Samsung Electronics Patents

Samsung Electronics Co., Ltd. is a Korean electronics manufacturer and a part of the Samsung Group. Samsung Electronics manufactures and sells consumer electronics, including cell phones, televisions, tablets, digital cameras, computers, home appliances and home theater and audio components.

Samsung Electronics Patents by Type
  • Publication number: 20240086336
    Abstract: Disclosed is a method of operating a storage device which communicates with a host device. The method includes allocating a secure region and a user region, storing first data encrypted by using a first encryption key in a first data block of the secure region, receiving a first request indicating a first secure delete operation of the first data from the host device, decrypting at least one valid data of the first data block by using the first encryption key based on the first request, wherein the at least one valid data do not include the first data, encrypting the decrypted at least one valid data by using a second encryption key different from the first encryption key, storing the encrypted at least one valid data in a second data block of the secure region, and deleting the first encryption key.
    Type: Application
    Filed: July 21, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Changhwan KIM, Mingon SHIN, Jisoo KIM
  • Publication number: 20240088176
    Abstract: An image sensor includes a pixel array in which a plurality of pixels are arranged, wherein each of the pixels includes a photodiode, a transfer transistor, first to third floating diffusion nodes, a first capacitor, a second capacitor, a third capacitor, a first switch transistor, a second switch transistor, and a reset transistor. The second switch transistor is configured to turn off in a first period and to turn on in a second period of an exposure period of the photodiode, and the reset transistor is configured to turn on in the first period and to turn off in the second period of the exposure period of the photodiode.
    Type: Application
    Filed: May 18, 2023
    Publication date: March 14, 2024
    Applicant: Samsung electronics Co., Ltd.
    Inventors: Juyeong KIM, Changhyun PARK, Eunsub SHIM
  • Publication number: 20240086342
    Abstract: A semiconductor system including a transmitter configured to output a plurality of data as a plurality of data input/output signals through a plurality of channels based on a matrix E, and a receiver configured to generate the plurality of data by differentially amplifying the plurality of data input/output signals received through the plurality of channels based on a matrix D, in which all components of the matrix E and the matrix D are integers, a product matrix of the matrix D and the matrix E is a diagonal matrix, a sum of the components of each row of the matrix D is 0, and a sum of absolute values of the components of each column of the matrix D is less than or equal to a threshold value.
    Type: Application
    Filed: June 27, 2023
    Publication date: March 14, 2024
    Applicants: Samsung Electronics Co., Ltd., UIF (University Industry Foundation), Yonsei University
    Inventors: HYUN JUN PARK, WOO-SEOK CHOI
  • Publication number: 20240086234
    Abstract: An electronic device includes: a plurality of processing cores and a memory including a plurality of task queues respectively corresponding to the plurality of processing cores and a plurality of task relation tables respectively corresponding to a plurality of tasks. Each of the plurality of task relation tables includes: one or more entries representing a mapping relationship between an identifier of a waker task that wakes up a wakee task, and an occurrence count that is a number of times the wakee task is woken up by the waker task. At least one of the plurality of processing cores is configured to: execute a scheduler, search for a task set includes related tasks, based on the plurality of task relation tables, store a subset of tasks of the task set in at least one of the plurality of task queues, and schedule the task set.
    Type: Application
    Filed: May 12, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jonglae Park, Eunok JO, Bumgyu PARK, Seyeong BYEON, Daeyeong LEE
  • Publication number: 20240086345
    Abstract: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS Co., LTD.
