Abstract: Lead-free solders based on an Sn—In—Ag solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium.

Abstract: The present invention provides improved cathodes and industrialized methods for producing such cathodes using an industrial dosing valve-based electrode coating fluid emitting technique. The family of cathodes according to the present invention can be produced so that they inhabit a pre-existing metallic surface such as an inner surface of a titanium casing adjacent but insulated from direct electrical communication from an anode. Foil-type valve metal anodes as well as porous valve metal anodes formed from metallic powders may be used in conjunction with the cathodes of the present invention.

Abstract: Methods for manufacturing 7-ethyl-10-[4-(1-piperidino)-1-piperidino]-carbonyloxy-camptothecin are described comprising I. reacting a mixture of 1-chlorocarbonyl-4-piperidinopiperidine hydrochloride and 7-ethyl-10-hydroxycamptothecin in a polar aprotic solvent with a base in the presence of catalytic amounts of a N-containing cyclic organic compound having 3 to 20 carbon atoms and optionally in the presence of a water binding agent in an amount which effectively binds any water present in the above reactants and solvents; or II. reacting: (a) 7-Ethyl-10-hydroxycamptothecin in a polar aprotic solvent with phosgene, trichlormethyl-chloroformate, bis(trichloromethyl)carbonate or a alternative to phosgene and a base in the presence of catalytic amounts of a N-containing cyclic organic compound having 3 to 20 carbon atoms; and (b) subsequently with piperidinopiperidine and an amine base.

Abstract: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.

Abstract: Metal pastes and methods make it possible to produce extremely compact layers between contact surfaces of structural components, which layers are sufficiently elastic to permanently withstand mechanical and thermal stress variations. This is achieved by the porosity of a corresponding contact area being controlled. For this purpose, a metal paste is provided which contains 70-90% by weight of a metal powder, 1-20% by weight of an endothermically decomposable metal compound and 5-20% by weight of a solvent having a boiling point or range above 220° C., the metal paste being compactable exothermically to form a metal contact.

Abstract: A catalyst for selective oxidation of hydrocarbons relative to carbon monoxide includes a mixed oxide based on the compound Ce0.1-0.5Ti0.2-0.8Cr0.1-0.5Ox, wherein x is (the total of the valences of the metals)/2. Preferably, the mixed oxide is fixed as a coating on a molded body or less than 0.5 wt. % precious metal is doped to the mixed oxide. Oxidizable exhaust-gas components are oxidized for exhaust-gas purification by a mixed oxide based on the compound Ce0.1-0.5Ti0.2-0.8Cr0.1-0.5Ox as the catalyst. Preferably, hydrocarbons are preferentially oxidized relative to carbon monoxides or nitrogen oxides. For producing an oxidation catalyst for internal combustion engines, a mixed oxide made of cerium oxide, titanium oxide, chromium oxide, and optionally other metal oxides is fixed to a metallic or oxide or carbide, high temperature-stable molded body or an oxide ceramic, wherein the oxide ceramic is fixed to a molded body.

Abstract: An adhesive is provided, in particular for the adhesion of conductive materials, having at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder contain an electrically conductive material. Further, an assembly is provided made of a sputtering target material and a carrier material with an adhesive.

Abstract: An electrode structure made of noble metal or a noble metal alloy having a thickness of ?100 ?m is provided for implants. The electrode structure has an electrode core made of gold, silver, copper, or an alloy of at least two of these elements, and the electrode core is completely encased by a first coating, which is formed from platinum, iridium, or ruthenium.

Abstract: A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.

Abstract: A stimulation electrode is produced having a porous film layer and being partially coated with an insulating parylene (polyparaxylylene) film, whose insulating film has a dielectric breakdown voltage of greater than 100 V. Parylene is deposited on the entire surface of a porous film coating and then partially removed again by plasma. After the partial removal of the parylene, this porous film still has a capacitance of greater than 15 mF/cm2 in a physiological NaCl solution at a frequency of 0.1 Hz. For the stimulation electrode, the transition from the insulating film to the porous film is formed so that the film thickness of the parylene film decreases continuously. In this way, a stimulation electrode having a porous film layer and being partially coated with an insulating parylene film is provided, whose electrode on the non-insulating parylene film-coated surface has a capacitance of greater than 15 mF/cm2 in a physiological NaCl solution at a frequency of 0.

