Patents Assigned to Vishay Intertechnology
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Patent number: 7394845Abstract: An interwoven spreading code is formed by a stretched spreading code series at a first frequency and a mirror of the stretched spreading code series at a second frequency. The interwoven spreading code can be used to spread a baseband signal. Data can be recovered through correlation of a received signal with the interwoven spreading code. The spreading code used in forming the interwoven spreading code can be a Barker code.Type: GrantFiled: February 3, 2005Date of Patent: July 1, 2008Assignee: Vishay Intertechnology, Inc.Inventors: Dani Alon, Meir Gazit
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Publication number: 20070253143Abstract: An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted.Type: ApplicationFiled: May 1, 2006Publication date: November 1, 2007Applicant: Vishay Intertechnology, Inc.Inventors: Haim Goldberger, Reuven Katraro, Doron Gozaly
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Patent number: 7278201Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: GrantFiled: October 18, 2004Date of Patent: October 9, 2007Assignee: Vishay Intertechnology, IncInventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 7247250Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.Type: GrantFiled: October 13, 2004Date of Patent: July 24, 2007Assignee: Vishay Intertechnology, Inc.Inventors: George V. Gerber, Anthony E. Troianello, Haim Goldberger
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Patent number: 7154370Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power.Type: GrantFiled: January 22, 2004Date of Patent: December 26, 2006Assignee: Vishay Intertechnology, Inc.Inventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 7150199Abstract: An improved strain gage and an improved manufacturing method are disclosed. The strain gage includes a semi-rigid substrate having a thickness of 3 to 30 mils, a resistive strain sensitive foil bonded to the semi-rigid substrate for providing a resistance varying with strain associated with a surface to which the strain gage is attached, a first and a second terminal operatively connected to the resistive strain sensitive foil, and an anti-static layer. The improved strain gage allows for reduced labor content in manufacturing by allowing use of modern automated electronic component manufacturing equipment.Type: GrantFiled: October 5, 2004Date of Patent: December 19, 2006Assignee: Vishay Intertechnology, Inc.Inventors: Thomas Patrick Kieffer, Robert Barry Watson, Sharon Lee Karcher Harris
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Patent number: 7089652Abstract: The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: GrantFiled: May 19, 2003Date of Patent: August 15, 2006Assignee: Vishay Intertechnology, Inc.Inventors: Leonid Akhtman, Sakaev Matvey
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Publication number: 20060171447Abstract: An interwoven spreading code is formed by a stretched spreading code series at a first frequency and a mirror of the stretched spreading code series at a second frequency. The interwoven spreading code can be used to spread a baseband signal. Data can be recovered through correlation of a received signal with the interwoven spreading code. The spreading code used in forming the interwoven spreading code can be a Barker code.Type: ApplicationFiled: February 3, 2005Publication date: August 3, 2006Applicant: Vishay Intertechnology, Inc.Inventors: Dani Alon, Meir Gazit
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Publication number: 20050224454Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.Type: ApplicationFiled: October 13, 2004Publication date: October 13, 2005Applicant: Vishay Intertechnology, Inc.Inventors: George Gerber, Anthony Troianello, Haim Goldberger
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Patent number: 6892443Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: GrantFiled: November 25, 2002Date of Patent: May 17, 2005Assignee: Vishay IntertechnologyInventors: Joseph Szwarc, Reuven Goldstein
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Publication number: 20050083170Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: ApplicationFiled: October 18, 2004Publication date: April 21, 2005Applicant: Vishay IntertechnologyInventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 6880234Abstract: A method for manufacturing a thin film negative temperature coefficient thermistor is disclosed. The method includes selecting a negative temperature coefficient of resistance versus temperature curve, selecting a mixture of metal film materials to provide the negative temperature coefficient of resistance curve while maintaining a desired physical size, and depositing the mixture of metal film materials on a substrate.Type: GrantFiled: March 16, 2001Date of Patent: April 19, 2005Assignee: Vishay Intertechnology, Inc.Inventor: Javed Khan