    Inventors: Sang-Hyuk KWON, Nam Sung KIM, Kyomin SOHN, Jaeyoun YOUN
  • Publication number: 20240088256
    Abstract: An electronic device includes a seed layer including a two-dimensional (2D) material, and a ferroelectric layer on the seed layer. The ferroelectric layer is configured to be aligned in a direction in which a (111) crystal direction is perpendicular to a top surface of a substrate on which the seed layer is located and/or a top surface of the seed layer.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jinseong HEO, Yunseong LEE, Taehwan MOON, Sanghyun JO
  • Publication number: 20240086354
    Abstract: A system on chip, semiconductor device, and/or method are provided that include a plurality of masters, an interface, and a semaphore unit. The interface interfaces the plurality of masters with a slave device. The semaphore unit detects requests of the plurality of masters, controlling the salve device, about an access to the interface and assigns a semaphore about each of the plurality of masters by a specific operation unit according to the detection result.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: DongSik CHO, Jeonghoon KIM, Rohitaswa BHATTACHARYA, Jaeshin LEE, Honggi JEONG
  • Publication number: 20240089568
    Abstract: A thermal sensor, a thermal sensor array, an electronic apparatus including the thermal sensor, and an operating method of the thermal sensor are provided. The thermal sensor includes a first region onto which first infrared light is incident, a visible light radiation region configured to radiate visible light generated by incidence of the first infrared light on the first region, a second region onto which second infrared light is incident, and an image sensor configured to receive the visible light radiated from the visible light radiation region. The first region, the second region, and the visible light radiation region each include a nonlinear optical material.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Anton Nikolaevich SOFRONOV, Sergey Nikolaevich KOPTYAEV, Maxim Vladimirovich RYABKO
  • Publication number: 20240085777
    Abstract: Provided is a process proximity effect correction method capable of efficiently improving the dispersion of patterns. There is a process proximity effect correction method according to some embodiments, the process proximity effect correction method of a process proximity effect correction device for performing process proximity effect correction (PPC) of a plurality of patterns using a machine learning module executed by a processor, comprising: training a sensitivity model by inputting a layout image of the plurality of patterns and a layout critical dimension (CD) of the plurality of patterns into the machine learning module; estimating an after cleaning inspection critical dimension (ACI-CD) sensitivity prediction value of the plurality of patterns by inferring an ACI-CD prediction value of the plurality of patterns; and determining a correction rate of the layout CD of the plurality of patterns using the estimated sensitivity prediction value.
    Type: Application
    Filed: May 31, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae Young PARK, Jeong Hoon KO, Seong Ryeol KIM, Young-Gu KIM, Tae Hoon KIM, Hyun Joong KIM, Young Ju LEE
  • Publication number: 20240087983
    Abstract: There is provided a method of manufacturing a semiconductor package, a first redistribution wiring layer including a chip mounting region and a peripheral region surrounding the chip mounting region is formed, and the first redistribution wiring layer has first redistribution wires stacked in at least two layers. A first semiconductor device is mounted on the chip mounting region on the first redistribution wiring layer. A sealing member is formed on the first redistribution wiring layer to cover the first semiconductor device. A plurality of conductive connectors is formed on the peripheral region, and the conductive connectors penetrate the sealing member and are electrically connected to the first redistribution wires. A plurality of through openings extending from an upper surface of the sealing member is formed on the chip mounting region and exposes an upper surface of the first semiconductor device.
    Type: Application
    Filed: May 26, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Daewoong HEO
  • Publication number: 20240086765
    Abstract: Provided are a method for domain adaptation and a system thereof. The method according to some embodiments of the present disclosure may include obtaining a model trained using a labeled dataset of a source domain, wherein the model comprises a feature extractor configured to extract a feature from an input data sample and a predictor configured to predict a label based on the extracted feature, selecting a first data sample from an unlabeled dataset of a target domain, generating a second data sample through data augmentation on the first data sample, calculating a consistency loss between the first data sample and the second data sample by using at least one of the feature extractor or the predictor, and updating the feature extractor based on the consistency loss.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG SDS CO., LTD.
