Abstract: A process for the production of 10-hydroxycamptothecin hydroxycamptothecin and/or of 7-alkyl 10-hydroxycamptothecin, with the steps of A Providing a continuous fluid stream with a thickness d of a solution of camptothecin N-oxide or 7-alkyl camptothecin N-oxide; and B. Passing the stream past at least one source of light which produces radiation parallel to the thickness d, d being 10 ?m to 1000 ?m; and devices for executing the process.
Type:
Application
Filed:
November 25, 2008
Publication date:
June 4, 2009
Applicant:
W.C. HERAEUS GMBH
Inventors:
Silvia WERNER, Holger Rauter, Friedrich Wissmann, Raimund Seliger
Abstract: Palladium on aluminium oxide carrier is very well-suited for decomposing dinitrogen monoxide-contained, e.g., in anaesthetic gases—in oxygen-containing gases having a moisture content of 5-20% H2O (or 5-10% H2O) at temperatures <450° C. The palladium content of the catalyst preferably is <2 wt.-% with respect to Al2O3.
Type:
Application
Filed:
November 21, 2008
Publication date:
May 28, 2009
Applicant:
W.C. HERAEUS GMBH
Inventors:
STEFAN KOCH, RAINER KIEMEL, GABRIELLE PRZIBILLA
Abstract: In a halogen-metal vapor lamp having a ceramic housing (2) and a current lead-through conductor (3) arranged in the ceramic housing, the glazed part of the current lead-through conductor (3) is a niobium alloy doped with phosphorus, in particular with 50 ppm to 0.5 wt. % phosphorus. The glazed part of the current lead-through conductor (3) preferably has inside the ceramic vessel (2) a shielding (4) from halides, which is connected to a tungsten electrode. The glazed part of a current lead-through conductor (3) in the form of a pin having a length of 5 to 30 mm and a diameter of 0.2 to 2 mm is a niobium alloy doped with phosphorus. For the glazing of current lead-through conductors in a ceramic burner, a current lead-through conductor made of a niobium alloy temperature-stabilized with phosphorus is glazed.
Abstract: A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of metallic strands and positioning the bundle within an outer tube. The tube and strands are then drawn down to a predetermined diameter to form a wire for use in medical devices. The wire may be covered with an insulating material.
Type:
Application
Filed:
January 29, 2009
Publication date:
May 28, 2009
Applicants:
FORT WAYNE METALS RESEARCH PRODUCTS CORPORATION, W. C. HERAEUS GMBH & CO. KG
Inventors:
Mark S. Michael, Hans-Juergen Wachter, Robert J. Myers
Abstract: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.
Type:
Application
Filed:
September 25, 2008
Publication date:
May 28, 2009
Applicant:
W. C. Heraeus GmbH
Inventors:
Wolfgang SCHMITT, Tanja DICKEL, Katja STENGER
Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
Type:
Application
Filed:
September 18, 2008
Publication date:
March 19, 2009
Applicant:
W.C. HERAEUS GMBH
Inventors:
Dong-Ik YANG, Eun-Kyun CHUNG, Joong-Geun SHIN, Nam-Kwon CHO
Abstract: A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of metallic strands and positioning the bundle within an outer tube. The tube and strands are then drawn down to a predetermined diameter to form a wire for use in medical devices. The wire may be covered with an insulating material.
Type:
Grant
Filed:
August 15, 2005
Date of Patent:
March 10, 2009
Assignees:
Fort Wayne Metals Research Products Corporation, W.C. Heraeus GmbH & Co., KG
Inventors:
Mark S. Michael, Hans-Jüergen Wachter, Robert J. Myers
Abstract: A slip ring has a substrate material and a sliding contact surface made of gold or a gold alloy. The sliding contact surface is stabilized by a support base. The slip ring is used in slip ring transmitters, in particular in wind power plants or industrial robots, for transmitting control signals and control currents and generator currents. An extended service life, in conjunction with improved quality, a reduced drop in voltage and considerable savings in the amount of gold used can be achieved with the slip ring.
Abstract: The invention relates to a gold alloy containing 99 wt. %, preferably 99.9 wt. % gold, and 1 to 1000 ppm, preferably 10 to 100 ppm calcium, and 1 to 1000 ppm, preferably 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, as well as a method for producing a homogeneous gold alloy containing europium and/or ytterbium.
Type:
Application
Filed:
February 13, 2007
Publication date:
January 22, 2009
Applicant:
W.C. HERAEUS GMBH
Inventors:
Albrecht Bischoff, Lutz Schraepler, Holger Zingg
Abstract: A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant.
Type:
Application
Filed:
September 2, 2008
Publication date:
December 25, 2008
Applicant:
W.C. HERAEUS GMBH
Inventors:
Matthias FRERICKS, Oliver KEITEL, Frank KRUGER, Heiko SPECHT, Hans-Jurgen WACHTER, Christiane LEITOLD
Abstract: A wire, strip or reshaped part is produced from an alloy based on platinum, palladium or a mixture of platinum and palladium and hardened by oxide dispersion. The wire, strip or reshaped part cross-section exhibits a peripheral zone in which at least one relatively easily volatilized oxide generator is depleted by at least 25%. In addition, a process is provided for production of such a wire, strip or reshaped part, in which a porous skin is produced thermally on the wire, strip or reshaped part, and the porous skin is compacted by conversion into a soft or impermeable skin.
