Abstract: A prober tester interface system and a method for loading a probe card into a prober. The interface system includes a stiffener for holding a probe card, the stiffener having an upper surface, a perimeter, an underside, a plurality of recesses in the underside around the perimeter, and first and second alignment holes. A theta ring for holds the stiffener in the prober, the theta ring having first alignment pins for engaging the first alignment holes, a plurality of lock cylinders for engaging the recesses, and a machined lip against which the upper surface of the stiffener is forced by the lock cylinders. A loader is coupled to the prober for loading the stiffener in and unloading the stiffener from the theta ring, the loader having second alignment pins for engaging the second alignment holes. A theta drive assembly is coupled to the theta ring for rotating the theta ring to align the probe card with the test head.

Abstract: A method and apparatus are described for providing electrical connection between a first array of contact points and a second array of contact points via a layer of anisotropically conductive material in contact with the second array of contact points. A membrane is provided having a plurality of apertures therein for receiving the first array of contact points. A plurality of electrical contacts is also provided, each of the electrical contacts being coupled to the membrane and at least partially in registration with one of the plurality of apertures. The electrical contacts are for contacting the first array of contact points through the plurality of apertures. The electrical contacts are also for electrically connecting to the second array of contact points via the layer of anisotropically conductive material. Each of the electrical contacts is operable to move substantially independently of adjacent electrical contacts.

Abstract: A prober tester interface system and a method for loading a probe card into a prober. The interface system includes a stiffener for holding a probe card, the stiffener having an upper surface, a perimeter, an underside, a plurality of recesses in the underside around the perimeter, and first and second alignment holes. A theta ring for holds the stiffener in the prober, the theta ring having first alignment pins for engaging the first alignment holes, a plurality of lock cylinders for engaging the recesses, and a machined lip against which the upper surface of the stiffener is forced by the lock cylinders. A loader is coupled to the prober for loading the stiffener in and unloading the stiffener from the theta ring, the loader having second alignment pins for engaging the second alignment holes. A theta drive assembly is coupled to the theta ring for rotating the theta ring to align the probe card with the test head.

Abstract: A semiconductor wafer probe test interface system (2) and method of operating the system. The wafer probe system includes a plurality of cassettes (302) adapted to hold wafer probe test cards (304). The cassettes are loaded into position for testing of semiconductor wafers with a transport assembly system (6). A memory device (316) on the cassette is used to store data regarding usage of the card such as number of wafer touchdowns. A smart controller (220) has the capability to "talk" to the prober and tester.

Abstract: A prober tester interface system is described which includes a carriage having a plurality of cam followers on its perimeter and a cam ring having a plurality of cam grooves on its interior. Positioning means are detachably coupled to the carriage for positioning the cam followers in the cam grooves. Rotating means are coupled to the cam ring for rotating the cam ring, thereby causing the cam followers to track in the cam grooves and move the carriage in a direction substantially perpendicular to the plane of the cam ring. A method is also described in which a carriage having a probe card disposed therein and a plurality of cam followers on its perimeter is positioned in a cam ring having a plurality of cam grooves located on its interior to engage the cam followers in the cam grooves. The probe card is equipped with a plurality of test pins.

Abstract: A semiconductor wafer probe test interface system (2) and method of operating the system. The wafer probe system includes a plurality of cassettes (302) adapted to hold wafer probe test cards (304). The cassettes are loaded into position for testing of semiconductor wafers with a transport assembly system (6). A memory device (316) on the cassette is used to store data regarding usage of the card such as number of wafer touchdowns. A smart controller (220) has the capability to "talk" to the prober and tester.