    Inventor: Joon Ho LEE
  • Publication number: 20240088118
    Abstract: A semiconductor package including a first semiconductor chip including a logic structure and a second semiconductor chip bonded to the first semiconductor chip may be provided. The first semiconductor chip may include signal lines on a first surface of a first semiconductor substrate and connected to the logic structure, a power delivery network on a second surface of the first semiconductor substrate, the second surface being opposite to the first surface, and penetration vias penetrating the first semiconductor substrate and connecting the power delivery network to the logic structure. The second semiconductor chip may include a capacitor layer that is on a second semiconductor substrate and is adjacent to the power delivery network.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Manho LEE, Eunseok SONG, Keung Beum KIM, Kyung Suk OH, Eon Soo JANG
  • Publication number: 20240086603
    Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
  • Publication number: 20240087976
    Abstract: Provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a seed metal layer on the second surface of the heat dissipation plate, and a metal thermal interfacial material (TIM) on the seed metal layer.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngdeuk Kim, Mina Choi
  • Publication number: 20240087575
    Abstract: Methods, systems, and apparatuses for enabling indirect interactions between users in an Internet of Things (IoT) environment are provided. A method includes receiving, by a first device, an utterance from a first user, wherein the utterance relates to at least one task that is to be performed by the first user; based on receiving the utterance, identifying, by the first device, one or more second users related to the at least one task; providing, by the first device, an interactable interface to one or more second devices which are located closer to the one or more second users than the first device; receiving, by the first device, one or more inputs corresponding to the at least one task from the one or more second users through the interactable interface; and appending, by the first device, the received one or more inputs to the at least one task.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Boddu Venkata Krishna VINAY, Bhiman Kumar BAGHEL, Gorang MANIAR, Syed Khaja MOINUDDIN, Sudhansu Ranjan ACHARYA
  • Publication number: 20240088082
    Abstract: A semiconductor package, including a substrate extending in first direction and a second direction intersecting the first direction and including a solder resist layer having an open area thereon; a semiconductor chip on the substrate in a third direction, the third direction intersecting the first direction and the second direction, a first surface of the semiconductor chip facing the substrate; and a bump structure in contact with a first connection pad on the open area and a second connection pad on the first surface of the semiconductor chip, and configured to connect the substrate to the semiconductor chip, wherein the open area includes a first area and a second area disposed in a peripheral part of the first area, and wherein a length of the first area in the first direction is greater than a length of the second area in the first direction.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang Ho Cha, Yun-Rae Cho
  • Publication number: 20240088055
    Abstract: A semiconductor package includes a base structure having a fan-in area and fan-out areas surrounding the fan-in area, a semiconductor chip in the fan-in area, a package body layer in the fan-in area and the fan-out areas and covering the semiconductor chip, a redistribution structure on the package body layer, and alignment marks on the redistribution structure in a plan view. Each of the alignment marks includes a plurality of metal layers, and a plurality of auxiliary patterns are in the redistribution structure under the alignment marks to assist in recognition of the alignment marks.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Inhyung SONG, Jaegwon Jang, Yeonho Jang
  • Publication number: 20240090093
    Abstract: A cooking appliance including a door; a key member on the door; a main body; and a latch device on the main body. The latch device includes a first lever, and a second lever that, when the door is being closed, is pressed by the key member to thereby cause the second lever to rotate in a first direction so as to press the first lever and thereby cause the first lever to rotate in the first direction. A spring holding portion is on the first lever. A first end of a spring is attached to the first lever and slidably held by the spring holding portion. A second end of the spring is attached to the body. The spring provides an elastic force to cause the first lever to rotate in a second direction opposite to the first direction when the door is being opened.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Namsoo PARK, Hyungkwen HAM
  • Publication number: 20240087569
    Abstract: A voice command resolution apparatus, including a memory configured to store instructions; and a processor configured to execute the instructions to: recognize a voice command of a user in an input sound, analyze a non-speech sound included in the input sound, and determine at least one target Internet of things (IoT) device related to execution of the voice command, based on an analysis result of the non-speech sound.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ravibhushan B. TAYSHETE, Sourabh TIWARI, Vinay Vasanth PATAGE
  • Publication number: 20240087998
    Abstract: A semiconductor package including a first semiconductor device including a semiconductor chip; an interposer including silicon and electrically connected to the first semiconductor device, wherein the first semiconductor is provided on the interposer; a second semiconductor device; and a substrate, wherein the interposer and the second semiconductor device, are provided on the substrate apart from each other, and wherein the interposer is electrically connected to the second semiconductor device; wherein a first volume of a first shape, in which the first semiconductor device overlaps an upper surface of the substrate, is less than or equal to a second volume of a second shape, in which the interposer overlaps an upper surface of the substrate.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Kilsoo KIM
  • Publication number: 20240087921
    Abstract: A light irradiation apparatus including a stage configured to support a substrate; and a light emitting diode (LED) module spaced apart from the stage, wherein the LED module includes a plurality of LEDs, wherein some of the plurality of LEDs are arranged in a first direction, and wherein others of the plurality of LEDs are provided in a second direction, the second direction intersecting the first direction.
