Abstract: An output ripple voltage average amplitude of a switch mode DC-DC converter is dynamically maintained. The converter has a switch and an output filter. By varying a switching period (TPERIOD) of the switch, VRIPPLE is maintained at a substantially constant value over a first range of converter input voltages and a second range of switch duty cycles. Where the output filter includes an inductor having inductance (L) and a capacitor having capacitance (C) the average amplitude of VRIPPLE is dynamically maintained by varying TPERIOD with respect to switch duty cycle (D) and input voltage (VIN) so as to approximately satisfy the following relationship: TPERIOD=(VRIPPLE*8*L*C)0.5/(VIN*(D?D2)).5.

Abstract: A hybrid voltage rectifier enables a switch mode DC-DC power converter to safely power an external dynamic load by way of a substantially lossless conductive coupling between an output filter of the converter and the load. The rectifier is controlled so as to permit net average current through an inductor of the output filter to be approximately equal to, but not less than, zero by permitting very low loss conduction in the first quadrant and, selectively, cycle by cycle, in the third quadrant during load operation. The converter has a first switch, an output filter, a second switch, and a controller. The output filter is conductively coupled with the first switch, and has an inductor in series with the load. The controller sets state conditions of the second switch, such that the inductor operates in a continuous current mode.

Abstract: DC-DC converters are described that employ a time-averaged modulated bypass diode to facilitate the efficient harvest of power in photovoltaic systems.

Abstract: A hybrid voltage rectifier enables a switch mode DC-DC power converter to safely power an external dynamic load by way of a substantially lossless conductive coupling between an output filter of the converter and the load. The rectifier is controlled so as to permit net average current through an inductor of the output filter to be approximately equal to, but not less than, zero by permitting very low loss conduction in the first quadrant and, selectively, cycle by cycle, in the third quadrant during load operation. The converter has a first switch, an output filter, a second switch, and a controller. The output filter is conductively coupled with the first switch, and has an inductor in series with the load. The controller sets state conditions of the second switch, such that the inductor operates in a continuous current mode.

Abstract: An output ripple voltage average amplitude of a switch mode DC-DC converter is dynamically maintained. The converter has a switch and an output filter. By varying a switching period (TPERIOD) of the switch, VRIPPLE is maintained at a substantially constant value over a first range of converter input voltages and a second range of switch duty cycles. Where the output filter includes an inductor having inductance (L) and a capacitor having capacitance (C) the average amplitude of VRIPPLE is dynamically maintained by varying TPERIOD with respect to switch duty cycle (D) and input voltage (VIN) so as to approximately satisfy the following relationship: TPERIOD=(VRIPPLE*8*L*C)0.5/(VIN*(D?D2))0.5.

Abstract: DC-DC converters are described that employ a time-averaged modulated bypass diode to facilitate the efficient harvest of power in photovoltaic systems.

Abstract: Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith.

Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.

Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.

Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.

Abstract: A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.

Abstract: A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.

Abstract: Methods and apparatus are described for aligning a probe card with a wafer probe interface by bringing first kinematic features into contact with second kinematic features, thereby restraining relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.

Abstract: A clamping assembly for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face and a second outer face. The second contacts are arranged on at least one of the first and second outer faces. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. Mechanical alignment features facilitate alignment of the first contacts with the second contacts. The first and second assemblies are configured to enable relative motion therebetween to effect clamping of the first and second inner faces to the first and second outer faces of the circuit board.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

Abstract: A transmission line circuit is described which includes a conductive plane, a plurality of signal traces, and an intermediate layer between the conductive plane and the signal traces. The intermediate layer maintains a substantially constant separation between the conductive plane and the signal traces. At least a portion of the intermediate layer comprises air. The signal traces and the conductive plane form transmission lines.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

Abstract: A transmission line circuit is described which includes a conductive plane, a plurality of signal traces, and an intermediate layer between the conductive plane and the signal traces. The intermediate layer maintains a substantially constant separation between the conductive plane and the signal traces. At least a portion of the intermediate layer comprises air. The signal traces and the conductive plane form transmission lines.

Abstract: An apparatus for providing an electrical connection between a load board and a probe card assembly is described. The load board has a plurality of first contacts and is for interfacing with a test head. The probe card assembly has a plurality of second contacts and is for interfacing with a device-under-test (DUT). A load board assembly is provided for incorporating the load board. The load board assembly has a plurality of guide pins and either a plurality of cam members or a plurality of cam grooves. An electrical interface is provided having a plurality of conductive elements for establishing electrical contact between the first contacts and the second contacts. The electrical interface also has a plurality of apertures for receiving the guide pins thereby aligning the conductive elements with the first contacts. A cap ring is provided having the other of the plurality of cam members and the plurality of cam grooves.