Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.

Abstract: A novel aluminum chelate latent curing agent that can cure a glycidyl ether epoxy compound at a lower temperature and more quickly than an aluminum chelate latent curing agent produced by emulsification and interfacial polymerization of a polyfunctional isocyanate in the presence of both a radical polymerizable monomer, such as divinyl benzene, and a radical polymerization initiator, is micro-encapsulated in a core-shell form, wherein an aluminum chelate curing agent and a cationic polymerizable compound are included in a capsule formed from an interfacial polymerization product of a polyfunctional isocyanate.

Abstract: A method for producing a display device includes: (a) coating a resin composition on at least one of a display part and a protective part, (b) closely adhering the display and protective parts via a resin composition interposed therebetween, and (c) arranging the cured resin layer between the display and protective parts by curing the resin composition by irradiating UV rays on an external side of the protective part. If a defect is detected, the method includes: (d) separating the display and protective parts by applying a wire to a side face of the cured resin layer where the protective and display parts are bonded and moving the wire through the cured resin layer, (e) peeling off and removing the cured resin adhered to the separated display and protective parts by a removing solution which contains an organic solvent, and (f) repeating steps (a) to (c).

Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 ?m, a thickness of 0.5 to 2 ?m, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.

Abstract: A solar cell module includes a glass substrate, a first sealing resin layer, a solar cell connected to a tab wire, a second sealing resin layer, and a protective sheet, which are laminated. The second sealing resin layer is formed from a blend polymer of a thermoplastic polyurethane resin having an ester-type polyol unit and a thermoplastic polyurethane resin having an ether-type polyol unit. The blend ratio of the thermoplastic polyurethane resin having the ester-type polyol unit to the thermoplastic polyurethane resin having the ether-type polyol unit in the blend polymer is 20:80 to 50:50 by mass.

Abstract: To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Abstract: A magnetic sheet, which contains: a magnetic layer including a magnetic powder and a resin composition containing the magnetic powder therein; and a convex-concave forming layer, in which the convex-concave forming layer has Bekk smoothness of 70 sec/mL or less. A method for producing a magnetic sheet, which contains: adding a magnetic powder to a resin composition to prepare a magnetic composition, and giving the magnetic composition a shape to form a magnetic layer; and placing and stacking a convex-concave forming layer and a pattern transferring material on a surface of the magnetic layer in this order, and hot pressing the stacked layers so as to bond the convex-concave forming layer with the magnetic layer to form a laminate, as well as to transfer a surface configuration of the pattern transferring material to a surface of the laminate of the convex-concave forming layer and the magnetic layer.

Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.

Abstract: A method for producing a display device includes: (a) coating a resin composition on at least one of a display part and a protective part, (b) closely adhering the display and protective parts via a resin composition interposed therebetween, and (c) arranging the cured resin layer between the display and protective parts by curing the resin composition by irradiating UV rays on an external side of the protective part. If a defect is detected, the method includes: (d) separating the display and protective parts by applying a wire to a side face of the cured resin layer where the protective and display parts are bonded and moving the wire through the cured resin layer, (e) peeling off and removing the cured resin adhered to the separated display and protective parts by a removing solution which contains an organic solvent, and (f) repeating steps (a) to (c).

Abstract: A method for producing a display device includes: (A) coating a resin composition, which is a raw material of the cured resin, on at least one of the display part or the protective part, (B) closely attaching the display part and the protective part via the resin composition, and (C) arranging the cured resin layer between the display part and the protective part by curing the resin composition by irradiating UV rays from external side of the protective part. After (B), if there is any defect in the resin composition layer, the method further includes (b1) separating the display part and the protective part, and (b2) peeling and removing the resin composition adhered to the separated display part and the separated protective part by a removing solution which contains an organic solvent.

Abstract: An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.

Abstract: An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [?0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1<[?1]/[?0]?3??(1) where in the equation (1), [?0] represents the minimum melt viscosity of the anisotropic conductive material, and [?1] represents a melt viscosity at a temperature T1 which is 30° C. lower than a temperature T0 at which the minimum melt viscosity is exhibited.

Abstract: A flexible flat cable capable of having good flexibility and good bending strength while reducing a thickness thereof without damaging a good electrical characteristic of a strip structure and capable of enhancing cost effectiveness is provided. The flexible flat cable includes: an air-containing layer, serving as an insulating member, having a width substantially the same as a transmission path width of a cable body including a plurality of conductors arranged in a prescribed pitch, the air-containing layer being disposed in such a manner as to sandwich the cable body from both sides; and shield members disposed in such a manner as to cover a surface of the air-containing layer and to be conductively connected to a ground layer at terminal portions of both ends of the cable body. The air-containing layer includes non-woven fabrics cut in a width substantially the same as the transmission path width of the cable body.

Abstract: In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.

Abstract: The present invention is to impart, to a sheet-like soft magnetic material, a configuration in which sheet thickness change is suppressed and in which fluctuation in magnetic permeability is small even under a high-temperature or a high-temperature, high-humidity environment, even when a plurality of thin curable soft magnetic sheets produced by a coating method are laminated. The sheet-like soft magnetic material is formed from a soft magnetic composition which is formed by mixing at least a flat soft magnetic powder, an acrylic rubber, an epoxy resin, a curing agent for the epoxy resin, and a solvent. The flat soft magnetic powder is arranged in an in-plane direction of the sheet-like soft magnetic material. An acrylic rubber having a glycidyl group is used for the acrylic rubber. The weight ratio of the flat soft magnetic powder with respect to the total amount of the acrylic rubber, the epoxy resin, and the curing agent for the epoxy resin is 3.7 to 5.8.

Abstract: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.

Abstract: This invention provides an antenna apparatus (60) for use in a non-contact type IC card into and from which data can be written and read by electronic apparatuses having a communication function, by virtue of inductive coupling. The antenna apparatus comprises a loop coil (61) and a magnetic member (62). The loop coil is produced by winding a conductive wire in a plane and configured to perform the inductive coupling. The magnetic member covers one region (61a) of the loop coil, provided at one side, from one surface of the loop coil, passes through the loop coil, and covers the other region (61b) of the loop coil, provided at the other side, from the other surface of the loop coil. The entire region of the loop coil is thus covered.

Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.

Abstract: Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.

Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 ?m, a thickness of 0.5 to 2 ?m, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component.