Patents Examined by A. A. Turner
  • Patent number: 11776973
    Abstract: A method of manufacturing a display device, the method including providing a substrate, forming a first electrode, a second electrode spaced from the first electrode and in a same plane as the first electrode, a first alignment line connected to the first electrode, and a second alignment line connected to the second electrode on the substrate, self-aligning the plurality of light emitting elements by providing a solution containing a plurality of light emitting elements on the substrate, removing the first alignment line and the second alignment line from the substrate on which the plurality of light emitting elements are self-aligned, forming a first contact electrode electrically connecting one end of each light emitting element to the first electrode, and forming a second contact electrode electrically connecting an other end of each light emitting element to the second electrode.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: October 3, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Joon Kim, Kyung Bae Kim, Kyung Hoon Chung, Mee Hye Jung
  • Patent number: 11764096
    Abstract: Methods for protecting edges of semiconductor dies are disclosed. Further, the disclosed methods provide for separating the semiconductor dies without using a dicing technique. In one embodiment, a plurality of trenches may be formed on a front side of a substrate including a plurality of semiconductor dies. Individual trenches may correspond to scribe lines of the substrate where each trench includes a depth greater than a final thickness of the semiconductor dies. A dielectric layer may be formed on sidewalls of the trenches, thereby protecting the edges of the semiconductor dies, prior to filling the trenches with an adhesive material. Subsequently, the substrate may be thinned from a back side such that the adhesive material in the trenches may be exposed from the back side. The adhesive material may be removed to singulate individual semiconductor dies of the plurality from the substrate.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: September 19, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Brandon P. Wirz, Andrew M. Bayless
  • Patent number: 11752507
    Abstract: This application relates to an electrostatic precipitator with an electromagnetic wave tube comprising a carbon nanotube (CNT)-based emitter. The electrostatic precipitator includes a charger configured to include the CNT-based emitter and ionize microparticles, in contaminated air introduced from the environment, by emitting an electromagnetic wave. The electrostatic precipitator further includes a collector configured to collect the ionized microparticles to discharge clean air.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: September 12, 2023
    Assignee: AweXome Ray, Inc.
    Inventors: Hong Sue Choi, Jun Young Choi, Se Hoon Gihm
  • Patent number: 11757021
    Abstract: The present disclosure provide a method for using a hard mask layer on a top surface of fin structures to form a fin-top mask layer. The fin-top mask layer can function as an etch stop for subsequent processes. Using the fin-top hard mask layer allows a thinner conformal dielectric layer to be used to protect semiconductor fins during the subsequent process, such as during etching of sacrificial gate electrode layer. Using a thinner conformal dielectric layer can reduce the pitch of fins, particularly for input/output devices.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Ruei Jhan, Kuan-Ting Pan, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Patent number: 11735464
    Abstract: The described method enables removal of any flexible material from a temporary carrier for transfer to another surface. In particular, a semiconductor wafer is commonly held by a temporary adhesive to a carrier substrate for support during a variety of processing steps, including thinning of the semiconductor device layer. Subsequent to processing, the described method attaches the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, followed by transfer to a demount roller, which then releases it onto a desired permanent surface. Utilizing the flexible nature of the ultra-thin device layer, the sequence of rollers is able to peel it from the temporary adhesive without any need for laser release processing or chemical adhesive removal while maintaining the thinned wafer in a planar form during processing. This transfer supports operations that include a change of orientation, such as from face up to face down.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: August 22, 2023
    Assignee: American Semiconductor, Inc.
