-changed portion of the substrate reaches a reference position downstream of the skew correction section, the controller restarts the skew correction.

Abstract: A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is placed on the susceptor, an inner space of the chamber is separated into an upper space and a lower space. Particles are likely to accumulate on a lower chamber window as a floor part of the chamber. However, since the upper space and the lower space are separated, the semiconductor wafer can be prevented from being contaminated by the particles flowing into the upper space and adhering to a surface of the semiconductor wafer even when the particles on the lower chamber window are blown up by irradiation with flash light.

Abstract: Film information about a thin film formed on the front surface of a semiconductor wafer, substrate information about the semiconductor wafer, and an installation angle of an upper radiation thermometer are set and input. Emissivity of the front surface of the semiconductor wafer formed with a multilayer film is calculated based on the various kinds of information. Further, a weighted average efficiency of the emissivity of the front surface of the semiconductor wafer is determined based on a sensitivity distribution of the upper radiation thermometer. Front surface temperature of the semiconductor wafer at the time of heat treatment is measured using the determined weighted average efficiency of the emissivity. The emissivity is determined based on the film information and the like, so that the front surface temperature of the semiconductor wafer can be accurately measured even when thin films are formed in multiple layers.

Abstract: A data processing method includes a step of obtaining evaluated values of the time-series data by comparing the time-series data with reference data, a step of classifying the evaluated values into a plurality of levels, a step of displaying an evaluation result screen including a display area including a first graph showing an occurrence rate of each level of the evaluated values, the evaluation result screen including the display area with respect to each of the two or more processing units. A history screen displaying a history in which the evaluated values have been obtained and a trend screen including graphs showing temporal change in the evaluated values in addition to the evaluation result screen is hierarchically displayed. A mark is attached at a position corresponding to a processing result selected in the history screen in a graph in the trend screen.

Abstract: An inkjet printing apparatus performs printing on a printing medium by feeding ink to an inkjet head having a plurality of nozzles and dispensing the ink from the inkjet head to the printing medium. The apparatus includes a tank, a supply pipe communicatively connecting the tank and the inkjet head, a pump for feeding the ink stored in the tank to the inkjet head, a filter disposed on a path of the supply pipe, and a controller for operates the pump and controlling feeding of the ink. The controller operates the pump to engage in forward drive in time of printing operation, and operates the pump to engage in backward drive in time of functional recovery operation.

Abstract: After the end of initial processing, such as a setting of a priority mode, a print schedule (a job execution schedule and a roll paper loading schedule) is created in consideration of the type, the remaining amount, and the like of roll paper loaded in each of a plurality of slots constituting an autochanger. Then, a possible loading time is obtained, which is a time at which roll paper can be loaded into a loading target slot that is a slot in which the roll paper is to be loaded during execution of continuous printing.