Type:
Application
Filed:
February 14, 2008
Publication date:
December 4, 2008
Applicant:
W.C. Heraeus GmbH
Inventors:
Harald MANHARDT, Carsten MOHR, David Francis LUPTON
Abstract: A recycling furnace and method are provided for processing potentially explosive precious metal-containing materials having organic fractions that combust with great energy, the furnace including a switching facility for alternating operation of a burning-off chamber of the furnace between: (A) pyrolysis or carbonization under protective furnace gas in an atmosphere comprising maximally 6 wt-% oxygen, and (B) oxidative combustion of the organic fractions including carbon. The furnace has indirect heating and a control that determines the end of the pyrolysis or carbonization by a sensor and controls the switching facility to supply air or oxygen to the interior of the furnace. Steps (A) and (B) are carried out sequentially in the furnace chamber, wherein neither the batch is changed, nor the furnace is opened. After the end of step (A) is determined, step (B) proceeds right after the pyrolysis or carbonization by supplying air or oxygen.
Type:
Application
Filed:
March 27, 2008
Publication date:
December 4, 2008
Applicant:
W.C. HERAEUS GMBH
Inventors:
Christian NOWOTTNY, Horst MEYER, Matthias GREHL, Dieter SCHAFER, Hans-Joachim ALT, Wilhelm GLAB
Abstract: Preparation of halogenide-free Platinum(II)acetylacetonate [Pt(acac)2] Platinum(II) hexafluoroacetylacetonate [Pt(hfac)2], Platinum(II) trifluoroacetylacetonate [Pt(tfac)2] or Platinum(II)-alkylsubstituted acetylacetonates by the reaction of a halogen free platinum (IV) oxo- or hydroxo-compound, such as PtO2.nH2O (n being an integer from 1 to 4) or H2Pt(OH)6 or Na2Pt(OH)6 or K2Pt(OH)6, with a reducing agent in aqueous solution in the presence of a stoichiometric or higher amount of acetylacetone (acac), potassium acetylacetoante (Kacac) sodium acetylacetonate (Naacac), hexafluoroacetylacetone (hfac), trifluoroacetylacetone (tfac) or alkyl substituted acetylacetones or their salts and an H+ donor.
Type:
Grant
Filed:
January 25, 2008
Date of Patent:
October 28, 2008
Assignee:
W.C. Heraeus GmbH
Inventors:
Steffen Voss, Dongshui Zeng, Stephen Jeffery, Kevin King
Abstract: An electrically conductive titanium dioxide sputter target with an electrical resistivity of less than 5 ?-cm, which contains as an additive at least one doping agent or a mixture of doping agents in an amount of less than 5 mole %. The doping agent or agents are selected from the group including indium oxide, zinc oxide, bismuth oxide, aluminum oxide, gallium oxide, antimony oxide, and zirconium oxide. This treatment renders the titanium dioxide sputter target suitable for use in a direct-current sputtering process without any negative effects on the properties of the coating.
Type:
Grant
Filed:
August 19, 2002
Date of Patent:
October 7, 2008
Assignee:
W.C. Heraeus GmbH & Co., KG
Inventors:
Markus Schultheis, Christoph Simons, Martin Weigert
Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
Abstract: The invention relates to an iridium alloy of at least 85% by weight iridium, at least 0.005% by weight molybdenum, 0.001 to 0.6% by weight hafnium and, if necessary, rhenium, the sum of molybdenum and hafnium being between 0.002 and 1.2% by weight, and to a process for the production of an iridium alloy, an IrMo and an IrHf master alloy, respectively, being produced in the electric arc and immersed into an iridium melt, if necessary together with Re.
Type:
Application
Filed:
July 7, 2006
Publication date:
September 4, 2008
Applicant:
W.C. Heraeus GmbH
Inventors:
Michael Koch, David Francis Lupton, Harald Manhardt, Tobias Mueller, Reinhold Weiland, Bernd Fischer
Abstract: A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of drawn filled tubing strands and positioning the bundle within an outer tubing. The tubing and strands are then drawn down to a predetermined diameter to form a wire for use in the medical devices. The wire may be covered with an insulating material.
Type:
Grant
Filed:
September 13, 2004
Date of Patent:
September 2, 2008
Assignees:
Fort Wayne Metals Research Products Corp., W.C. Heraeus GmbH & Co. KG
Inventors:
Mark S. Michael, Hans-Jüergen Wachter, Robert J. Myers
Abstract: A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant.
Type:
Grant
Filed:
December 12, 2003
Date of Patent:
September 2, 2008
Assignee:
W.C. Heraeus GmbH & Co. KG
Inventors:
Matthias Frericks, Oliver Keitel, Frank Krüger, Heiko Specht, Hans-Jürgen Wachter, Christiane Leitold
Abstract: A material mixture is produced having a cobalt-based alloy as the predominant component and an additional component of at least TiOx. The material mixture may be formed into a sputter target by hot pressing.
Abstract: A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HVO.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.
Type:
Application
Filed:
September 7, 2007
Publication date:
March 27, 2008
Applicant:
W.C. Heraeus GmbH
Inventors:
Albrecht Bischoff, Heinz Foerderer, Lutz Schraepler, Frank Krueger