Abstract: A substrate fixing device includes a baseplate, an electrostatic attraction member, and an electrode pin. The baseplate includes a metallic member in which a through hole is famed. The electrostatic attraction member is over a surface of the baseplate and includes an attraction electrode. The electrode pin is inserted through the through hole to be connected to the attraction electrode. A recess communicating with the through hole is formed in the surface of the metallic member with the through hole being within the recess in a plan view from a direction perpendicular to the surface of the metallic member.

Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.

Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.

Abstract: A composite green sheet includes a green sheet, and a bulk metal film provided on the green sheet. Examples of the metal forming the metal film may include aluminum, aluminum alloys, copper, copper alloy, or the like.

Abstract: A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

Abstract: An electrostatic chuck includes a base having a surface on which an object is to be placed, and a through hole extending through the base, wherein a porous material containing angular ceramic particles is disposed in the through hole.

Abstract: An inductor includes: a first conductor layer including: a pair of first metal pieces; and a first conductor, wherein the first conductor is wound in a spiral shape in the same plane; a second conductor layer including: a pair of second metal pieces, wherein each of the pair of second metal pieces is bonded to a corresponding one of the pair of first metal pieces; and a second conductor, wherein the second conductor is wound in a spiral shape in the same plane, and the second conductor includes an inner circumferential side end portion bonded to an inner circumferential side end portion of the first conductor; a pair of electrodes each of which is bonded to a corresponding one of the pair of second metal pieces; and a sealing resin that covers the first conductor layer, the second conductor layer and the pair of electrodes.

Abstract: A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.

Abstract: A wiring substrate includes an insulation layer, a first wiring layer, and a second wiring layer. The first wiring layer is embedded in the insulation layer with an upper surface of the first wiring layer exposed from the insulation layer. The second wiring layer includes a terminal portion located at a lower position than a lower surface of the insulation layer and an embedded portion embedded in the insulation layer. The wiring substrate further includes a connection via connecting the first wiring layer and the embedded portion. The insulation layer includes an extension between the embedded portion and a lower surface of the first wiring layer. The extension includes a through hole. The connection via is located in the through hole of the extension.

Abstract: A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Abstract: An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.

Abstract: At least one of an evaporator, a condenser, a liquid pipe, and a vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer including a porous body. The porous body includes a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, and a first convex portion provided inside the first bottomed hole. The first convex portion has a proximal end connected to a bottom face of the first bottomed hole and a distal end provided on an opposite side to the proximal end in a thickness direction of the first convex portion. The distal end is provided at a position further recessed toward the bottom face of the first bottomed hole than the one face of the inner metal layer.

Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a first condenser and a second condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the first condenser and second condenser, a first vapor pipe configured to connect the evaporator and the first condenser; and a second vapor pipe configured to connect the evaporator and the second condenser. The liquid pipe includes a first liquid pipe having a first flow path and connected to the first condenser, a second liquid pipe having a second flow path and connected to the second condenser, and a third liquid pipe having a third flow path connecting to the first flow path and the second flow path and connected to the evaporator.

Abstract: An electrostatic adsorption member includes a dielectric member having a first surface and a second surface opposite to the first surface and formed with a through-hole penetrating from the first surface to the second surface, and a porous body provided in the through-hole and having a third surface flush with the first surface. The through-hole has a first opening apart from the first surface by a first distance in a first direction perpendicular to the first surface, and a second opening apart from the first surface by a second distance larger than the first distance in the first direction. In a plan view from the first direction, at least a portion of the first opening is inside the second opening, and the porous body has a first portion located inside the first opening, and a second portion connected to the first portion and located outside the first opening.

Abstract: An electrostatic chuck includes a base plate that is made of a metal; a ceramic plate that is fixed to the base plate and configured to adsorb an object by electrostatic force; and a bonding layer that is provided between the base plate and the ceramic plate to bond the base plate and the ceramic plate to each other. The bonding layer is formed of a composite material including the metal forming the base plate and a ceramic forming the ceramic plate.

Abstract: A semiconductor device includes a substrate, an adhesive layer formed on a lower surface of the substrate, a semiconductor element adhered to a lower surface of the adhesive layer, a through hole extending through the substrate and the adhesive layer and exposing a first electrode arranged on an upper surface of the semiconductor element, a via wiring formed in the through hole, a wiring layer formed on an upper surface of the substrate and electrically connected to the first electrode through the via wiring, and a protective insulation layer formed on the lower surface of the adhesive layer. The protective insulation layer covers an entirety of all side surfaces of the semiconductor element and a peripheral part of a lower surface of the semiconductor element and exposes a central part of the lower surface of the semiconductor element.

Abstract: An electrostatic chuck is configured to adsorb and retain an object thereon. The electrostatic chuck includes: a base body on which the object is mounted; an electrostatic electrode that is provided in the base body; a plurality of heating elements that are provided in the base body; a plurality of current control elements that are provided in the base body, and each of which is connected in series with a corresponding one of the heating elements; and a control circuit that is provided in the base body, and that is connected to the current control elements and configured to control operations of the current control elements.

Abstract: An electrostatic chuck includes a plurality of ceramic substrates each having a step formed at a peripheral edge portion of one surface, the ceramic substrates being arranged adjacent to each other so that the steps face each other, electrodes each embedded in each of the plurality of ceramic substrates, and a filling portion that fills a groove portion formed by the facing steps of the adjacent ceramic substrates.

Abstract: An electrostatic chuck includes: a ceramic plate; an adsorption electrode that is built in the ceramic plate; and a plurality of connection pads that are built in the ceramic plate to be electrically connected to the adsorption electrode. The connection pads are arranged stepwise.

Abstract: A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.