Abstract: Process for removing the noble metal from noble metal-containing moulded catalyst bodies, comprising these steps of A leaching the noble metal from loosely heaped moulded catalyst bodies, B removing the mother liquor, C automated conveying of the moulded bodies into a centrifuge, D renewed leaching, E separating off of the residual mother liquor by centrifuging.

Abstract: A sputter target includes a sputter material made of an alloy or a material mixture composed of at least two components which are in a state of thermodynamic disequilibrium. The components are compacted by an isostatic or uniaxial cold-pressing process.

Abstract: An electrode system with a current feedthrough through a ceramic discharge vessel is provided which, on one hand, increases the visible output of lamps and, on the other hand, allows smaller dimensions. For this purpose, the current feedthrough is made of rhenium or a platinum-group metal. In this way, improved color reproduction is also achievable. In preferred embodiments: (a) the current feedthrough is made of rhenium or a rhenium alloy or a platinum-group metal or a platinum-group metal alloy and the current feedthrough is brazed flush in the discharge vessel, (b) the discharge vessel has no shaft, and/or (3) the current feedthrough is in the form of one or more joined spheres.

Abstract: An electrode for medical applications is provided with a PtIr coating which is at least partly porous. The coating contains more than 20% iridium by weight and at least 100 ppm Pt. The coated areas of the electrode exhibit an electrochemical capacitance of more than 5 mF/cm2 in physiological saline solution at 37° C. and a measurement frequency of 100 mHz. A sputter process is suitable for this purpose, in which a porous platinum-iridium layer is deposited on the electrode by simultaneously sputtering at least one iridium target and at least one platinum target.

Abstract: A tubular target is provided having a cylindrical carrier tube, at least one target tube arranged on its exterior surface, and a connecting layer arranged between the target tube and the carrier tube. The connecting layer is electrically conductive and has a wetting degree of >90%.

Abstract: Processes for the recovery of ruthenium from materials containing ruthenium or ruthenium oxides or from ruthenium-containing noble metal ore concentrates, with the steps of A. the introduction of the material into a highly alkaline alkali hydroxide melt in the presence of nitrate as oxidising agent with the formation of an oxidised melt residue with water-soluble ruthenate (RuO4)2?, B. the dissolution of the oxidised melt residue obtained in water, C. the addition of a reducing agent, D. the precipitation of the metals formed, can also be used for separating off selenium. Optionally, ruthenium is separated off by distillation, instead of precipitation, following step B, with the steps of 5C the treatment of the ruthenate-containing solution with an oxidising agent, 5D distilling off of the RuO4 obtained, 5E taking up of the RuO4 from step 5D in hydrochloric acid. By way of further subsequent purification steps, processes for the recovery of ruthenium targets are obtained.

Abstract: In processes for removing ruthenium by distilling RuO4 from ruthenate-containing solutions with these steps of the treatment of the ruthenate-containing solution with an oxidising agent, distilling off of the RuO4 formed, absorbing the RuO4 from step II in hydrochloric acid, the oxidising agent is recycled into step I following step III. The processes can be carried out in reactor modules with A a reactor with a stirrer, gas inlet and gas outlet, B at least one scrubber connected in series downstream with the gas outlet via a line, C one or several gas absorbers connected in series downstream with the at least one scrubber via lines, E at least one line from the optionally last absorber for recycling into the gas inlet of the reactor or into a further module or into a facility for off-gas treatment.

Abstract: A sputter target is provided having a sputter material based on TiO2 and made such that the sputter material contains 15-60 mol. % Nb2O5. A method for the production of the sputter target includes the following steps: mixing of TiO2 and Nb2O5 powder in a liquid slurry; spray granulating this slurry to form TiO2:Nb2O5 mixed oxide granulate; and plasma spraying this granulate onto a sputter target base body.

Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

Abstract: A sputter target has a carrier body and a target material arranged on the carrier body, wherein the carrier body has a rear surface facing away from the target material and the target material has a front surface facing away from the carrier body. A ferromagnetic material is arranged between the front surface and the rear surface.