Abstract: A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

Abstract: An information recording medium excellent in long storage and capable of high-density recording, method of manufacturing the information recording medium, and information recording material are provided. Pulse laser light is focused onto a recording layer in which a thermosetting epoxy resin having a skeleton with high planarity and a curing agent are polymerized to form a recording mark. With a molecular weight between cross-linking points of a cured material of the recording layer being set to be equal to or smaller than 2000 and, more preferably, equal to or smaller than 500, a distance between recording marks (cavities) can be shortened.

Abstract: Heat from a heating resistor is efficiently transmitted to a low-melting-point metal body through a heat transfer path. A protection element, connected onto an electric current path of an electric circuit, is provided with an insulating substrate (60), a heating resistor (64) which is formed on one surface of the insulating substrate (60) with a first insulating layer (62) interposed therebetween, a low-melting-point metal body (67) which is disposed above the heating resistor (64) with a second insulating layer (65) interposed therebetween and constitutes part of the electric current path, and connection portions (611, 612) which are connected to both ends of the low-melting-point metal body (67) and electrically connect the electric current path and the low-melting-point metal body (67), and the connection portions (611, 612) are formed on the surface of the insulating substrate (60) with a first glass layer (70) interposed therebetween.

Abstract: A protective circuit capable of coping with broad voltage variations of a battery unit to interrupt its charging/discharging current path as damages to the heating unit are prevented from occurrence is disclosed. The protective circuit includes fuses, connected to a charging/discharging current path in series between a battery unit and a charging/discharging control circuit, and a heating unit composed by a series connection of resistors. One of two ends of the resistor which is not connected to the peer resistor is connected to a current path of the fuses. The ends of the resistors not connected to the fuses, are provided with a plurality of terminals selected for connection to a current control element that controls the current flowing through the heating unit, as a range of voltage variations of the battery unit is taken into account.

Abstract: An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1).

Abstract: An information recording medium excellent in long storage and capable of high-density recording, method of manufacturing the information recording medium, and information recording material are provided. Pulse laser light is focused onto a recording layer in which a thermosetting epoxy resin having a skeleton with high planarity and a curing agent are polymerized to form a recording mark. With a cured material of a recording layer having a density equal to or larger than 1.210 g/cm3 and a glass transition temperature of 110° C. to 140° C., high-speed recording is possible.

Abstract: The present invention provides a communication device that can reduce a housing of an electronic device in size and thickness when the communication device is built in the electronic device. The communication device includes: an antenna coil (11a) arranged on an outer peripheral portion (134) of a housing (131) surface facing a reader/writer (120) of a mobile phone (130); a magnetic sheet (13) that attracts a magnetic field transmitted from the reader/writer (120) to the antenna coil (11a); and a communication processing unit (12) that is driven by a current flowing in the antenna coil (11a) and performs communication with the reader/writer (120), wherein the magnetic sheet (13) is arranged on the reader/writer (120) side of the antenna coil (11a) at a center portion (132a), and the antenna coil (11a) is arranged on the reader/writer (120) side on an outer periphery (130d) side.

Abstract: A thermosetting epoxy resin composition can be cured rapidly at low temperature with an aluminum chelate-based latent curing agent without the use of a cycloaliphatic epoxy compound. The thermosetting epoxy resin composition includes an aluminum chelate-based latent curing agent, a silanol compound of the formula (A), and a glycidyl ether-type epoxy resin: (Ar)mSi(OH)n??(A) wherein Ar is an optionally substituted aryl group, and m is 2 or 3, provided that the sum of m and n is 4. Examples of the silanol compound of the formula (A) include triphenylsilanol, diphenylsilanol, and the like.

Abstract: A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.

Abstract: An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 ?m or less based on 10-point average.

Abstract: A microencapsulated silane coupling agent includes adduct particles of an epoxy compound and an imidazole silane coupling agent, and an ethyl cellulose film coating a periphery of the adduct particles, in which the ethyl cellulose film is crosslinked by a polyfunctional isocyanate compound. Preferred examples of the imidazole silane coupling agent include a compound represented by the formula (1), wherein R1 and R2 are each independently a hydrogen atom or a lower alkyl group, and R3 is a lower alkyl group.

Abstract: An electromagnetic wave suppression material that has a high light transmission performance even under a low temperature environment to display a sufficient electromagnetic wave suppression effect, and an electromagnetic wave suppression sheet that has the electromagnetic wave suppression material sealed in it, are disclosed. An electromagnetic wave suppression sheet (3) is composed of an electromagnetic wave suppression material (1) charged into a moisture-resistant film (2) whose peripheral part is laminated by a predetermined adhesive by way of sealing.

Abstract: A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Abstract: An anisotropic electrically conductive adhesive film for establishing electrically conductive interconnection between electronic components includes a first peel film having a first peel layer on its one surface, and an adhesive layer provided on the first peel film via the first peel layer. The adhesive layer is formed of an anisotropic electrically conductive adhesive material. The adhesive film also includes a second peel film having a second peel layer on its one surface. The second peel film is provided via the second peel layer on a surface of the adhesive layer opposite to the surface of the adhesive layer provided with the first peel film. The first and second peel films have a non-contractile biodegradable film composed of a fatty acid polyester component as a base material. The first and second peel layers formed of a thermosetting silicone resin curable are provided on each top of the base material.

Abstract: A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.

Abstract: In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a conductive particle-containing layer containing a polymerizable acrylic compound, a film-forming resin, a polymerization initiator, and conductive particles, the insulating adhesive layer and the conductive particle-containing layer each contain a thiol compound in order not to decrease the adhesion strength to an adherend and to improve connection reliability. Examples of the thiol compound may include pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), and dipentaerythritol hexakis(3-mercaptopropionate).

Abstract: A phase difference element capable of reducing reflection of incident light and a manufacturing method for the phase difference element are disclosed. The phase difference element includes a transparent substrate 11, an interface anti-reflection film group 12 and an obliquely vapor deposited film 13. The interface anti-reflection film group is composed by one or more of alternately high and low refractive index films, with the film thicknesses of the respectively films being equal to or less than the wavelength of light in use. The obliquely vapor deposited film is formed by a plurality of layers of a dielectric material. These layers are alternately obliquely vapor deposited from two directions differing by 180° from each other. The refractive index of the interface anti-reflection film group 12 is higher than the refractive index of the transparent substrate 11 and lesser than that of the obliquely vapor deposited film 13 (FIG. 1).

Abstract: A phase difference element has a transparent substrate and a birefringent film with tantalum oxide and titanium oxide obliquely deposited on one surface of the transparent substrate. The birefringent film has a first photorefractive film and a second photorefractive film laminated to each other and having different oblique deposition directions. The ratio of titanium atoms to the total of titanium atoms and tantalum atoms in the birefringent film is 4.0 atomic % or higher to 30 atomic % or lower.

Abstract: A solar cell module is manufactured by resin-sealing a solar cell having a surface electrode to which a tab wire is connected, a tab wire is connected to the surface electrode and the solar cell is sealed with a sealing resin at a relative low temperature during the resin sealing step. For such purposes, a thin-film solar cell having a surface electrode to which a tab wire is connected is resin-sealed with a conductive adhesive film by using a decompression laminator, whereby the thin-film solar cell module is manufactured. A decompression laminator having a first chamber and a second chamber partitioned by a flexible sheet is used. Each chamber is capable of independent internal pressure adjustment. The second chamber includes a heating stage capable of heating. A resin mutually compatible with the thermoplastic resin constituting the conductive adhesive film is used as the sealing resin.

Abstract: A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.