Abstract: A stretcher 1 comprises a bed 21 on which a sick or injured person will be laid, legs 22 foldably provided on the bed 21, casters 23 provided at the legs 22, respectively, a tank 10 for storing high-pressure gas, pneumatic cylinders 8 and 9, and intake switches 11 and 13. When the intake switches 11 and 13 are turned ON, high-pressure gas is introduced from the tank 10 into the pneumatic cylinders 8 and 9 so that piston rods 28 are retracted. Thus, the legs 22 are given forces toward deployment so that the bed 21 is given an ascending force.

Abstract: A movable trailing edge is composed of a main body including a structural frame member in which a spar and a rib intersect with each other, and a first outer plate that covers the main body. The first outer plate is placed on and cover the structural frame member, a rotating probe is pressed against the first outer plate from the obverse side thereof to friction stir weld the first outer plate and the side end face of the structural frame member. Joint parts are arranged in a dotted pattern.

Abstract: The present invention relates to an assembly structure (e.g., a movable trailing edge of an aircraft) in which members are joined to each other without employing riveting. The assembly structure is composed of a box shaped main body and an outer plate. The main body is formed of a shaved member whose bottom, front end portion and rear end portion are formed integrally. Connection portions in thin plate shapes in which a plurality of through holes are formed are provided in the upper side of the main body. The outer plate and the main body are joined to each other by means of studs which are inserted in the through holes of the outer plate and the through holes of the main body, respectively, and are friction-stir-welded with the outer plate and the main body.

Abstract: A frame 1 is formed of an outer chord 2 of T-shaped section having an extension 4 extending inwardly, and an inner chord 3 having a flat portion 5 abutting against the extension 4 of the outer chord 2. The extension 4 of the outer chord 2 and the flat portion 5 of the inner chord 3 are friction stir welded together with one abutted against the other.

Abstract: A seal-feeding station includes a seal receiver (21) for receiving a waterproof seal (20) fed through a seal feeding tube (16) and a seal keeper (23) for keeping the waterproof seal (20) transferred from the seal receiver (21) in an electric-wire insertion position. The seal receiver (21) includes a slider board (27) which is supported slidably between a standby position and a transfer position and includes an acceptance hole (27b) in which the waterproof seal (20) is fit in when the slider board (27) is in the standby position, and a push pin (38) which is movable forward and backward, is located so as to face the acceptance hole (27b) of the slider board (27) when the slider board (27) is in the transfer position, and moves forward to push the waterproof seal (20) fit in the acceptance hole (27b) and transfer the waterproof seal (20) to the seal keeper (23).

Abstract: A vacuum chamber the inside of which can be maintained in a substantially vacuum condition is used; a wafer in which a semiconductor wiring film is to be formed is held by a wafer substrate holder disposed in the vacuum chamber; the material of the semiconductor wiring film is evaporated by an evaporation source disposed in the vacuum chamber; and a high frequency electric power for generating a plasma in the vacuum chamber, making use of the substrate holder as an electrode is supplied from a high frequency power source.

Abstract: An electric-wire guide unit is provided with a fixed roller and a movable roller that is supported movably toward and away from the fixed roller, and holds an electric wire from both of the sides of the electric wire in cooperation with the fixed roller. An electric-wire nozzle unit is provided with a fixed nozzle guide and a movable nozzle guide that is slidably placed, and forms a nozzle opening through which the electric wire is inserted, in cooperation with the fixed nozzle guide. A link mechanism, which couples the movable roller and the movable nozzle guide so as to be interlocked, is prepared. An tension spring, which presses the movable roller in an approaching direction toward the fixed roller, is attached. In accordance with the size of the diameter of the electric wire to be held between the movable roller and the fixed roller, the movable nozzle guide is slide-operated through the link mechanism so that the nozzle opening is size-adjusted.

Abstract: In ion plating in which a substrate is held on a substrate holder placed in an evacuated vacuum chamber and plasma is generated in the vacuum chamber to be formed into a film, a bias voltage composed of a negative bias component having a predetermined negative voltage value for a predetermined output time and a pulse bias component corresponding to a pulse output having a constant positive value for a predetermined time and output with a cycle set in the rage of 1 kHz-1 GHz is supplied to the inside of the vacuum chamber through the substrate holder by a power supply unit.

Abstract: In an impeller 11, an inlet portion and an outlet portion are provided at one end side and the other end side in the axial direction, respectively. An inlet 29 is formed in the lower part of the inlet portion, and an outlet is formed in the side face of the outlet portion. The inlet portion and the outlet portion are partitioned by a flange portion 40. The impeller 11 includes a primary vane 36 and a secondary vane 38. The primary vane 36 defines a spiral primary channel 35 that connects the inlet 29 and the outlet. The secondary vane 38 is formed in a shape that a part of the outer periphery of the outlet portion is gouged inward so as to define a secondary channel 37 connected to the primary channel 35 and extending circumferentially around the outer periphery.

