Patents Examined by A. A. Owens
  • Systems for image projection
    Patent number: 11899349
    Abstract: An apparatus for image projection is disclosed herein. In some embodiments, an apparatus may include an image projection device, a sealed housing, and a cooling system. A sealed housing may be configured to protect an image projection device from a foreign element. A sealed housing may include an image output window. A cooling system may include a cooling pad and a coolant reservoir. A cooling system may be configured to modulate the temperature of the image projection device.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: February 13, 2024
    Inventors: Christopher Clinton Chappell, McNamara Marlow Pope, III, Rodney Daniel Sparks
  • Solar reflecting film and preparation method thereof
    Patent number: 11899227
    Abstract: The present disclosure provides a solar reflecting film and a preparation method thereof. The solar reflecting film includes a substrate and a functional layer stacked on each other. The functional layer includes a first reflecting layer, a barrier layer, and a second reflecting layer stacked on the substrate in order. The barrier layer includes a first barrier layer and a second barrier layer stacked on the first barrier layer. The first barrier layer is metal fluoride, inorganic non-metallic oxide, metal oxide or a combination thereof. The second barrier layer is metal oxides, metal nitrides, semiconductor doped compounds or a combination thereof. And a material of the first barrier layer is at least partially different from that of the second barrier layer.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: February 13, 2024
    Assignees: NINGBO RADI-COOL ADVANCED ENERGY TECHNOLOGIES CO., LTD., NINGBO RUILING ADVANCED ENERGY MATERIALS INSTITUTE CO., LTD.
    Inventors: Ronggui Yang, Shaoyu Xu, Minghui Wang, Huailun Zhai, Yulei Yan, Zhengjie Yin, Jinling Zhao
  • Horizontal shaft electric powerhead
    Patent number: 11901794
    Abstract: A horizontal shaft electric powerhead includes an electric motor, a battery, a housing, and a base plate. The electric motor includes a horizontal output shaft configured to rotate about a horizontal axis of rotation and has a power rating of 2,500 or fewer watts. The battery includes a plurality of lithium-ion battery cells and is coupled to the electric motor. The housing has a standard cross-sectional footprint so that the electric powerhead has substantially the same volume as a comparable small internal combustion engine. The base plate is configured to be fastened to a mounting surface and includes a plurality of openings arranged in a standard horizontal shaft engine support pattern.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: February 13, 2024
    Assignee: Briggs & Stratton, LLC
    Inventor: David Schulenberg
  • Show effect system for attraction system
    Patent number: 11899348
    Abstract: An attraction system of an amusement park includes a viewing area, a virtual area, a beam splitter positioned to enable visibility of a portion of the viewing area through the beam splitter and visibility of a portion of the virtual area via reflection off the beam splitter, and a controller. The controller is configured to generate image data based on a distortive parameter associated with a first element disposed in the viewing area and transmit the image data to cause display of a second element in the virtual area. The distortive parameter is indicative of a distortion of an appearance of an object visible through the first element.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: February 13, 2024
    Assignee: Universal City Studios LLC
    Inventor: Akiva Meir Krauthamer
  • Semiconductor device having a resin that seals a rewiring
    Patent number: 11894325
    Abstract: A semiconductor device includes a semiconductor layer that has a main surface, an electrode pad that is formed on the main surface, a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad, and a resin that covers the second wiring surface on the main surface and that seals the rewiring.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: February 6, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Manato Kurata
  • Chip package structure, chip structure and method for forming chip structure
    Patent number: 11894331
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect layer over the substrate. The chip structure includes a conductive pad over the interconnect layer. The chip structure includes a conductive bump over the conductive pad. The conductive bump has a first portion, a second portion, and a neck portion between the first portion and the second portion. The first portion is between the neck portion and the conductive pad. The neck portion is narrower than the first portion and narrower than the second portion.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Cheng Chen, Pei-Haw Tsao
  • Light source module
    Patent number: 11892158
    Abstract: A light source device includes first and second laser light sources, a wavelength conversion unit, a light condensing module, a light combining member, and light guiding members. The first laser light source is configured to emit a first light beam along a first axis. The second laser light source is arranged along the second axis with the first laser light source and configured to emit a second light beam along the first axis. The wavelength conversion unit is configured to convert the second light beam into a color light. The condensing module is configured to condense the color light. The light combining member is configured to receive the first light beam and the color light. The light guiding members are configured to guide at least one of the first light beam and the color light.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: February 6, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chih-Hao Lin
  • Light beam emission device and light beam projection device equipped therewith
    Patent number: 11895442