    Type: Application
    Filed: April 28, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jaehyuk CHOI
  • Publication number: 20240088003
    Abstract: A semiconductor package includes a film substrate; a plurality of wires on an upper surface of the film substrate; an upper insulating film covering the plurality of wires on the upper surface of the film substrate and defining a plurality of pad openings and a mounting region opening such that, the plurality of pad openings expose at least a portion of an outer lead bonding portion of the plurality of wires along at least one of the first side surface or the second side surface and the mounting region opening exposes at least a portion of an inner lead bonding portion of the plurality of wiring; a semiconductor chip bonded to and electrically connected to the exposed inner lead bonding portion, and at least one support pattern on a lower surface of the film substrate and extending in the first direction to overlap with the plurality of pad openings.
    Type: Application
    Filed: May 17, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Narae SHIN, Youngbae KIM, Youngjun YOON, Jeongkyu HA
  • Publication number: 20240087358
    Abstract: A processor-implemented method includes generating a preprocessed infrared (IR) image by performing first preprocessing based on an IR image including an object; generating a preprocessed depth image by performing second preprocessing based on a depth image including the object; and determining whether the object is a genuine object based on the preprocessed IR image and the preprocessed depth image
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngjun KWAK, Minsu KO, Youngsung KIM, Heewon KIM, Ju Hwan SONG, Byung In YOO, Seon Min RHEE, Yong-il LEE, Jiho CHOI, Seungju HAN
  • Publication number: 20240088774
    Abstract: An apparatus configured to measure a load current provided to a load of a switching converter includes a pulse generation circuit configured to generate a control pulse based on a power switch driving signal of the switching converter, a reference current generation circuit configured to generate a reference current based on the control pulse, a clock generation circuit configured to generate a clock signal based on the control pulse and the reference current, and a clock counter configured to count the number of cycles of the clock signal during a switching period of the switching converter. The reference current generation circuit is configured to adjust the reference current to compensate for a leakage current generated in the clock generation circuit during the switching period.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Sang PARK, Dongjin KEUM, Byoungmook KIM
  • Publication number: 20240088203
    Abstract: Provided is a semiconductor device including a lower electrode, an upper electrode isolated from direct contact with the lower electrode, and a dielectric layer between the lower electrode and the upper electrode, the dielectric layer comprising a first metal oxide area, a second metal oxide area, and a third metal oxide area. The third metal oxide area is between the first metal oxide area and the second metal oxide area, and includes boron and one or more metal elements selected from aluminum (Al), magnesium (Mg), silicon (Si), or beryllium (Be). In the third metal oxide area, a content of boron (B) is less than or equal to a content of the metal elements of Al, Mg, Si, and/or Be.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeonggyu SONG, Younsoo KIM, Jooho LEE, Narae HAN
  • Publication number: 20240088006
    Abstract: Provided is a semiconductor package including a substrate including a first surface and a second surface opposite to the first surface, a connecting circuit arranged on the first surface of the substrate, a through silicon via (TSV) structure penetrating the substrate, a first passivation layer arranged on the connecting circuit, a second passivation layer arranged on the second surface, a first bumping pad arranged inside the first passivation layer, and a second bumping pad arranged inside the second passivation layer, wherein the first bumping pad includes a first pad plug, and a first seed layer surrounding a lower surface and sidewalls of the first pad plug, wherein the second bumping pad includes a second pad plug, and a second seed layer surrounding an upper surface and sidewalls of the second pad plug, and wherein the first seed layer and the second seed layer include materials having different reactivities to water.
    Type: Application
    Filed: May 15, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sangcheon PARK, Dongwoo KANG, Unbyoung KANG, Soohwan LEE, Hyunchul JUNG, Youngkun JEE
  • Publication number: 20240087537
    Abstract: A display device including a light emitting diode, a driving transistor, a second transistor, a third transistor, a fourth transistor, and a current blocking transistor. The current blocking transistor is a transistor of a different type from the driving transistor, and in case that a voltage of a gate electrode of the driving transistor is maintained at an initialization voltage, the current blocking transistor is turned off during a light emitting period to not transmit the light emitting current outputted by the driving transistor to an anode of the light emitting diode.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Seung-Kyu LEE, YONGSIK HWANG
  • Publication number: 20240089486
    Abstract: Disclosed are an apparatus and method with video processing. A computing apparatus includes one or more processors and storage storing instructions configured to, when executed by the one or more processors, cause the one or more processors to: generate cluster maps using clusters generated by performing clustering, wherein the generating the cluster maps performed based on a reference frame of a video generated based on a previous point in time of the video, generate a predicted frame by performing motion compensation based on the cluster maps, and generate a decoded frame by performing decoding based on the current frame and the predicted frame.
