Abstract: In a described example, an apparatus includes: a package substrate for mounting a semiconductor die to a die side surface, the package substrate including leads spaced from one another; and cavities extending into the leads from the die side surface, the cavities having sides and a bottom surface of the lead material, the cavities at locations corresponding to post connect locations on the semiconductor die.

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body that defines a substrate support surface. The substrate support surface may define a plurality of protrusions that extend upward from the substrate support surface. A density of the plurality of protrusions within an outer region of the substrate support surface may be greater than in an inner region of the substrate support surface. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include an electrode embedded within the electrostatic chuck body.

Abstract: A method for decoding a video according to the present invention may comprise: deriving a spatial merge candidate for a current block from at least one of a first spatial neighboring block adjacent to the current block or a second spatial neighboring block adjacent to the first spatial neighboring block, generating a merge candidate list including the spatial merge candidate, and performing a motion compensation for the current block by using the merge candidate list.

Abstract: A method for manufacturing a projection screen and a projection screen are provided. The method includes: preparing a substrate; under a first preparation condition, forming a reflective layer by vacuum plating above the substrate; and under a second preparation condition, forming a diffusion layer by the vacuum plating on the reflective layer. The second preparation condition is different from the first preparation condition, and a sputtering power in the second preparation condition is higher than a sputtering power in the first preparation condition.

Abstract: A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.

Abstract: Provided is an encoder which includes circuitry and memory. Using the memory, the circuitry splits an image block into a plurality of partitions, obtains a prediction image for a partition, and encodes the image block using the prediction image. When the partition is not a non-rectangular partition, the circuitry obtains (i) a first prediction image for the partition, (ii) a gradient image for the first prediction image, and (iii) a second prediction image as the prediction image using the first prediction image and the gradient image. When the partition is a non-rectangular partition, the circuitry obtains the first prediction image as the prediction image without using the gradient image.

Abstract: A silicon integrated circuit. In some embodiments, the silicon integrated circuit includes a first conductive trace, on a top surface of the silicon integrated circuit, a dielectric layer, on the first conductive trace, and a second conductive trace, on the dielectric layer, connected to the first conductive trace through a first via.

Abstract: A light projector and method of aligning the light projector is provided. A light projector steers an outgoing beam of light onto an object, passing light returned from the object through a focusing lens onto an optical detector. The light projector may generate a light pattern or template by rapidly moving the outgoing beam of light along a path on a surface. To place the light pattern/template in a desired location, the light projector may be aligned with an electronic model.

Abstract: A display device includes a substrate including an active area having pixels and a non-active area including a pad region. A pad electrode is disposed in the pad region and includes a first pad electrode and a second pad electrode disposed on the first pad electrode. A first insulating pattern is interposed between the first and second pad electrodes. In a plan view, the first insulating pattern is positioned inside the first pad electrode, and a portion of the second pad electrode overlapping the first insulating pattern protrudes further from the substrate in a thickness direction than a portion of the second pad electrode not overlapping the first insulating pattern. The second pad electrode directly contacts a portion of the upper surface of the first pad electrode. In a plan view, an area of the second pad electrode is greater than an area of the first pad electrode.

Abstract: Techniques are disclosed for facilitating interconnecting semiconductor devices. In one example, a method of interconnecting a first substrate to a second substrate is provided. The method includes forming a first plurality of contacts on the first substrate. The method further includes forming an insulative layer on the first substrate. The method further includes forming a second plurality of contacts on the second substrate. The method further includes joining the first plurality of contacts to the second plurality of contacts to form interconnects between the first substrate and the second substrate. When the first and second substrates are joined, at least a portion of each of the interconnects is surrounded by the insulative layer. Related systems and devices are also provided.

Abstract: Provided is an encoder which includes circuitry and memory. Using the memory, the circuitry splits an image block into a plurality of partitions, obtains a prediction image for a partition, and encodes the image block using the prediction image. When the partition is not a non-rectangular partition, the circuitry obtains (i) a first prediction image for the partition, (ii) a gradient image for the first prediction image, and (iii) a second prediction image as the prediction image using the first prediction image and the gradient image. When the partition is a non-rectangular partition, the circuitry obtains the first prediction image as the prediction image without using the gradient image.

Abstract: There is provided an optical distance measurement system including an image sensor and a processing unit. The processing unit is configured to generate an image to be calculated according to at least one image captured by the image sensor, wherein different image regions of the image to be calculated correspond to different exposure times thereby improving the accuracy of the distance calculation.

