Abstract: A method for operating a computing system includes: monitoring a central interface for a power event; accessing a high-speed memory for pre-shutdown data; accessing a non-volatile memory during the power event for the pre-shutdown data previously stored on the high-speed memory; selecting a multiplexer for allowing external access to the high-speed memory; and formatting the pre-shutdown data in the non-volatile memory for access through a non-disruptive interface.

Abstract: A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

Abstract: A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.

Abstract: A memory module with power management system, and a method of operation of a memory module with power management system thereof, including: a base power plane; a power management circuit electrically connected to the base power plane; a managed power plane electrically connected to the base power plane only through the power management circuit; and a memory array electrically connected to the managed power plane.

Abstract: A method of operation of a non-volatile memory packaging system includes: addressing an integrated circuit package having a system interface; accessing a module controller, in the integrated circuit package, through system interface; accessing a random access memory, in the integrated circuit package, by the module controller for storing data from the system interface; writing to a non-volatile memory, in the integrated circuit package by the module controller, with the data from the random access memory; and monitoring an address look-up register, by the module controller, for reading the data from the non-volatile memory or the random access memory through the system interface.

Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.

Abstract: A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.

Abstract: A method of operation of a non-volatile dynamic random access memory system including: accessing a dynamic random access memory; managing a delay-locked-loop control in the dynamic random access memory; sourcing timing inputs to the dynamic random access memory by a control logic unit with the delay-locked-loop control disabled including: selecting a back-up interface through a first multiplexer and a second multiplexer, asserting an on-board termination, and accessing data in the dynamic random access memory by the control logic unit at a lower frequency; and enabling a memory control interface by the control logic unit, with the delay-locked-loop control enabled including: selecting a host interface through the first multiplexer, the second multiplexer, or a combination thereof, disabling the on-board termination, and accessing the data in the dynamic random access memory by the memory control interface at a delay-locked-loop frequency.

Abstract: A system, method and apparatus for clock and power fault detection for a memory module is provided. In one embodiment, a system is provided. The system includes a voltage detection circuit and a clock detection circuit. The system further includes a controller coupled to the voltage detection circuit and the clock detection circuit. The system also includes a memory control state machine coupled to the controller. The system includes volatile memory coupled to the memory control state machine. The system further includes a battery and battery regulation circuitry coupled to the controller and the memory control state machine. The battery, battery regulation circuitry, volatile memory, memory control state machine, controller, clock detection circuit and voltage detection circuit are all collectively included in a unitary memory module.

Abstract: A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.

Abstract: A method of operation of a non-volatile memory packaging system includes: addressing an integrated circuit package having a system interface; accessing a module controller, in the integrated circuit package, through system interface; accessing a random access memory, in the integrated circuit package, by the module controller for storing data from the system interface; writing to a non-volatile memory, in the integrated circuit package by the module controller, with the data from the random access memory; and monitoring an address look-up register, by the module controller, for reading the data from the non-volatile memory or the random access memory through the system interface.

Abstract: A method of manufacture of the memory management system includes: fabricating a dual in-line memory module carrier; mounting a volatile memory device on the dual in-line memory module carrier; mounting a non-volatile memory on the dual in-line memory module carrier on a side opposite the volatile memory device; mounting an uninterruptible power supply on the dual in-line memory module carrier for maintaining a memory module power when a system power input decays; and mounting a controller logic integrated circuit on the dual in-line memory module carrier coupled to the volatile memory device, the non-volatile memory, and the uninterruptible power supply for copying data content of the volatile memory device to the non-volatile memory when the uninterruptible power supply detects the decay of the system power input to a first cross-over level.

Abstract: A method for operating a computing system includes: monitoring a central interface for a power event; accessing a high-speed memory for pre-shutdown data; accessing a non-volatile memory during the power event for the pre-shutdown data previously stored on the high-speed memory; selecting a multiplexer for allowing external access to the high-speed memory; and formatting the pre-shutdown data in the non-volatile memory for access through a non-disruptive interface.

Abstract: A method for operating a dynamic back-up storage system includes: providing a high speed memory including a first rank memory device and subsequent ranks of memory devices; providing a non-volatile memory for saving data from the high speed memory; and providing a control logic unit for controlling access, of a central processing unit that executes a program, from the high speed memory including restoring the subsequent ranks of memory devices while the central processing unit is executing the program from the first rank memory device.

Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract: A method of operation of a non-volatile dynamic random access memory system including: accessing a dynamic random access memory; managing a delay-locked-loop control in the dynamic random access memory; sourcing timing inputs to the dynamic random access memory by a control logic unit with the delay-locked-loop control disabled including: selecting a back-up interface through a first multiplexer and a second multiplexer, asserting an on-board termination, and accessing data in the dynamic random access memory by the control logic unit at a lower frequency; and enabling a memory control interface by the control logic unit, with the delay-locked-loop control enabled including: selecting a host interface through the first multiplexer, the second multiplexer, or a combination thereof, disabling the on-board termination, and accessing the data in the dynamic random access memory by the memory control interface at a delay-locked-loop frequency.

Abstract: A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.

Abstract: A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.

Abstract: In various embodiments, options for data striping to FLASH memory are provided. In one embodiment, an apparatus is provided. The apparatus includes an SATA to ATA bridge, an ATA to USB bridge coupled to the SATA to ATA bridge, and a USB interface coupled to the ATA to USB bridge. The apparatus also includes a first FLASH memory controller coupled to the USB interface. The apparatus further includes a first FLASH memory module coupled to the first FLASH memory controller. The apparatus also includes a second FLASH memory controller coupled to the USB interface and a second FLASH memory module coupled to the second FLASH memory controller. A method for block striping data to or from a plurality of read or write channels.