    Type: Application
    Filed: January 5, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungeon KIM, Wonhee LEE
  • Publication number: 20240088163
    Abstract: A display device includes a pixel component including scan lines, data lines, and pixels electrically connected to the scan lines and the data lines, and defining pixel columns and pixel rows, a data driver disposed on a side of the pixel component, and a scan driver disposed on the side of the pixel component. The pixel component includes sub-scan lines, and dummy lines. Each scan line may be electrically connected to the sub-scan lines by contacts. The contacts are divided into contact groups having a same arrangement. The pixel component is divided into pixel blocks corresponding to the contact groups. Each pixel block includes first and second area divided by contact group. The first area is closer to the scan driver than the second area. The pixel component further includes supplementary power lines spaced apart from the respective sub-scan lines.
    Type: Application
    Filed: April 3, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Do Yeong PARK, Kyung Bae KIM, Jong Woong CHANG
  • Publication number: 20240089462
    Abstract: An operating method of a storage device, includes: receiving decoded data from a codec; determining whether the decoded data includes a region of interest (ROI); based on determining the ROI is included in the decoded data, determining whether the decoded data includes a first background region, other than the ROI, identical to a second background region of an adjacent frame; based on determining the first background region is identical to the second background region, determining a similarity for the ROI between the decoded data and the adjacent frame; determining whether the similarity is lower than a reference value; and based on determining the similarity is lower than the reference value, generating detection information indicating that the decoded data is faked.
    Type: Application
    Filed: May 18, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyunjoon Yoo, Minho Kim, Dongouk Moon, Sooyoung Ji, Sanghwa Jin
  • Publication number: 20240087658
    Abstract: Disclosed is a storage device which includes a first word line connected with memory cells being in a program state, a second word line connected with memory cells being an erase state, and a free word line between the first and second word lines and connected with memory cells being the erase state. Whether a block continuous-write is possible with respect to the memory cells connected with the second word line is determined by verifying the erase state of the memory cells connected with the free word line during one busy signal period. According to the present disclosure, because whether a block continuous-write is possible is determined with respect to a plurality of free pages during one busy signal period, a time taken to perform the block continuous-write operation may decrease.
    Type: Application
    Filed: April 21, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Kuihan KO, Sang-Won Park
  • Publication number: 20240088788
    Abstract: A switching regulator is provided. The switching regulator comprises a switching controller configured to activate a switching conversion operation based on an enable signal, a gate driver configured to generate first and second gate signals under control of the switching controller and a switching circuit configured to convert an input voltage applied to an input voltage node to a output voltage. The switching circuit includes a P-type transistor connected between the input voltage node and a switching node and gated based on the first gate signal, an N-type transistor connected between the switching node and a power ground terminal and gated based on the second gate signal and an inductor connected between the switching node and an output node and configured to output the output voltage.
    Type: Application
    Filed: June 9, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyun Seok NAM, Jeong Woon KONG
  • Publication number: 20240087991
    Abstract: A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
    Type: Application
    Filed: June 30, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae Hyun LIM, Sung Woo PARK, Hyun Jong MOON, Kwang Jin LEE
  • Publication number: 20240088039
    Abstract: A semiconductor device includes a substrate having an active region, a first group of standard cells arranged in a first row on the active region of the substrate and having a first height defined in a column direction, a second group of standard cells arranged in a second row on the active region of the substrate, and having a second height, and a plurality of power lines extending in a row direction and respectively extending along boundaries of the first and the second groups of standard cells. The first and second groups of standard cells each further include a plurality of wiring lines extending in the row direction and arranged in the column direction, and at least some of wiring lines in at least one standard cell of the first and second groups of standard cells are arranged at different spacings and/or pitches.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jungho DO, Sanghoon BAEK
  • Publication number: 20240088329
    Abstract: A display module includes a thin film transistor (TFT) substrate including a glass substrate, a TFT layer provided at a front surface of the glass substrate and comprising a TFT electrode pad, and a driving circuit provided at a rear surface of the glass substrate and configured to drive the TFT layer, at least one light-emitting diode (LED) comprising at least one LED electrode pad, and a junction structure provided between the at least one LED electrode pad and the TFT electrode pad. The junction structure is formed in a metallically bonded state.
