Abstract: The method of the present invention includes patterning a gate structure. Then, a polyoxide layer is formed on side walls of the gate structure. Then, silicon nitride side wall spacers are formed on the side walls of the gate structure. Then, source/drain structure of the device is fabricated. Next, the side wall spacers are removed to expose a portion of the source and drain. Then, an undoped amorphous silicon layer is formed on the surface of the gate structure, the oxide layer and the exposed source and drain. A dry oxidation process is used to convert the amorphous silicon layer into textured tunnel oxide at the interface of the substrate and the oxide. The oxide is then removed, and a further oxide is re-deposited on the gate and substrate. Polysilicon side wall spacers are then formed. A further polysilicon layer is subsequently deposited over the gate. Then, the polysilicon layer is patterned to define the floating gate. A dielectric is formed at the top of the floating gate.

Abstract: The present invention includes forming field oxide (FOX) isolations on a substrate. A pad oxide layer is then formed on the substrate. An ion implantation is carried out to dope dopants into the substrate by using FOX as a hard mask. Thus, a buried oxygen amorphized region is formed in the substrate. Subsequently, a high temperature thermal anneal is performed to convert the oxygen amorphized region into an buried oxide layer, thereby forming localized Si islands between the substrate and the buried oxide layer. A further thermal oxidation is used to narrow the thickness of the localized Si islands, thereby forming nanometer Si wires. Then, a further ultra thin gate oxide layer is regrow on the nanometer Si wires. Then, CMOS transistors are formed on the substrate.

Abstract: The method for forming flash memory includes the following steps. At first, a semiconductor substrate with an isolation region formed thereupon is provided. The semiconductor substrate has a pad oxide layer and a first nitride layer formed thereover. A portion of the first nitride layer and a portion of the pad oxide layer are removed to define a gate region. A first oxide layer is formed and then a sidewall structure is formed. The semiconductor substrate is doped with first type dopants. A first thermal process is performed to form a second oxide layer and to drive in the first type dopants. The sidewall structure and the first nitride layer are then removed, and a first conductive layer is then formed over the substrate. A doping process is performed to dope the pad oxide layer, the first oxide layer, and the second oxide layer by implanting second type dopants through the first conductive layer.

Abstract: The method includes forming a buried oxide layer in a substrate. A pad oxide layer is then formed on the substrate. A silicon nitride layer is pattered on the surface of the pad oxide. Then, a thick field oxide (FOX) is formed on the pad oxide layer. Sidewall spacers are formed on the side walls of the opening of the silicon nitride layer. Next, the FOX is etched. An ion implantation is performed for adjusting the threshold voltage and anti-punch-through implantation. Subsequently, a dielectric with high permittivity is deposited along the surface of the substrate. The dielectric layer may be formed by a nitride technique. A conductive layer composed of metal or alloy is then formed on the dielectric layer and refilled into the opening. A chemical mechanical polishing is used to remove the dielectric layer, silicon nitride and the spacers such that the conductive layer remains only in the opening. The residual nitride and spacers are removed by hot phosphor acid solution. Source and drain are next created.

Abstract: The present invention provides a method of forming buried contacts on a semiconductor substrate. The steps are as follows. At first, a gate insulator layer is formed over the substrate. A first silicon layer is then formed over the gate insulator layer. A buried contact opening is defined through the first silicon layer and the gate insulator layer extending down to the substrate. The substrate is then doped with a region under the buried contact opening for forming a buried contact region. A second silicon layer is formed over the substrate and the first silicon layer. A portion of the second silicon layer is then removed to define a gate region and an interconnect. Next, the substrate is doped for forming a second doping region under a region uncovered by the gate region and the interconnect. A thermal oxidation process is performed to oxidize an exposed portion of the first silicon layer and a portion of the second silicon layer at a top surface.

Abstract: The present invention includes NMOS devices on a NMOS device area and coded NMOS devices on a cell area. Isolation structures are formed between the NMOS devices and between the coded NMOS devices. N conductive type bit lines are formed under first isolation structures. A coding region is formed on the cell area between two coded NMOS devices and under a second isolation structure. Spacers are formed on the side walls of the NMOS devices and the coded NMOS devices and an anti-reflective coating layer is formed on the NMOS devices and the coded NMOS devices.

