Patents Assigned to Sony Chemicals Corp.
  • Patent number: 6917505
    Abstract: A protective circuit for a secondary battery is formed with a heater and a thermistor that are connected in parallel, and a main fuse is connected in series with the parallel circuit. In a secondary battery equipped with this protective circuit, a charging/discharging current passes through the protective circuit and is limited by the operation of the thermistor when the voltage applied during abnormal conditions is relatively low. On the other hand, the current will cause the main fuse to blow when the voltage during abnormal conditions is high.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: July 12, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Norikazu Iwasaki, Hisaya Tamura, Kazutaka Furuta, Masami Kawazu
  • Patent number: 6912779
    Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: July 5, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Keiichi Naitoh, Toshihiro Shinohara, Masahiro Watanabe
  • Publication number: 20050139098
    Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.
    Type: Application
    Filed: February 23, 2005
    Publication date: June 30, 2005
    Applicant: Sony Chemicals Corp.
    Inventors: Tetsuji Ishikawa, Rovert Van Den Berg
  • Patent number: 6879258
    Abstract: An IC card 10A has a mica capacitor that comprises a mica film 1 and electrodes 6a, 6b formed on both sides thereof, where the mica film 1 serves as a mounting substrate for an antenna coil 2 and an IC chip 3, thereby reducing profile of an IC card and also reducing its cost of manufacture and to stabilize its resonance frequency.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: April 12, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Nobukazu Kuroda, Kazuaki Suzuki
  • Patent number: 6861109
    Abstract: A recording material for back-printing contains (i) a back-printing sheet comprising a transparent substrate, an ink-absorbing layer that is provided on the transparent substrate, and a porous ink-receiving layer that is provided on the ink-absorbing layer and has filler dispersed in a binder resin, and (ii) a back-printing sheet cover film having a cover substrate, and an adhesive layer that has an adhesive resin and is formed on the cover substrate, the refractive index of the filler and the refractive index of the adhesive resin are different to one another. Specifically, the difference between the refractive index of the filler and the refractive index of the adhesive resin is at least 1.0.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: March 1, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Hideaki Takahashi, Jun Takahashi, Akio Ito, Yukiko Murasawa
  • Patent number: 6861655
    Abstract: In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of the cured product.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: March 1, 2005
    Assignee: Sony Chemicals Corp.
    Inventor: Hiroyuki Kumakura
  • Patent number: 6855389
    Abstract: The present invention relates to photopolymerizable resin composition inducing substantially no chemical degradation in metals in tight contract with the resin. Further, the present invention relates to optical recording media using the photopolymerizable resins. In one embodiment, a photopolymerizable resin composition includes a photopolymerizable resin based on acrylic ester, and an additive based on at least one selected from the group consisting of benzotriazole and a derivative of benzotriazole, and a photointiator.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: February 15, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Misao Konishi, Yoshiaki Nakata
  • Publication number: 20050027099
    Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.
    Type: Application
    Filed: August 31, 2004
    Publication date: February 3, 2005
    Applicant: SONY CHEMICALS CORP
    Inventors: Noriaki Kudo, Minoru Nagashima
  • Patent number: 6846527
    Abstract: The present invention provides a thermal transfer recording medium having a solvent-resistant layer based on a polyester resin wherein an even ink layer is formed by coating on the solvent-resistant layer. A thermal transfer recording medium 10 of the present invention comprises a solvent-resistant layer 2 based on a polyester resin on a substrate 1 and an ink layer 3 based on a ketone resin on the solvent-resistant layer 2. The solvent-resistant layer 2 contains a polyethylene wax in the range from 10 to 80% by weight of on the basis of the solid content of the solvent-resistant layer.
    Type: Grant
    Filed: October 4, 1999
    Date of Patent: January 25, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Takuya Monju, Hideaki Takahashi
  • Patent number: 6840430
    Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: January 11, 2005
    Assignee: Sony Chemicals, Corp.