    Inventors: Douglas R. Hackler, Sr., Randall S. Parker
  • Patent number: 11734626
    Abstract: An embodiment includes extracting a capability from a dataset representative of a project description of a proposed project using a first machine learning process to form a cluster representative of the capability. The embodiment assigns the capability to a first node of a business operations graph based on a classification result of the capability by a second machine learning process. The embodiment generates a visual indicator based, at least in part, on the assigning of the capability to the first node. The embodiment generates the visual indicator by a process comprising generating a first visual indicator of the capability being assigned to the first node, and a second visual indicator of a development sequence for the capability relative to another capability from the project description based at least in part on an association from the business operations graph between the first node and a second node of the graph.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: August 22, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sathya Santhar, Venkatesh Halappa, Gerhardt Jacobus Scriven
  • Patent number: 11731573
    Abstract: A grill guard assembly has a vehicle coupling portion mounted to the vehicle forwardly of the vehicle grill. A hinge couples a coupling portion of a grill guard frame on the vehicle coupling portion to pivot between a working position extending primarily upwardly and a lowered position extending primarily forwardly. A latch assembly has a clamping surface and a clamping jaw supported on opposing ones of the vehicle coupling portion and the grill guard coupling portion. An over-center linkage operatively connects the clamping jaw to the respective coupling portion and the second coupling portion such that the linkage is rotated through an over-center position between open and closed positions of the jaw, whereby the clamping force of the jaw acts to urge the jaw to remain closed.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: August 22, 2023
    Inventors: Meghdad Saediamiri, Randy John Delos Santos, Mohammadreza Farohki
  • Patent number: 11735483
    Abstract: Embodiments of the present disclosure provide a method of forming N-type and P-type source/drain features using one patterned mask and one self-aligned mask to increase windows of error tolerance and provide flexibilities for source/drain features of various shapes and/or volumes. In some embodiments, after forming a first type of source/drain features, a self-aligned mask layer is formed over the first type of source/drain features without using photolithography process, thus, avoid damaging the first type of source/drain features in the patterning process.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: August 22, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yao-Sheng Huang, I-Ming Chang, Huang-Lin Chao
  • Patent number: 11724650
    Abstract: The present disclosure provides a cargo rack for a utility vehicle. The cargo rack comprises a base structure, a front wall structure extending upward from the base structure and having a top edge, a pair of opposing sidewall structures, wherein each sidewall extends upward from the base structure and having a top edge, and a back wall structure extending upward from the base structure and having a top edge. The cargo rack base structure is structured to be disposed within a reservoir of a vehicle front body cowl such that the entirety of the cargo rack base structure is disposed within the cowl reservoir.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: August 15, 2023
    Assignee: TEXTRON INNOVATIONS INC.
    Inventors: Philip Jhant, Nick Moore, Matthew Baekelandt
  • Patent number: 11725836
    Abstract: This publication discloses an electrostatic filter construction, to be positioned in air ducts or ventilation channels, which electrostatic filter construction includes a charging unit, which charges the particles to be filtered into a first electric potential and arranged in the filter construction in the path of the air flow before filter elements, electrically conducting electrodes connected to a second electric potential different to the potential of the charged particles and set substantially parallel to the direction of the airflow, and bag shaped filter elements positioned after the charging unit in the path of the air flow. According to the invention each bag shaped filter element has at least one designated UV-light source and an element of photo catalytic material like TiO2.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: August 15, 2023
    Assignee: Oy Lifa Air Ltd
    Inventors: Janette Mäkipää, Vesa Mäkipää
  • Patent number: 11728173
    Abstract: A method includes forming a semiconductor layer over a substrate; etching a portion of the semiconductor layer to form a first recess and a second recess; forming a first masking layer over the semiconductor layer; performing a first thermal treatment on the first masking layer, the first thermal treatment densifying the first masking layer; etching the first masking layer to expose the first recess; forming a first semiconductor material in the first recess; and removing the first masking layer.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Ju Chen, Chung-Ting Ko, Wan-Chen Hsieh, Chun-Ming Lung, Tai-Chun Huang, Chi On Chui
  • Patent number: 11728223
    Abstract: A semiconductor device and methods of forming the semiconductor device are described herein and are directed towards forming a source/drain contact plug for adjacent finFETs. The source/drain regions of the adjacent finFETs are embedded in an interlayer dielectric and are separated by an isolation region of a cut-metal gate (CMG) structure isolating gate electrodes of the adjacent finFETs The methods include recessing the isolation region, forming a contact plug opening through the interlayer dielectric to expose portions of a contact etch stop layer disposed over the source/drain regions through the contact plug opening, the contact etch stop layer being a different material from the material of the isolation region. Once exposed, the portions of the CESL are removed and a conductive material is formed in the contact plug opening and in contact with the source/drain regions of the adjacent finFETs and in contact with the isolation region.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Ting Chen, Wei-Yang Lee, Feng-Cheng Yang, Yen-Ming Chen
  • Patent number: 11728200
    Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: August 15, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoe Chul Kim, Seok Ho Kim, Tae Yeong Kim, Hoon Joo Na, Hyung Jun Jeon
  • Patent number: 11717006
    Abstract: The method and system for processing meal from oilseeds after oil extraction includes biotransformation of meal and its cascade, sequential refining leading to the separation of the product or products with high added value, and finally obtaining the remaining biomass with an increased nutritional value compared to the original post-extraction meal material.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: August 8, 2023
    Assignee: INVENTIONBIO SP. Z O.O.