Abstract: The present invention is a method of manufacturing a high density capacitors for use in semiconductor memories. High etching selectivity between BPSG (borophososilicate glass) and CVD-oxide (chemical vapor deposition oxide) is used to fabricate a multiple fin-shape capacitor with a plurality of horizontal fins and vertical pillars. First, a contact hole formed on a semiconductor substrate using an etching process. A first polysilicon layer is then deposited in the contact hole to form a plug. A composition layer consists of BPSG and silicon oxide formed on the substrate. Then a opening is formed in the composition layer to serve as a storage node. A highly selective etching is then used to etch the BPSG sublayers of the composition layer. Next, a second polysilicon layer is formed along the surface of the composition layer, the substrate and the plug. Then a SOG layer is formed along the surface of the second polysilicon layer.

Abstract: This invention is a compact and cost effective multiple-feed signal receiver for use in conjunction with a parabolic dish antenna to receive electromagnetic signals from more than one satellite clusters. The multiple-feed signal receiver has a multi-layer structure to integrate circuit boards for different frequency bands or the same frequency band for different signal processing within a limited cross-section and to isolate these boards from signal interference with one another.

Abstract: A method for fabricating a Read Only Memory, (ROM), cell on a semiconductor substrate with device region and programmable cell region. The method includes the followed step. A plurality of field oxide regions is formed on the semiconductor substrate. A P-well and an N-well are formed in the device region of the semiconductor substrate, a P-well is formed in the programmable cell region of the substrate. A photoresist is formed over the N-well in the device region. Next, a phosphorus ion implantation is performed into the P-well in the device region for anti-punchthrough and into the N-well in the programmable region to form buried channel by using the photoresist layer as implant mask. After removing the photoresisit, a CMOS transistor is formed on the device region, and a NMOS transistor is formed on the programmable cell region.

Abstract: A method for forming a trench capacitor of a dynamic random access memory cell is disclosed. The method includes patterning to etch a semiconductor substrate (10) of a first conductivity to form a trench (18) in the substrate. Ions of the first conductivity are tilt-implanted over the trench, so that sidewalls and a bottom surface of the substrate near the trench are doped with the ions of the first conductivity. Next, first ions of a second conductivity are tilt-implanted over the trench at a first angle, thereby forming a first implanted region (22), followed by tilt-implanting second ions of the second conductivity over the trench at a second angle, thereby forming a second implanted region (24). The first angle is larger than the second angle, and the first implanted region and the second implanted region together form a bottom cell plate of the trench capacitor.

Abstract: A MOS transistor with a self-aligned silicide and a lightly doped drain ballast resistor for ESD protection on a semiconductor substrate is formed with the method in the present invention. The ESD protection devices in a ESD protective region are formed at the same time with the forming of the NMOS, PMOS, or both in a functional region. The transistors with a lightly doped drain (LDD) structure and an ultra-shallow junction can be manufactured. The short channel effect and it's accompanying hot carrier effect is eliminated. ESD damage from external connections to the integrated circuits are kept from the densely packed devices. The self-aligned silicide (salicide) technology employed in the present invention for forming low resistance contacts provides high operation speed with low heat generation. Integrated circuits with ESD hardness and high circuit operation speed of the functional devices are provided by the semiconductor manufacturing process employing the method disclosed.

Abstract: The method of the present invention is a method to fabricate a MOS device without boron penetration. After growing a gate oxide layer, a thin stacked-amorphous-silicon layer (SAS) is deposited over the oxide layer. Subsequently, a lightly nitrogen ion is implanted into the stacked-amorphous silicon layer. The stacked-amorphous silicon layer is patterned to define a gate structure. Then, a light doped ion implantation is performed to dope ions through the gate oxide layer into the substrate to form lightly doped source and drain regions. A dielectric layer is formed over the gate structure and the gate oxide layer, and the dielectric layer is etched to form sidewall spacers. Next, a second ion implantation is performed to dope ions into the substrate to form source and drain. Finally, a thermal annealing is performed on the stacked-amorphous silicon gate and the substrate.

Abstract: The method for forming dual threshold circuits on a semiconductor substrate is provided. The semiconductor substrate has a first region, a second region, and a third region. The first region, the second region, and the third region are doped with first type dopants. Then the first region and the second region are doped with second type dopants. The second type dopants are opposite type dopants of the first type dopants. The semiconductor substrate can be performed with more steps to form transistors in the first region, the second region, and the third region.