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Patent number: 6880233Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.Type: GrantFiled: February 20, 2002Date of Patent: April 19, 2005Assignee: Vishay Intertechnology, Inc.Inventors: George V. Gerber, Anthony E. Troianello, Haim Goldberger
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Patent number: 6876061Abstract: A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate).Type: GrantFiled: May 28, 2002Date of Patent: April 5, 2005Assignee: Vishay Intertechnology, Inc.Inventors: Felix Zandman, Y. Mohammed Kasem, Yueh-Se Ho
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Patent number: 6873028Abstract: A chip resistor comprising a substrate having opposite parallel symmetrical first and second surfaces, a central longitudinal plane of symmetry, separate and spaced first and second resistive layers on the first and second surfaces. The resistive layers are electrically connected in parallel to each other and the first and second surfaces of the substrate are symmetrically located with respect to and equidistant from a central longitudinal plane. Thus, when electrical current passes through the resistive layers, a temperature distribution within the substrate will be substantially symmetrical about the central longitudinal plane of the substrate for eliminating thermal bending thereof. The splitting of the surge current between two resistive layers results in the lower temperature in each resistive layer when compared with the temperature in the single resistive layer of the prior art chip resistor loaded by the same current.Type: GrantFiled: November 15, 2001Date of Patent: March 29, 2005Assignee: Vishay Intertechnology, Inc.Inventor: Michael Belman
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Publication number: 20050039539Abstract: An improved strain gage and an improved manufacturing method are disclosed. The strain gage includes a semi-rigid substrate having a thickness of 3 to 30 mils, a resistive strain sensitive foil bonded to the semi-rigid substrate for providing a resistance varying with strain associated with a surface to which the strain gage is attached, a first and a second terminal operatively connected to the resistive strain sensitive foil, and an anti-static layer. The improved strain gage allows for reduced labor content in manufacturing by allowing use of modern automated electronic component manufacturing equipment.Type: ApplicationFiled: October 5, 2004Publication date: February 24, 2005Applicant: VISHAY INTERTECHNOLOGY, INC.Inventors: Thomas Kieffer, Robert Watson, Sharon Karcher Harris
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Publication number: 20040159162Abstract: An improved strain gage is disclosed. The strain gage includes a semi-rigid substrate having a thickness of about 1 to about 30 mils, a resistive strain sensitive foil bonded to the semi-rigid substrate for providing a resistance varying with strain associated with a surface to which the strain gage is attached, and a first and a second terminal operatively connected to the resistive strain sensitive foil.Type: ApplicationFiled: February 19, 2003Publication date: August 19, 2004Applicant: Vishay IntertechnologyInventors: Thomas Patrick Kieffer, Robert Barry Watson, Sharon Lee Karcher Harris
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Publication number: 20040150505Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power.Type: ApplicationFiled: January 22, 2004Publication date: August 5, 2004Applicant: Vishay IntertechnologyInventors: Joseph Szwarc, Reuven Goldstein
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Publication number: 20040100356Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: ApplicationFiled: November 25, 2002Publication date: May 27, 2004Applicant: Vishay IntertechnologyInventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 6727798Abstract: The present invention provides for a flip chip resistor having a substrate having opposite ends, a pair of electrodes formed from a first electrode layer disposed on the opposite ends of the substrate, a resistance layer electrically connecting the pair of electrodes, a protective layer overlaying the resistance layer, and a second electrode layer overlaying the first electrode layer and at least a portion of the protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: GrantFiled: September 3, 2002Date of Patent: April 27, 2004Assignee: Vishay Intertechnology, Inc.Inventors: Leonid Akhtman, Sakaev Matvey
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Patent number: 5248298Abstract: An insert is provided to be attached to a shield on a surgical trocar obturator handle. The insert is actuated by the surgical trocar cannula handle so that it causes the shield to expose the sharpened obturator tip after insertion of the obturator and shield within the cannula. After usage, the insert is deactivated so that the shield again covers the obturator. The obturator can then be removed from the cannula handle and obturator shield, and the obturator handle can be discarded safely.Type: GrantFiled: April 16, 1992Date of Patent: September 28, 1993Assignee: Ethicon, Inc.Inventors: James Bedi, Steven Annunziato