Patents Assigned to Senju Metal Industry Co., Ltd.
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Patent number: 11813686Abstract: An object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy or the like which has a low melting point, excellent ductility, and high tensile strength, and in which if soldering is performed on a Cu electrode subjected to electroless Ni plating treatment, a solder joint formed through this soldering exhibits high shear strength. In addition, another object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy in which a solder joint formed through soldering exhibits high shear strength even for a Cu electrode which has not been subjected to plating treatment. Furthermore, still another object of the present invention is to provide, in addition to the above-described objects, a solder alloy or the like of which yellowish discoloration can be suppressed and in which change in viscosity of a solder paste over time can be suppressed. The solder alloy has an alloy composition consisting of, by mass %, 31% to 59% of Bi, 0.3% to 1.0% of Cu, 0.01% to 0.06% of Ni, 0.0040% to 0.Type: GrantFiled: May 15, 2020Date of Patent: November 14, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Yuji Kawamata
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Publication number: 20230356314Abstract: A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.Type: ApplicationFiled: June 14, 2021Publication date: November 9, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventor: Yuta SAITO
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Publication number: 20230347437Abstract: Provided is a soldering device in which gas is drawn through suction ports in a first plate more uniformly than in a conventional device. A soldering device according to the present disclosure is a soldering device for performing soldering and includes a blower unit for supplying gas to an object. The blower unit includes: a first plate in which a plurality of suction ports for drawing of the gas outside the blower unit are formed; a second plate that has a plate surface facing the plurality of suction ports; a plurality of nozzles; and a fan for supplying the gas drawn through the plurality of suction ports to the plurality of nozzles. A flow path through which the gas flows and which extends from the plurality of suction ports to go through a heater and the fan and to reach the plurality of nozzles is formed in the blower unit. A part of the flow path surrounds at least a part of the second plate in directions in which the plate surface extends.Type: ApplicationFiled: August 25, 2021Publication date: November 2, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventor: Tsutomu HIYAMA
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Patent number: 11794288Abstract: A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1) NH3-n—(R—OH)n(n?3); or??(1) being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.Type: GrantFiled: September 11, 2020Date of Patent: October 24, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventor: Toshio Mizowaki
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Publication number: 20230311226Abstract: A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portion from the through hole; a heating step that heats the thread solder piece with the cylindrical soldering iron and causes to melt the thread solder piece at the solder object portion; and a curing step that cures a melting object of the thread solder piece to solder the solder object portion. The thread solder piece is composed of a core containing a flux and a coating member containing a solder alloy that covers the core. The flux has a rosin having an acid value which is substantially as a main component thereof.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Applicants: DENSO CORPORATION, SENJU METAL INDUSTRY CO., LTD.Inventors: Kei ENDO, Kazuyuki HAMAMOTO, Hisashi TOKUTOMI, Motohiro ONITSUKA, Yoko KURASAWA
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Patent number: 11772204Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: GrantFiled: March 6, 2023Date of Patent: October 3, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Shunsuke Koga, Tomoki Sasaki, Yoshie Tachibana, Shunsaku Yoshikawa
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Patent number: 11772208Abstract: Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.Type: GrantFiled: December 28, 2018Date of Patent: October 3, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Hiroyuki Yamasaki
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Publication number: 20230302585Abstract: A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of 1200 or less, in which the content of the low-molecular-weight nonionic surfactant is equal to or larger than the content of the organic sulfonic acid activator. This flux contains no cationic surfactant or contains more than 0 wt % and 5 wt % or less of the cationic surfactant. A solder paste containing this flux and a Sn-based solder metal.Type: ApplicationFiled: October 14, 2021Publication date: September 28, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroshi SUGII, Yasuhiro KAJIKAWA, Yo YAMADA
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Patent number: 11738415Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.Type: GrantFiled: March 22, 2021Date of Patent: August 29, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takafumi Ohtake, Hiroaki Kawamata, Shinji Kikuchi, Keisuke Shinozaki, Yuki Fujino, Kazuya Kitazawa
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Publication number: 20230256547Abstract: A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.Type: ApplicationFiled: August 20, 2021Publication date: August 17, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Tomohiro YAMAGAME, Yo YAMADA
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Patent number: 11712760Abstract: In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.Type: GrantFiled: March 19, 2021Date of Patent: August 1, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata, Kaichi Tsuruta
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Patent number: 11710580Abstract: An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 ?m or less; a silver powder having a median diameter D50 of 25 ?m or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 ?m or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 ?m or more.Type: GrantFiled: March 20, 2019Date of Patent: July 25, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Jinting Jiu, Tetsu Takemasa, Junko Seino
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Publication number: 20230226648Abstract: A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.Type: ApplicationFiled: March 27, 2023Publication date: July 20, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi SAITO, Shunsaku YOSHIKAWA, Naoko IZUMITA
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Publication number: 20230158614Abstract: An objective of the present invention is to provide a flux that suppresses occurrence of flux drying up during soldering and occurrence of precipitation during storing. The flux comprising, based on the whole flux, 3.5 to 11% by mass of a rosin ester, more than 0% by mass and 18% by mass or less of a rosin resin other than a rosin ester, and 70% by mass or more and less than 96.5% by mass of a solvent.Type: ApplicationFiled: October 13, 2021Publication date: May 25, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Toshihiko ORUI, Hiroaki HANDA, Hiroyuki YAMASAKI
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Patent number: 11648631Abstract: Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.Type: GrantFiled: June 27, 2019Date of Patent: May 16, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Yoko Kurasawa, Motohiro Onitsuka, Hisashi Tokutomi, Hiroyoshi Kawasaki
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Patent number: 11633815Abstract: Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.Type: GrantFiled: March 22, 2019Date of Patent: April 25, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Toru Hayashida, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei
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Patent number: 11628520Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: GrantFiled: March 29, 2022Date of Patent: April 18, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Shunsuke Koga, Tomoki Sasaki, Yoshie Tachibana, Shunsaku Yoshikawa
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Publication number: 20230112020Abstract: A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.Type: ApplicationFiled: November 18, 2020Publication date: April 13, 2023Applicants: SENJU METAL INDUSTRY CO., LTD., National Institute of Advanced Industrial Science and TechnologyInventors: Haruya SAKUMA, Kenichi TOMITSUKA, Hisahiko YOSHIDA, Kenji KANAZAWA, Sei UEMURA, Takashi NAKAMURA, Masateru NISHIOKA
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Publication number: 20230107101Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.Type: ApplicationFiled: March 22, 2021Publication date: April 6, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takafumi OHTAKE, Hiroaki KAWAMATA, Shinji KIKUCHI, Keisuke SHINOZAKI, Yuki FUJINO, Kazuya KITAZAWA
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Patent number: 11607753Abstract: A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)?0.945% (relation (1)), (P+Ge)?0.15% (relation (2)), 2.0?(Cu+5Ni)/(P+Ge)?1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.Type: GrantFiled: June 12, 2020Date of Patent: March 21, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Naoko Izumita, Yuuki Iijima, Kanta Dei