    Abstract: Provided is a light beam emission device and a light beam projection device, that are downsizable, have a simple configuration, and simplify complicated processing of video signals, such as the timing adjustment of video output signals, without generating color irregularity. The devices include: a plurality of light sources; and a condensing member. A range in the light source array direction, in which emission spots of the light beams emitted from the plurality of light sources respectively exist, is within a size in the array direction of a light beam, immediately after the light beam emitted from an emission spot located most closely to the center of the plurality of light sources, with respect to the condensing member, passed through the condensing member.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: February 6, 2024
    Assignee: UNIVERSITY OF FUKUI
    Inventors: Toshio Katsuyama, Shoji Yamada, Akira Nakao
  • Solder joint
    Patent number: 11890702
    Abstract: The present invention provides a highly reliable solder joint, the solder joint including a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a Ni—P—Cu plating layer on a surface in contact with the solder joint layer, wherein the Ni—P—Cu plating layer contains Ni as a main component and contains 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, the Ni—P—Cu plating layer has a microcrystalline layer at an interface with the solder joint layer, and the microcrystalline layer includes a phase containing microcrystals of a NiCuP ternary alloy, a phase containing microcrystals of (Ni,Cu)3P, and a phase containing microcrystals of Ni3P.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 6, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hirohiko Watanabe, Shunsuke Saito, Takeshi Yokoyama
  • Encoder, decoder, encoding method, and decoding method
    Patent number: 11895298
    Abstract: Provided is an encoder which includes circuitry and memory. Using the memory, the circuitry splits an image block into a plurality of partitions, obtains a prediction image for a partition, and encodes the image block using the prediction image. When the partition is not a non-rectangular partition, the circuitry obtains (i) a first prediction image for the partition, (ii) a gradient image for the first prediction image, and (iii) a second prediction image as the prediction image using the first prediction image and the gradient image. When the partition is a non-rectangular partition, the circuitry obtains the first prediction image as the prediction image without using the gradient image.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 6, 2024
    Assignee: Panasonic Intellectual Property Corporation of America
    Inventors: Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Ryuichi Kanoh, Chong Soon Lim, Ru Ling Liao, Hai Wei Sun, Sughosh Pavan Shashidhar, Han Boon Teo, Jing Ya Li
  • Semiconductor device and manufacturing method thereof
    Patent number: 11894358
    Abstract: In a semiconductor device, a substrate has a main surface. A first semiconductor chip has a first front surface and a first back surface, and is mounted on the main surface via a plurality of bump electrodes. A first spacer has a second front surface and a second back surface that is mounted on the main surface. A height of the second front surface from the main surface is within a range between a highest height and a lowest height of the first back surface from the main surface. A second spacer has a third front surface and a third back surface that is mounted on the main surface. A height of the third front surface from the main surface is within the range between the highest height and the lowest height of the first back surface from the main surface.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: February 6, 2024
    Assignee: KIOXIA CORPORATION
    Inventor: Masayuki Miura
  • Temperature hierarchy solder bonding
    Patent number: 11887956
    Abstract: A semiconductor device and formation thereof. The semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a plurality of pillars interconnecting the first semiconductor structure and the second semiconductor structure. The plurality of pillars include a first solder layer and a second solder layer, wherein the first solder layer has a higher melting point than the second solder layer.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: January 30, 2024
    Assignee: International Business Machines Corporation
    Inventors: Katsuyuki Sakuma, Mukta Ghate Farooq
  • Coplanar bump contacts of differing sizes
    Patent number: 11887958
    Abstract: A die including a first contact with a first shape (e.g., ring-shaped) and a second contact with a second shape (e.g., cylindrical shaped) different from the first shape. The first contact has an opening that extends through a central region of a surface of the first contact. A first solder portion is coupled to the surface of the first contact and the first solder portion has the first shape. A second solder portion is coupled to a surface of the second contact and the second solder portion has the second shape. The first solder portion and the second solder portion both have respective points furthest away from a substrate of the die. These respective points of the first solder portion and the second solder portion are co-planar with each other such that a standoff height of the die remains consistent when coupled to a PCB or an electronic component.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: January 30, 2024
    Assignee: STMICROELECTRONICS LTD
    Inventor: Cheng-Yang Su
  • Encoder, decoder, encoding method, and decoding method
    Patent number: 11889076
    Abstract: Provided is an encoder which includes circuitry and memory. The circuitry encodes an image block using the memory. In encoding the image block, the circuitry: obtains one or more size parameters related to a size of the image block; determines whether the one or more size parameters and one or more thresholds satisfy a determined relationship; encodes a split parameter when the one or more size parameters and the one or more thresholds are determined to satisfy the determined relationship, the split parameter indicating whether the image block is to be split into a plurality of partitions including a non-rectangular partition; and encodes the image block after splitting the image block into the plurality of partitions when the split parameter indicates that the image block is to be split into the plurality of partitions.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: January 30, 2024
    Assignee: Panasonic Intellectual Property Corporation of America