Abstract: A first SiO film having a refractive index substantially equal to the refractive index of an acrylic resin substrate is formed to a thickness of about 200 nm on the substrate, and a second SiO film having a refractive index assuming a value falling within the range from 1.48 to 1.62 is formed to a thickness of about 200 nm on the first SiO film. Further, in the case of an HLHL type antireflection film for example, a TiO2 film having a refractive index assuming a value falling within the range from 2.2 to 2.4 is formed as the layer next to the outermost layer with a special ion plating apparatus.

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Abstract: A vacuum chamber the inside of which can be maintained in a substantially vacuum condition is used; a wafer in which a semiconductor wiring film is to be formed is held by a wafer substrate holder disposed in the vacuum chamber; the material of the semiconductor wiring film is evaporated by an evaporation source disposed in the vacuum chamber; and a high frequency electric power for generating a plasma in the vacuum chamber, making use of the substrate holder as an electrode is supplied from a high frequency power source.

Abstract: An arc evaporator comprises: an anode; an evaporation source electrode as a cathode; and a current control unit for supplying an AC square wave arcing current across the anode and the evaporation source electrode.

Abstract: A liquid dropping apparatus for a helicopter includes a tank for containing a liquid therein for attachment below a helicopter body. The tank has a lower surface with a concave portion formed by concaving a wall portion and has a liquid discharge port opened on a side surface of the concave portion. A door is provided on a bottom surface of the concave portion of the tank to pivotally swing around a side thereof closer to the bottom surface of the concave portion, thereby freely opening and closing the liquid discharge port. Drivers are provided for driving the door to open and close.

Abstract: This invention provides film deposition method and film deposition system for depositing a halogen compound film, which are capable of depositing such a film while suppressing abuse that occurs due to deficiency of a halogen element even if the halogen element is dissociated from a film material. Specifically, the halogen compound film is deposited through a process including: evaporating a film material comprising a halogen compound by means of an evaporation source 3; ionizing the evaporated film material with a radio frequency power outputted from a radio frequency power supply unit 11 and supplied through a substrate holder 2; and causing the ionized film material to deposit on the substrate 5. In this process a bias voltage outputted from a bias power supply unit 12 and applied to the substrate holder 2 causes halogen ions dissociated from ions of the halogen compound to be incorporated into the film being deposited on the substrate 5.

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Abstract: A laser fusion bonding apparatus includes a laser beam irradiation unit for emitting a laser beam with which portions of two works which are in contact with or close to each other are irradiated, and thereby fusion bonded. The laser beam is a substantially-parallel laser beam.

Abstract: A conveying device in which a conveying arm assembly can be quickly set in a conveying position and can be rapidly stabilized in the conveying position is disclosed. The conveying device comprises a conveying arm assembly, a fixed shaft, at least one set of hollow operating shafts which are necessary for controlling an operation of the conveying arm assembly, and a motor provided between the fixed shaft and each of the operating shafts. The one set of operating shafts are attached to the fixed shaft such that they can be rotated coaxially with respect to the fixed shaft outside fixed shaft and are arranged in an axial direction of the fixed shaft. The motor comprises a stator provided on the fixed shaft and a rotor provided on each of the operating shafts such that it is opposed to the stator on an outer peripheral side of the stator.

Abstract: To allow an elevating body (17) in a clean robot (RB) installed in a clean room (R) to be located outside frames (4) without protruding from a swivel base (2) in order to enable the elevating body to be assembled and maintained easily and to ensure a wide elevating stroke. Two hollow frames (4, 4) extend vertically from the right and left sides of the rear of a swivel base (2) so as to be approximately symmetrical, a cover (9) is mounted between the frames (4, 4) and an elevating body (17) having a robot body (20) at its tip is accommodated in an elevating space (13) in the cover (9) and supported by rails (15) in the frames (4) so as to travel upward and downward.

Abstract: The wire handling apparatus of the present invention comprises a length measuring unit, a first clamp mechanism and a second clamp mechanism, a cutter mechanism, a first terminal pressing mechanism and a second terminal pressing mechanism, a first carrier mechanism and a second carrier mechanism, and a wire discharge mechanism, and synchronous moving means for upwardly/downwardly moving a receiving clamp part of the wire discharge mechanism in synchronization with upward/downward movement of a clamp part of the said second clamp mechanism in a terminal pressing operation of the said second terminal pressing mechanism is provided while the position of the said receiving clamp part is coincided with the position of a coated wire so that grasping of the coated wire by the receiving clamp part is enabled in the terminal pressing operation of the second terminal pressing mechanism.