    Type: Application
    Filed: September 9, 2022
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunhye KIM, Sangmoo Park, Dongyeob Lee, Yoonsuk Lee
  • Publication number: 20240088075
    Abstract: A semiconductor package includes a sequential stack of first and second semiconductor chips, and a first internal connection member that connects the first and second semiconductor chips to each other. The first semiconductor chip includes a first substrate that has a first top surface and a first bottom surface that are opposite to each other, and a first conductive pad on the first top surface. The second semiconductor chip includes a second substrate that has a second top surface and a second bottom surface that are opposite to each other, and a second conductive bump on the second bottom surface. The first internal connection member connects the first conductive pad to the second conductive bump. The first conductive pad has a first width in one direction. The second conductive bump has a second width in the one direction. The first width is smaller than the second width.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sunkyoung SEO, Teak Hoon LEE, Chajea JO
  • Patent number: 11927640
    Abstract: An electronic device according to various embodiments of the present invention includes: a memory which stores one or more mapping parameters that indicate the correlation between a voltage change amount and the state of health (SOH) of the battery; and a processor, wherein the processor can be set to: detect that an external device for charging the battery is connected to the electronic device; charge the battery by using a charging current supplied from the external device; decide on at least one mapping parameter among the one or more mapping parameters on the basis of at least the charging current; check the voltage change amount of the battery while the battery is being charged; and acquire the SOH of the battery at least partially on the basis of the at least one mapping parameter and the voltage change amount.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: March 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seongho Han, Bookeun Oh, Gilho Kim, Junyoung Oh, Sungun Wi, Jaeyeon Lee
  • Patent number: 11927987
    Abstract: A display device includes a window, a display module, a protection film, a circuit board, a first area adhesive member, and a second area adhesive member. The window includes a first area providing a front surface and a second area bent from the first area to provide a side surface. The display module includes a first portion coupled to the window and a second portion extending from the first portion. The protection film includes a first film portion corresponding to the first portion and a second film portion corresponding to the second portion, and is disposed below the display module. The first area adhesive member couples the first portion and the first film portion. The second area adhesive member couples the second portion and the second film portion, and has an elastic modulus greater than that of the first area adhesive member. The circuit board is coupled to the second portion.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sun Hee Lee, Sunho Kim, Hyun Kim
  • Patent number: 11928256
    Abstract: An electronic device includes a sensor; a memory storing instructions; and a processor configured to execute the instructions to: estimate a field of view (FOV) of a user by using another sensor included in a wireless earphone; estimate a FOV of the electronic device by using the sensor; compare the estimated FOV of the user with the estimated FOV of the electronic device; determine whether the user gazes at a screen of the electronic device based on the comparison result; recognize a gaze of the user based on determining that the user gazes at the screen of the electronic device; and perform a specified function based on the gaze of the user.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Namjoon Park, Jinik Kim
  • Patent number: 11927726
    Abstract: According to certain embodiments, an electronic device comprises a window member; a display panel stacked on a rear surface of the window member; a lens assembly; an iris; and an image sensor including an image plane configured to form an electronic signal representing an image formed by the lens assembly, wherein the iris is fixed with respect to the image plane, wherein at least a portion of the iris is located on a same plane as at least a portion of the display panel, and the iris is located closer to an object-side than an object-side surface of a lens closest to the object-side of the lens assembly on an optical axis.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: March 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungpa Seo, Hokeun Kwak, Seungyong Kim, Sungwook Choi
  • Patent number: 11927879
    Abstract: A method includes forming a first photomask including N mask chip regions and a first mask scribe lane region surrounding each of the N mask chip regions, forming a second photomask including M mask chip regions and a second mask scribe lane region surrounding each of the M mask chip regions, performing a first semiconductor process including a first photolithography process using the first photomask on a semiconductor wafer; and performing a second semiconductor process including a second photolithography process using the second photomask on the semiconductor wafer. The first photolithography process is an extreme ultraviolet (EUV) photolithography process, the first photomask is an EUV photomask, N is a natural number of 2 or more, and M is two times N.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moosong Lee, Seung Yoon Lee, Jeongjin Lee
