Abstract: Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device may include a buffer layer disposed on a substrate, the buffer layer including gallium (Ga) and nitrogen (N), a barrier layer disposed on the buffer layer, the barrier layer including aluminum (Al) and nitrogen (N), a regrown structure disposed in and epitaxially coupled with the barrier layer, the regrown structure including nitrogen (N) and at least one of aluminum (Al) or gallium (Ga) and being epitaxially deposited at a temperature less than or equal to 600° C., and a gate terminal disposed in the barrier layer, wherein the regrown structure is disposed between the gate terminal and the buffer layer. Other embodiments may be described and/or claimed.

Abstract: Embodiments provide a switching device including one or more field-effect transistors (FETs). In embodiments, a negative bias circuit is configured to generate a negative voltage signal based on a radio frequency (RF) signal applied to the circuit. When the FET is in an off state, the negative voltage signal is provided to a gate terminal of the FET.

Abstract: Various embodiments provide a bias circuit for a radio frequency (RF) power amplifier (PA) to provide a direct current (DC) bias voltage, with bias boosting, to the RF PA. The bias circuit may include a bias transistor that forms a current mirror with an amplifier transistor of the RF PA. The bias circuit may further include a first resistor coupled between the gate terminal and the drain terminal of the bias transistor to block RF signals from the gate terminal of the bias transistor. The bias circuit may further include a second resistor coupled between the drain terminal of the bias transistor and the RF PA (e.g., the gate terminal of the amplifier transistor). An amount of bias boosting of the DC bias voltage provided by the bias circuit may be based on an impedance value of the second resistor.

Abstract: A bulk acoustic wave (BAW) resonator is constructed to reduce phase and amplitude ripples in a frequency response. The BAW resonator is fabricated on a substrate 400 ?m thick or less, preferably approximately 325 ?m, having a first side and a polished second side with a peak-to-peak roughness of approximately 1000 A. A Bragg mirror having alternate layers of a high acoustic impedance material, such as tungsten, and a low acoustic impedance material is fabricated on the first side of the substrate. A BAW resonator is fabricated on the Bragg mirror. A lossy material, such as epoxy, coats the second side of the substrate opposite the first side. The lossy material has an acoustic impedance in the range of 0.01× to 1.0× the acoustic impedance of the layers of high acoustic impedance material.

Abstract: A radio frequency (RF) power amplifier (PA) may include a first transistor and a second transistor. A first power cell may be coupled with the first transistor, and a second power cell may be coupled with the second transistor. In embodiments, the first transistor may be scaled to operate at a first current density, while the second transistor may be scaled to operate at a second current density.

Abstract: Methods and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. A package may include a plurality of distinct thermal spreader layers disposed between a die and a metal carrier. Other embodiments are described and claimed.

Abstract: Embodiments of apparatuses, systems and methods relating to temperature compensation of acoustic resonators in the electrical domain are disclosed. Other embodiments may be described and claimed.

Abstract: Embodiments provide a switching device including a field-effect transistor (FET) having a source terminal, a drain terminal, a gate terminal, and a body terminal. The FET may be switchable between an on state, in which the FET passes a transmission signal between the source terminal and the drain terminal, and an off state, in which the FET prevents a transmission signal from passing between the source terminal and the drain terminal. The FET may receive a control signal at the gate terminal to switch the FET between the on state and the off state. The switching device may further include one or more forward diodes coupled between the gate terminal and the body terminal to bias the body terminal during the on state, and one or more reverse diodes coupled between the gate terminal and the body terminal to bias the body terminal during the off state.

Abstract: One embodiment of an integrated circuit includes a discrete device that defines a top surface, an integrated circuit substrate, and a heat dissipation structure fully covering the top surface of the discrete device and being thermally connected to the integrated circuit substrate.

Abstract: Embodiments of the present disclosure describe apparatuses, methods, and systems of thermal via structures with surface features. In some embodiments the surface features may have dimensions greater than approximately one micron. The thermal via structures may be incorporated into a substrate of an integrated circuit device. Other embodiments may be described and/or claimed.

Abstract: Embodiments include but are not limited to apparatuses and systems including an integrated capacitor. An integrated capacitor may include a substrate, a first capacitor plate having four edges, and a second capacitor plate overhanging the four edges of the first capacitor plate and disposed over the first capacitor plate such that the first capacitor plate is disposed between the second capacitor plate and the substrate.

Abstract: Embodiments provide a radio frequency (RF) power amplifier (PA) circuit having a high-power mode and a low-power mode. The RF PA circuit may include a high-power amplifier to provide an amplified RF signal on a first path, and a low-power amplifier to provide an amplified RF signal on a second path. The first path and second path may intersect at a junction node. A switch may be coupled between the low-power amplifier and the junction node to switch the circuit between the high-power mode and the low-power mode. A matching circuit may be coupled on the second path to match an output impedance of the low-power amplifier to a junction impedance of the junction node at a fundamental frequency of the RF signal, and to present an open circuit at a third harmonic of the RF signal. The matching circuit may facilitate high efficiency for the RF PA circuit.

Abstract: Embodiments of apparatuses, methods, and systems for a radio frequency amplification circuit providing for fast loadline modulation are generally described herein. Other embodiments may be described and claimed.

Abstract: An isolated epitaxial modulation device comprises a substrate; a barrier structure formed on the substrate; an isolated epitaxial region formed above the substrate and electrically isolated from the substrate by the barrier structure; a semiconductor device, the semiconductor device located in the isolated epitaxial region; and a modulation network formed on the substrate and electrically coupled to the semiconductor device. The device also comprises a bond pad and a ground pad. The isolated epitaxial region is electrically coupled to at least one of the bond pad and the ground pad. The semiconductor device and the epitaxial modulation network are configured to modulate an input voltage.

Abstract: Embodiments provide a switching device including one or more field-effect transistors (FETs). In embodiments, a resistive divider comprising a first resistor and a second resistor may be coupled with the FET at a position electrically between a gate terminal of the FET and a body terminal of the FET.

Abstract: Embodiments provide a solidly-mounted bulk acoustic wave (BAW) resonator and method of making same. In embodiments, the BAW resonator may include one or more extensions that are acoustical similar to active region components of the BAW resonator. Other embodiments may be described and claimed.

Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.

Abstract: Embodiments include an apparatus, system, and method related to a body-contacted partially depleted silicon on insulator (PDSOI) transistor that may be used in a switch circuit. In some embodiments, the switch circuit may include a discharge transistor to provide a discharge path for a body of a switch transistor. Other embodiments may be described and claimed.

Abstract: Methods and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. A package may include a plurality of distinct thermal spreader layers disposed between a die and a metal carrier. Other embodiments are described and claimed.

Abstract: Embodiments include but are not limited to apparatuses and systems including a quadrature lattice matching network including first path having a series inductor and a shunt inductor, and a second path having a series capacitor and a shunt capacitor. Other embodiments may be described and claimed.