Abstract: A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler, wherein the insulating inorganic filler content (a; vol %) and the elastic modulus of the thermosetting adhesive material after curing (E; GPa/30° C.) satisfy the following relational formula (1): 0.042a+0.9<E<0.106a+2.5  (1) and at the same time, the insulating inorganic filler content (a; vol %) and the tensile elongation (d; %) at 25° C. of the thermosetting adhesive material after curing satisfy the following relational formula (2) −0.072a+4<d<−0.263a+13  (2).

Abstract: The present invention pertains to a multilayer flexible wiring board.

Abstract: The protective element 20A includes a first PTC element 1, as well as a low-melting-point metal member 2, a heat-generating member 3 and a second PTC element. A the PTC material 1′ constituting the first PTC element 1 serves as a substrate for the low-melting-point metal member 2, the heat-generating member 3 or the second PTC element. This protective element using the PTC element can be manufactured easily, with fewer components, and at lower costs. Moreover, the protective element can be made thinner.

Abstract: A PTC element with reduced thickness is manufactured are lower cost by forming an electrode layer on a surface of a flat-plate-shaped PTC material, such that it extends over the upper and lower surfaces and at least one of the side surfaces thereof, and forming an upper surface electrode and a lower surface electrode so that the terminals thereof are positioned on one of the surfaces of the PTC material, by partially removing the electrode layer 11 to segment it into a region where the electrode layer 11 is present on either of the upper or lower surfaces of the PTC material 1 and a region where it extends over the upper and lower surfaces as well as a side surface.

Abstract: A recording sheet for use with inkjet printers which achieves high color density while being free of bleeding is provided. The recording sheet has an ink-receiving layer and an ink permeable layer arranged on a surface of the ink-receiving layer. The ink permeable layer includes a filler, a surfactant, and a binder. The surfactant includes a fluorosurfactant having perfluoro-alkyl groups in its chemical structure. The ink permeable layer is made hydrophobic as well as lipophobic since hydrophilic groups on the surfaces of the filler particles will be covered by perfluoro-alkyl groups of the fluorosurfactant. This prevents aqueous ink added an organic solvent from dispersing within the ink permeable layer. The ink permeable layer includes a binder containing a water-insoluble resin having a hydroxyl value of 4 or higher (mgKOH/g) to lower the affinity to the ink.

Abstract: An information recording sheet of the present invention includes a substrate sheet, a variable information recording layer formed on the substrate sheet and a fixed information recording layer formed on a part of the variable information recording layer and made of a subliming dye receptor layer.

Abstract: A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).

Abstract: An optical disk contains a recording layer and an adhesive layer between at least two substrates, wherein the adhesive layer contains a cationic polymerizable resin (A), a photo-initiator (B), and an anion catcher (C). The weight ratio of the photo-initiator (B) and the anion catcher (C) is preferably from 3:1 to 3:24, more preferably from 3:1 to 3:12.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer.

Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (&mgr;m) and maximum particle size D2 (&mgr;m) respectively satisfy Equations (2) and (3) below, 3<S<17  (1) D1≦5  (2) D2≦0.5(h1+h2)  (3) (wherein h1 represents the height of the protuberant electrode in the electronic component, and h2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.

Abstract: A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at least 90%. The particle material can be manufactured by fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of the conductive particle by a physical/mechanical method to form the insulating resin layer.

Abstract: A printing material containing a white layer and an absorption layer formed on a base material made of a resin film. The base material may be black and opaque, while the white layer contains titanium oxide. The absorption layer may contain a protein and absorbs aqueous inks. The white layer is hydrophilic and thus highly compatible with aqueous inks which have permeated the absorption layer and reached the white layer, thereby giving a vivid image. The printing material may be used in an advertising poster adhered to a windowpane of a bus, etc. by forming a number of holes in the printing material.

Abstract: A connection structure manufacturing method for obtaining a connection structure in which first and second connection terminals are electrically connected, comprises disposing the second connection terminals (connection terminals of a semiconductor element) facing the first connection terminals (connection terminals of a circuit board) through the agency of a thermosetting anisotropic conductive adhesive (anisotropic conductive film), and pressing the second connection terminals while heating and curing the thermosetting anisotropic conductive adhesive. The pressing rate of the second connection terminals is kept at 50 mm/min or less, and the first and second connection terminals are brought into contact through the agency of the conductive particles in the thermosetting anisotropic conductive adhesive before the viscosity of the thermosetting anisotropic conductive adhesive reaches 107 Pa·s as a result of heating and curing.

Abstract: A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.

Abstract: The recording sheet has an ink-receiving layer and an ink permeable layer. The ink permeable layer is arranged on a surface of the ink-receiving layer and includes a filler and a binder. The binder contains as a primary component a water-insoluble polyester resin having a high hydroxyl value in the range of 25 to 65. The ink permeable layer 13 has a significant ink phobicity. The ink permeable layer does not contain a surfactant and is low lipophilic. Thus, when it receives ink containing an organic solvent, the ink does not disperse within the ink permeable layer to provide printed images without bleeding.

Abstract: In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of the cured product.

Abstract: Disclosed are a material for an optical waveguide, which has high polymerizability and high solvent resistance, an optical waveguide made of the material, and a method for manufacturing the optical waveguide. When a material for an optical waveguide from which organic material layers are made is irradiated with an energy beam, it is activated to make a cladding and a core. The material comprises an oxetane compound, an oxirane compound, and a cationic polymerization initiator. Since the oxetane compound has an oxetane ring, it has a high repeated reactivity in a chain reaction. Thus, the material has high polymerizability at the time of a chain reaction, so that a polymer having an increased mechanical strength and a high solvent resistance is produced. The oxetane compound and the oxirane compound have high compatibility with each other and the refractive index of each of the compounds is reflected in the refractive index of a cured mixture.

Abstract: A recording material for back-printing contains (i) a back-printing sheet comprising a transparent substrate, an ink-absorbing layer that is provided on the transparent substrate, and a porous ink-receiving layer that is provided on the ink-absorbing layer and has filler dispersed in a binder resin, and (ii) a back-printing sheet cover film having a cover substrate, and an adhesive layer that has an adhesive resin and is formed on the cover substrate, the refractive index of the filler and the refractive index of the adhesive resin are different to one another. Specifically, the difference between the refractive index of the filler and the refractive index of the adhesive resin is at least 1.0.

Abstract: The present invention provides a flexible wiring board for double-side connection capable of improving the reliability of connection to circuit boards and a manufacturing process thereof.