    Inventors: Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Ryuichi Kanoh, Chong Soon Lim, Ru Ling Liao, Hai Wei Sun, Sughosh Pavan Shashidhar, Han Boon Teo, Jing Ya Li
  • Light source system
    Patent number: 11886104
    Abstract: A light source system includes a first light emitter configured to emit a first light with a first color band in a first time interval of a time period, a second light emitter configured to emit a second light with a second color band in a second time interval of the time period rather than in the rest of the time period other than the second time interval, and a light guide disposed downstream from the first light emitter and the second light emitter. The first time interval and the second time interval overlap in an overlapping time interval. The first light emitter and the second light emitter synchronously emit the first light and the second light in the overlapping time interval to form a combined light beam in the light guide. The light with the second color band is dominant of the combined light beam.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: January 30, 2024
    Assignee: Qisda Corporation
    Inventors: Peng Lee, Tsung-Hsun Wu, Ching-Tze Huang, Jia-Ming Zhang
  • Solid-state imaging device and electronic apparatus
    Patent number: 11887950
    Abstract: A solid-state imaging device to be provided includes a first semiconductor device including a semiconductor layer in which a photoelectric conversion unit that photoelectrically converts incident light and a penetrating via are provided, a first connecting portion and a second connecting portion on the surface side of the semiconductor layer on the side that receives the light, and a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via. The solid-state imaging device further includes a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion. The solid-state imaging device is connected to an external terminal by the second connecting portion.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: January 30, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Takuya Nakamura
  • Rotor, electric motor, air blower, air conditioner, and method for fabricating rotor
    Patent number: 11888368
    Abstract: A rotor includes at least one first permanent magnet and at least one second permanent magnet. The at least one first permanent magnet forms part of an outer peripheral surface of the rotor and is magnetized to have polar anisotropy. The at least one second permanent magnet is adjacent to the at least one first permanent magnet in a circumferential direction of the rotor and has lower magnetic force than magnetic force of the at least one first permanent magnet.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 30, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanori Watanabe, Hiroki Aso
  • Encoder, decoder, encoding method, and decoding method
    Patent number: 11889075
    Abstract: Provided is an encoder which includes circuitry and memory. The circuitry encodes an image block using the memory. In encoding the image block, the circuitry: obtains one or more size parameters related to a size of the image block; determines whether the one or more size parameters and one or more thresholds satisfy a determined relationship; encodes a split parameter when the one or more size parameters and the one or more thresholds are determined to satisfy the determined relationship, the split parameter indicating whether the image block is to be split into a plurality of partitions including a non-rectangular partition; and encodes the image block after splitting the image block into the plurality of partitions when the split parameter indicates that the image block is to be split into the plurality of partitions.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 30, 2024
    Assignee: Panasonic Intellectual Property Corporation of America
    Inventors: Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Ryuichi Kanoh, Chong Soon Lim, Ru Ling Liao, Hai Wei Sun, Sughosh Pavan Shashidhar, Han Boon Teo, Jing Ya Li
  • Encoder, decoder, encoding method, and decoding method
    Patent number: 11882279
    Abstract: Provided is an encoder which includes circuitry and memory. Using the memory, the circuitry splits an image block into a plurality of partitions, obtains a prediction image for a partition, and encodes the image block using the prediction image. When the partition is not a non-rectangular partition, the circuitry obtains (i) a first prediction image for the partition, (ii) a gradient image for the first prediction image, and (iii) a second prediction image as the prediction image using the first prediction image and the gradient image. When the partition is a non-rectangular partition, the circuitry obtains the first prediction image as the prediction image without using the gradient image.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: January 23, 2024
    Assignee: Panasonic Intellectual Property Corporation of America
    Inventors: Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Ryuichi Kanoh, Chong Soon Lim, Ru Ling Liao, Hai Wei Sun, Sughosh Pavan Shashidhar, Han Boon Teo, Jing Ya Li
  • Method and apparatus for image encoding, and method and apparatus for image decoding
    Patent number: 11882246
    Abstract: An image decoding method includes reconstructing a current image by performing deblocking filtering on a boundary of at least one reconstruction block from among reconstruction blocks, wherein the reconstructing of the current image by performing the deblocking filtering on the boundary of the at least one reconstruction block from among the reconstruction blocks includes, when a prediction mode of at least one reconstruction mode from among blocks located on both sides of the boundary of the at least one reconstruction block is a combined inter-intra prediction mode, determining that a value of a boundary filtering strength applied to the boundary of the at least one reconstruction block is a predetermined value and performing deblocking filtering on the boundary of the at least one reconstruction block based on the determined value of the boundary filtering strength.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 23, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minsoo Park, Minwoo Park, Kiho Choi, Seungsoo Jeong