Abstract: A two-part curable urethane-based composition comprising a main agent (A); and a curing agent (B), wherein the main agent (A) contains a urethane prepolymer (a), an isocyanurate modified product of a polyisocyanate compound (b), and a silane coupling agent (c) in a specified ratio, the curing agent (B) contains a polyol (d) having a hydroxyl value of 50 to 500 mgKOH/g and an amine catalyst (e) in a specified amount, a mixing mass ratio of the main agent (A) to the curing agent (B) is 3:1 to 10:1, and an equivalent ratio of NCO group/OH group in the main agent (A) and the curing agent (B), respectively, is 1.0 to 5.0.

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.

Abstract: One embodiment relates to an organic electronic material containing a charge transport polymer, wherein the charge transport polymer is a polymer which, when 25 ?L portions of methanol are added dropwise and stirred into 1,000 ?L of a solution containing the charge transport polymer and toluene in a ratio of 20 mg of the charge transport polymer per 2,290 ?L of toluene, the amount of methanol added by the time cloudiness develops in the solution is greater than 350 ?L.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

Abstract: One embodiment relates to a method for manufacturing a cell suspension, the method including (A), (B) and (C) described below: (A) culturing adherent cells in a cell suspension containing the adherent cells, a microcarrier and a medium, and having a volume of at least 0.3 L, (B) culturing the adherent cells in a cell suspension containing the adherent cells obtained through (A), a microcarrier and a medium, and having a volume of at least 5 L, and (C) culturing the adherent cells in a cell suspension containing the adherent cells obtained through (B), a microcarrier and a medium, and having a volume of at least 10 L.

Abstract: An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

Abstract: Disclosed is an electrochemical device electrode comprising an electrode current collector and an electrode mixture layer provided on at least one principal surface of the electrode current collector, wherein the electrode mixture layer comprises an electrode active material, a polymer having a structural unit represented by the following formula (1), at least one electrolyte salt selected from the group consisting of lithium salts, sodium salts, calcium salts, and magnesium salts, and a molten salt having a melting point of 250° C. or less: wherein X? represents a counter anion.

Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?M.

Abstract: A charge transport material containing a charge transport polymer that satisfies at least one of (I) or (II) described below: (I) to independently have both a monovalent substituent having an alicyclic structure of 7 or more carbon atoms, and a monovalent substituent having a carbonyl-containing group; and (II) to have a monovalent substituent that includes a monovalent substituent having an alicyclic structure of 7 or more carbon atoms bonded directly to a carbonyl-containing group.

Abstract: Apparatus, system, and method are disclosed for cell recovery or cell separation. A cell separation system has at least a first container having a first filter for separating a first removal target from a suspension comprising cells and a removal target including at least the first removal target and a second removal target; a cell separation apparatus; a first flow path connecting the first container and the cell separation apparatus; and a first pump interposed in the first flow path for transferring the suspension from the first container to the cell separation apparatus by decompression suction, for example.

Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Abstract: In one aspect, the present invention is a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, a straight-chain saturated hydrocarbon compound, and a gelling agent.

Abstract: Provided is a semiconductor element mounting structure, including: a semiconductor element including an element electrode, and a substrate including a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, the semiconductor element and the substrate being connected via the element electrode and the substrate electrode, in which: one of the element electrode or the substrate electrode is a first protruding electrode including a solder layer at a tip portion thereof, the other of the element electrode or the substrate electrode is a first electrode pad including one or more metal protrusions on a surface thereof, the one or more metal protrusions of the first electrode pad extend into the solder layer of the first protruding electrode, and a bottom area of each of the one or more metal protrusions of the first electrode pad is 70% or less with respect to an area of the first electrode pad, or 75% or less with respect to a maximum cross-sect

Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1), wherein a content of the compound is 10% by mass or less based on the total amount of the electrolytic solution, wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a nitrogen atom.

Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.