  • Patent number: 11927828
    Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens having a convex image-side surface, a sixth lens, and a seventh lens disposed in order from an object side, and a distance from the image-side surface of the fifth lens to an object-side surface of the sixth lens is shorter than a distance from an image-side surface of the sixth lens to an object-side surface of the seventh lens.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: March 12, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Kyu Min Chae
  • Patent number: 11927890
    Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Heo, Cha Won Koh, Sang Joon Hong, Hyun Woo Kim, Kyung-Won Kang, Dong-Wook Kim, Kyung Won Seo, Young Il Jang, Yong Suk Choi
  • Patent number: 11927756
    Abstract: A head-mounted display (HMD) device is provided. The HMD device includes a transparent member, a display, at least one sensor, and at least one processor functionally connected to the display and the at least one sensor. The at least one processor is configured to obtain information on a surrounding environment of the HMD device via the at least one sensor, set a focus space generated based on a designated location, determine at least one first object positioned inside the focus space and at least one second object positioned outside the focus space, based on the information on the surrounding environment and the focus space, and display, via the display, a virtual image in an area of the transparent member, wherein the at least one second object is seen in the area.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: March 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eunsu Jeong, Ilgeun Bok, Chulsang Chang
  • Patent number: 11926954
    Abstract: A clothes dryer including a device and space for fixing a dryer sheet inside a main body. The clothes dryer includes: a main body including a laundry inlet: a drum rotatably installed inside the main body; a discharge flow path configured to discharge inside air of the drum to outside of the drum; and a sheet receiver accommodating a dryer sheet for providing fragrance to inside of the drum, the sheet receiver positioned on the discharge flow path and detachably installed in the main body.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seulgi Lee, Youngsu Lee
  • Patent number: 11927670
    Abstract: A light detection and ranging (LiDAR) apparatus capable of extracting speed information and distance information of objects in front thereof is provided. The LiDAR apparatus includes: a continuous wave light source configured to generate continuous wave light; a beam steering device configured to emit the continuous wave light to an object for a first time and stop emitting the continuous wave light to the object for a second time; a receiver configured to receive the continuous wave light that is reflected from the object to form a reception signal; and a signal processor configured to obtain distance information and speed information about the object based on the reception signal.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongjae Shin, Hyunil Byun, Changgyun Shin, Bongyong Jang
  • Patent number: 11927829
    Abstract: An optical imaging system includes first through seventh lenses. The first lens includes positive refractive power, the second lens includes a positive refractive power, the third lens includes a negative refractive power, an object-side surface thereof being convex, the fourth lens includes a positive refractive power, the fifth lens includes a negative refractive power, the sixth lens includes a negative refractive power, and the seventh lens includes a negative refractive power and having an inflection point formed on an image-side surface thereof. The first to seventh lenses are sequentially disposed from an object side toward an imaging plane.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 12, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Il Yong Park
  • Patent number: 11927731
    Abstract: A lens, wherein a first profile in a first direction intersecting an optical axis and a second profile in a second direction intersecting the optical axis are different from each other, and a length of the first profile in the first direction is different from a length of the second profile in the second direction.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 12, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyuk Huh, Yong Joo Jo, Young Suk Kang, Phil Ho Jung
  • Patent number: 11927838
    Abstract: A quantum dot including a core and a shell disposed on the core wherein one of the core and the shell includes a first semiconductor nanocrystal including zinc and sulfur and the other of the core and the shell includes a second semiconductor nanocrystal having a different composition from the first semiconductor nanocrystal, the first semiconductor nanocrystal further includes a metal and a halogen configured to act as a Lewis acid in a halide form, an amount of the metal is greater than or equal to about 10 mole percent (mol %) based on a total number of moles of sulfur, and an amount of the halogen is greater than or equal to about 10 mol % based on a total number of moles of sulfur, a method of producing the same, and a composite and an electronic device including the same.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Gon Kim, Garam Park, Jooyeon Ahn, Shang Hyeun Park, Shin Ae Jun
  • Patent number: D1017631
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heejin Ko, Joosun Moon, Heuijin Kwon, Juhyun Seong