Abstract: The present invention includes pad oxides that are separated from each other and on a substrate. First isolations are formed on the pad oxides. Second isolations are formed on the substrate, between the pad oxides. Floating gates are formed on the second isolations and between the first isolations. Third isolations are formed at the top of the floating gates. A word line is formed on the first isolations and on the third isolations. Bit lines are formed in the substrate and under the first isolations.

Abstract: The method of the present invention is a method of including forming a gate oxide layer on the substrate. A polysilicon layer is formed on the gate oxide layer. Then, a photographic and etching steps are used to form a gate structure. An oxidation is performed on the substrate and the gate structure to form an first oxide layer on the substrate and on the surface of the polysilicon gate. A silicon nitride layer is deposited on the first oxide layer. A side-wall spacers is formed on the side walls of the gate structure, a first portion of the first oxide layer remaining between the gate structure and the side-wall spacers, and a second portion of the first oxide layer remaining under the side-wall spacers. Next, a first ion implantation performed into the substrate to form first doped ions regions to serves as source and drain region of the transistor. Then, the side-wall spacers is removed, therefore remained the second portion of the first oxide layer covered by the side-wall spacers.

Abstract: The present invention proposes a novel structure of nonvolatile memories with recessed floating gates. A plurality of field oxides is formed on a semiconductor substrate. Buried bit lines are formed in the semiconductor substrate and beneath the field oxides. Between the field oxides over the buried bit lines, trenched floating gates are formed in the semiconductor substrate. Tunnel dielectrics are formed between the trenched floating gates and the semiconductor substrate. The interpoly dielectric is formed over the field oxides and the trenched floating gates and the control gates are formed on the interpoly dielectric. Because of the large area of the recessed tunnel dielectric and the recessed length of the channel, high-density shallow trench contactless nonvolatile memories can be achieved.

Abstract: A method to fabricate nonvolatile memories with a trench-pillar cell structure is disclosed. A pad oxide is formed on a substrate. A pad nitride is then formed on the pad oxide. An ion implantation is performed to form a lightly doping drain (LDD) in the substrate. The pad nitride, the pad oxide and the substrate are etched to form a trench. A nitride layer is then formed on the pad nitride to fill into the trench. The nitride layer is etched back to form spacers on the sidewalls of the trench. The substrate is etched back to form a subtrench in the trench. Afterward, a polysilicon layer is deposited to refill the trench region and covers a surface of the nitride. The polysilicon is etched back to remove the polysilicon layer on a surface of the nitride. The pad nitride, the nitride and the pad oxide are removed. A tunnel oxide is formed on the pillar, the trench region and the substrate. A floating gate is then formed. The floating is in the trench region and is extended to the top of the trench.

Abstract: The present invention includes a normal NMOS device region and a NMOS cell region for coding. An isolation structure is formed between the normal NMOS device region and the NMOS cell region. A gate oxide is formed on the normal NMOS device region and a coding oxide is formed on the NMOS cell region. A polysilicon layer is formed on the gate oxide. Gates are respectively formed on the polysilicon layer and the coding oxide. Spacers are formed on the side walls of the gates. LDD structures are formed under the spacers and adjacent to the gates. Source and drain regions are formed next to the LDD structures. A p type conductive region is formed adjacent to the surface of the NMOS cell region and under the coding oxide.

Abstract: An interconnection structure is disclosed. The interconnection structure has a dielectric layer over a semiconductor substrate. The interconnection structure also has first conductive connections within the dielectric layer. Second conductive connections are located over first conductive connections within the dielectric layer for connecting the first conductive connections. More layers of the interconnection structure can be stacked with the same structure to form multi-level connections.

Abstract: The method for forming a trench isolation includes the steps as follows. At first, a first pad layer is formed over the semiconductor substrate and a stacked layer is formed over the first pad layer. An opening is then defined in the first pad layer and the stacked layer. A portion of the first pad layer is removed to have an undercut region under the stacked layer. A second pad layer is formed on an exposed portion of the semiconductor substrate under the opening and the undercut region. Then a buffer layer within the undercut region and a sidewall structure on the stacked layer are formed. A portion of the second pad layer uncovered by the sidewall structure is removed. A portion of the semiconductor substrate uncovered by the stacked layer and the second pad layer is then removed to form a trench. A first insulator layer is formed over the trench and within the undercut region. Thus a trench structure with a first insulator layer can be formed.