    Inventors: Marcin Lukaszewicz, Marek Kulazynski, Anna Krasowska
  • Patent number: 11713081
    Abstract: A vehicle body includes a pair of side truss members extending in a longitudinal direction of a vehicle, a plurality of cross truss members connecting the pair of side truss members to each other in a width direction of the vehicle, a plurality of cross floor truss members coupled to upper ends of the pair of side truss members, extending in a transverse direction of the side truss members, and spaced apart from each other in an anteroposterior direction, and a plurality of side connection truss members extending in the longitudinal direction of the vehicle and connecting ends of the cross floor truss members to each other.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: August 1, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Seok Ju Gim, Tae Gyu Park, Ho Yeon Kim, Sun Hyung Cho, Chul Hee Heo, Ji Ae Yong
  • Patent number: 11715048
    Abstract: A method for computer modeling a retail environment includes: calculating a space elasticity for an item of an item category in a retail store, using a constrained linear regression model; calculating a cross-space elasticity for the item of the item category in the retail store, using a multiple regression model; generating a number for horizontal facings for the item of the item category in the retail store, using a non-linear multiple-constraint mixed integer optimization model, based on the space elasticity of the item and the cross-space elasticity of the item; and generating an electronic planogram of the item category for the retail store, based on the number of the horizontal facings of the item.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 1, 2023
    Assignee: Walmart Apollo, LLC
    Inventors: Somedip Karmakar, Ashish Gupta
  • Patent number: 11712281
    Abstract: Presented are a method and apparatus for evacuation. An exemplary fluid evacuation system includes a surgical apparatus having a fluid conduit therethrough. The system further includes a vacuum tube fluidly coupled with the fluid conduit, and an electrostatic precipitator fluidly coupled with the fluid conduit. Additionally, the system includes a vacuum source fluidly coupled with the vacuum tube, wherein the vacuum source is operable to create a flow of fluid through the fluid conduit, the vacuum tube and the electrostatic precipitator.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: August 1, 2023
    Assignee: Buffalo Filter LLC
    Inventors: Mark C. Szymanski, Michael A. Chimiak, Kyrylo Shvetsov, Gregory Pepe, Samantha Bonano
  • Patent number: 11710667
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method comprises forming a first stack structure and a second stack structure in a first area over a substrate, wherein each of the stack structures includes semiconductor layers separated and stacked up; depositing a first interfacial layer around each of the semiconductor layers of the stack structures; depositing a gate dielectric layer around the first interfacial layer; forming a dipole oxide layer around the gate dielectric layer; removing the dipole oxide layer around the gate dielectric layer of the second stack structure; performing an annealing process to form a dipole gate dielectric layer for the first stack structure and a non-dipole gate dielectric layer for the second stack structure; and depositing a first gate electrode around the dipole gate dielectric layer of the first stack structure and the non-dipole gate dielectric layer of the second stack structure.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: July 25, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Wei Hsu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Hou-Yu Chen, Ching-Wei Tsai, Chih-Hao Wang, Lung-Kun Chu, Mao-Lin Huang, Jia-Ni Yu
  • Patent number: 11700866
    Abstract: The present invention relates to the creation of meat-analogs, including bacon or jerky. The present invention further can relate to the use of hydrocolloid gels or films as structural components of meat analog food products. Hydrocolloid gels or films are used in order to improve the similarity of meat analog food products to whole muscle cuts of meat and seafood, including animal sourced bacon.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 18, 2023
    Assignee: Umaro Foods, Inc.
    Inventors: Beth Alison Zotter, Amanda Stiles
  • Patent number: 11695517
    Abstract: This invention discloses methods to enhance Physical Layer (PHY) processing in a radio access network between a Base Station (BS) and one or more User Equipment (UEs), including enhanced Hybrid Automatic Repeat Request (HARQ) management, transmitting path processing to reduce transfer bandwidth between an offload processor and a CPU, and offload processing to reduce HARQ latency.
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: July 4, 2023
    Assignee: RF DSP Inc
    Inventors: Dengkui Zhu, Jason Brent, Boyu Li, Ping Liang