    Inventors: Hideyuki Kurita, Masanao Watanabe, Toshihiro Shinohara, Mitsuhiro Fukuda, Yukio Anzai
  • Patent number: 6838134
    Abstract: A recording sheet adaptable to print an image using pigment ink, on which a smear is hardly generated, is provided. A recording sheet includes an ink permeable layer prepared by adding 3-30 parts by weight of a nonionic surfactant including an amine compound as a main component to 30 parts by weight of a water-insoluble component including an inorganic filler and a binder as main components. Ink applied on such an ink permeable layer is directly absorbed into the layer in a depth direction without dispersing in a lateral direction. Therefore, any smear (banding) is hardly generated on a printed image formed on the recording sheet using ink.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: January 4, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Jun Takahashi, Akio Ito, Yukiko Murasawa, Hideaki Takahashi
  • Patent number: 6835442
    Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: December 28, 2004
    Assignees: Sony Chemicals Corp., Circuit Foil Japan Co., Ltd.
    Inventors: Noriaki Kudo, Asaei Takabayashi, Akitoshi Suzuki, Shin Fukuda
  • Patent number: 6827880
    Abstract: An anisotropic conductive adhesive includes the following components (a) to (d): (a) radical polymerizable compound with bridged hydrocarbon residue, (b) an organic peroxide, (c) a thermoplastic resin, and (d) conductive particles for anisotropic conductive connection. In the radical polymerizable compound of component (a), it is desirable that the bridged hydrocarbon residue may be a tricyclodecane residue, and that it contain two or more unsaturated bonds.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: December 7, 2004
    Assignee: Sony Chemicals Corp.
    Inventor: Tomoyuki Ishimatsu
  • Publication number: 20040232273
    Abstract: A method adaptable for winding a long adhesive film at multiple stages in such a diameter that adhesive cannot be squeezed out is provided, as is a reel member that can be applied to this method. A reel member 50A includes a winding spool 52A around which a given film can be wound, and a plurality of flanges 51A mounted on the winding spool 52A and each having a guide groove 53A for passing the film from winding spool 52A on one side to winding spool 52A on the other side of the flange 51A.
    Type: Application
    Filed: August 18, 2003
    Publication date: November 25, 2004
    Applicant: Sony Chemicals Corp.
    Inventors: Koji Arai, Masahiko Ito
  • Patent number: 6818266
    Abstract: A backprinting recording medium includes a transparent substrate, an ink-absorbing layer formed on the transparent substrate and a porous ink-permeable layer formed on the ink-absorbing layer and produced by dispersing a filler in a binder resin, wherein the binder resin constituting the ink-permeable layer has a glass transition temperature of 10° C. or higher, and a Shore D hardness at 25° C. of 40 or higher.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: November 16, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Jun Takahashi, Takashi Nozawa, Hideaki Takahashi
  • Patent number: 6811851
    Abstract: A ridgy resin film made of a resin is formed. On a flat substrate, a first concave and a second concave are formed such as to be spaced a given distance apart from each other. Then, a resin liquid is supplied onto a land being part of the substrate exposed between the first and second concaves. Due to its surface tension, the resin liquid supplied onto the land bulges, and a ridgy resin film even in width is formed by curing the resin liquid in this state. Along the edges of the openings of the first concave and the second concave, ridges are formed. Since the resin liquid is supplied onto the land between the ridges, it does not drip nor overflow.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: November 2, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Mieko Tanaka, Misao Konishi, Satoshi Yanagida
  • Patent number: 6805967
    Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: October 19, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Noriaki Kudo, Minoru Nagashima
  • Patent number: 6800816
    Abstract: A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 &mgr;m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 &mgr;m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: October 5, 2004
    Assignee: Sony Chemicals Corp
    Inventor: Yutaka Kaneda
  • Publication number: 20040188139
    Abstract: A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 &mgr;m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 &mgr;m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 30, 2004
    Applicant: Sony Chemicals Corp.
    Inventor: Yutaka Kaneda
  • Patent number: 6783820
    Abstract: Thermal transfer recording media which make it possible to provide a highly sharpness and clear image even in case of printing on non-coated paper at a high speed and to improve the rub resistance of a printed area after the completion of printing. The present invention provides a thermal transfer recording medium comprising of a base material and a peel layer including a wax (A) and an ink layer including a styrene resin (B), a binder component (C) and a coloring component (D) laminated successively on the base material, wherein the wax (A) is compatible with the styrene resin (B). In the present invention, it is preferable that the weight ratio of the styrene resin (B) to the binder component (C) preferably ranges from 10:90 to 50:50.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: August 31, 2004
    Assignee: Sony Chemicals, Corp.
    Inventors: Toshimichi Harada, Yoichi Shutara