Abstract: An optical engine module and a projection device are provided. The optical engine module includes a light source unit, a first diffusion element, a polarizing beam splitting element, a second diffusion element, and a light valve. The light source unit emits a light beam. The first diffusion element is disposed on a transmission path of the light beam. The polarizing beam splitting element is disposed on the transmission path of the light beam. The first diffusion element is disposed between the polarizing beam splitting element and the light source unit. The second diffusion element has at least one optical surface to reflect and diffuse the light beam. The light beam forms an illumination beam after passing through the second diffusion element, and the illumination beam has an optical image matching angle. The light valve is disposed on a transmission path of the illumination beam. The light valve converts the illumination beam to an image beam.

Abstract: A mask plate, a method for manufacturing a mask plate, and a method for manufacturing an organic light-emitting device are disclosed. The mask plate includes a substrate and a first opening portion and a second opening portion formed on the substrate. The first opening portion includes a first edge and a second edge, an extending line of the first edge and an extending line of the second edge intersect at a first vertex to form a first corner, the second opening portion is at the first corner and protrudes outward, and an edge of the second opening portion intersects with the first edge and the second edge. The first opening portion and the second opening portion are used for evaporation on a display area of an organic light-emitting device, and the second opening portion is used to compensate for a corner of the display area during evaporation.

Abstract: A display apparatus with a detection device comprising: a substrate having a first principal surface and a second principal surface opposite to the first principal surface; a plurality of inorganic light-emitting elements provided on the first principal surface in a display region of the substrate; a first electrode facing the first principal surface of the substrate with the inorganic light-emitting elements interposed between the first electrode and the first principal surface; a first planarizing layer provided between the substrate and the first electrode and covering at least a side surface of the inorganic light-emitting elements; and a second electrode facing the second principal surface of the substrate and configured to output a signal corresponding to a change in distance between the second electrode and the first electrode.

Abstract: Provided is an encoder which includes circuitry and memory. Using the memory, the circuitry splits an image block into a plurality of partitions, obtains a prediction image for a partition, and encodes the image block using the prediction image. When the partition is not a non-rectangular partition, the circuitry obtains (i) a first prediction image for the partition, (ii) a gradient image for the first prediction image, and (iii) a second prediction image as the prediction image using the first prediction image and the gradient image. When the partition is a non-rectangular partition, the circuitry obtains the first prediction image as the prediction image without using the gradient image.

Abstract: The present disclosure provides methods and devices of processing a block according to a merge candidate list, the method comprising: constructing a first list according to motion information of neighboring blocks of a current block; obtaining prediction information of the current block; when the prediction information of the current block indicates that a sub-block prediction is applied to the current block, obtaining a uni-prediction candidate for the current block according to the first list; using, the uni-prediction candidate for the current block to perform inter prediction of the current block. According to embodiment of the present disclosure, the regular merge list can be directly used and there is no need to explicitly generate the uni-prediction merge candidate list for sub-block prediction.

Abstract: The present invention relates to an intra-prediction method and to an encoder and decoder using same. The intra-prediction method according to one embodiment of the present invention comprises the steps of: deriving a prediction mode of a current block; and generating a prediction block with respect to the current block on the basis of the prediction mode of the current block. When the prediction mode of the current block is an intra-angular prediction mode, values of boundary samples from among left boundary samples and upper boundary samples of the prediction block, which are not positioned in a prediction direction of the intra-angular prediction mode, are derived on the basis of reference samples positioned in the prediction direction of the intra-angular prediction mode, and on the basis of adjacent reference samples.

Abstract: The present application relates to a compound represented by Chemical Formula 1, an organic optoelectronic diode and a display device.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductive bump, a conductive cap over the conductive bump, and a passivation layer. The conductive pad is over the semiconductor substrate. The conductive bump is over the conductive pad, wherein the conductive bump has a stepped sidewall structure including a lower sidewall, an upper sidewall laterally offset from the lower sidewall, and an intermediary surface laterally extending from a bottom edge of the upper sidewall to a top edge of the lower sidewall. The conductive cap is over the conductive bump. The passivation layer is over the semiconductor substrate and laterally surrounds the conductive bump, wherein the passivation layer has a top surface higher than the intermediary surface of the stepped sidewall structure of the conductive bump and lower than a top surface of conductive cap.