Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

Abstract: An embodiment of the present invention relates to an organic electronics material which includes a charge-transporting polymer comprising a structural unit represented by formula (1), at least one structural unit selected from the group consisting of structural units represented by formula (2-1) and structural units represented by formula (2-2), a structural unit represented by formula (3), and at least one structural unit selected from the group consisting of structural units represented by formula (4-1) and structural units represented by formula (4-2).

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a sulfur atom.

Abstract: A compound includes metal powder, an epoxy resin, and a wax. The content of the metal powder is from 96 mass % to less than 100 mass %. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters.

Abstract: There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance.

Abstract: An organic electronic material containing a charge transport compound having a structural region represented by formula (I) and having a weight average molecular weight greater than 40,000. —Ar—X—Y—Z??(I) In the formula, Ar represents an arylene group or heteroarylene group of 2 to 30 carbon atoms, X represents a linking group, Y represents an aliphatic hydrocarbon group of 1 to 10 carbon atoms, and Z represents a substituted or unsubstituted polymerizable functional group.

Abstract: The present invention provides, as one aspect, an electrolytic solution comprising a compound represented by the following formula (1) and a compound represented by the following formula (2): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group comprising a sulfur atom and not comprising a nitrogen atom; and wherein R6 to R8 each independently represent an alkyl group or a fluorine atom, R9 represents an alkylene group, and R10 represents an organic group comprising a nitrogen atom and not comprising a sulfur atom.

Abstract: A cell scaffold material comprising a copolymer having a polylactic acid structural unit (A) and a polycarbonate structural unit (B). The polycarbonate structural unit (B) may include at least one unit having an alkoxyalkyloxycarbonyl group as a substituent. Also provided is a cell culture support comprising this cell scaffold material and a substrate.

Abstract: The present invention relates to an adhesive composition comprising an ?-olefin homopolymer, an ?-olefin copolymer having a melting point of 90° C. or higher, a tackifier resin, a wax, and a liquid softener, wherein a complex shear modulus (I) measured immediately after heating the adhesive composition to 180° C. and cooling the same to 20° C. is 1 MPa or less.

Abstract: An embodiment of the present invention pertains to an organic electronics material containing a charge-transporting polymer which includes: a structural unit represented by formula (1); at least one structural unit selected from the group consisting of a structural unit represented by formula (2-1) and a structural unit represented by formula (2-2); and a structural unit which is represented by formula (3) an of which an amount is 85-100 mol % with respect to the total amount of monovalent structural units.

Abstract: The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Abstract: Disclosed is an adhesive agent set composed of a main agent and a hardening agent, in which the main agent contains a urethane prepolymer having isocyanate groups as terminal groups; and an oligomer of hexamethylene diisocyanate having an isocyanate group modified with a silane coupling agent having a mercapto group or an amino group, the oligomer also having at least two unmodified isocyanate groups, and the hardening agent contains a polyol.

Abstract: Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

Abstract: This coating liquid contains: aerogel particles; a water-soluble polymer having a hydrophobic group; and a liquid medium.

Abstract: A wavelength conversion member comprising: a quantum dot phosphor and a filler; and a cured resin product that contains the quantum dot phosphor and the filler. The content of the filler is 3 mass % or more with respect to the total amount of the cured resin product.

Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and an Rsp value calculated by Formula (1) below is 1.60 or more: Rsp=(Tb/Tav)?1??(1) [in the formula, Tav represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of the slurry in a case where a content of the abrasive grains is 2.0% by mass, and Tb represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of a supernatant solution obtained when the slurry is subjected to centrifugal separation for 50 minutes at a centrifugal acceleration of 2.36×105 G in a case where the content of the abrasive grains is 2.0% by mass.

Abstract: A polishing method includes polishing a substrate with a CMP polishing liquid. The substrate includes a barrier metal, a metal film, and a silicon dioxide film. The metal film includes one or more of copper, copper alloy, copper oxide, or copper alloy oxide. The CMP polishing liquid includes abrasive particles, a metal oxide dissolving agent, an oxidizing agent, a water-soluble polymer, and an alkali metal ion. The pH of the CMP polishing liquid is 7.0 to 11.0. Surface potentials of the abrasive particles and the metal film have the same sign and a product of the surface potential (mV) of the abrasive particles and the surface potential (mV) of the metal film is 300 to 980 mV2 upon polishing the substrate with the CMP polishing liquid.

Abstract: Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.