Abstract: The present document describes a detection circuit to detect a condition of a flying capacitor which is charged during a charging phase and discharged during a subsequent discharging phase. The detection circuit has a timing circuit to set a detection trigger during a charging phase of the flying capacitor, and a measurement circuit to provide one or more differential measurement signals which are dependent on and/or indicative of a voltage across the flying capacitor at the detection trigger. Furthermore, the detection circuit has a comparator circuit to provide a digital output signal based on the one or more differential measurement signals, wherein the digital output signal is indicative of whether or not the flying capacitor is faulty.

Abstract: The present application is applicable to the technical field of terahertz on-wafer measurement, and provides a new on-wafer S-parameter calibration method and device. The method includes: performing two-port calibration on a waveguide end face when a probe is not connected to a test system; performing one-port calibration on each of two probe end faces when the probe is connected to the test system; and fabricating a crosstalk calibration standard equal to a device under test in length on a substrate of the device under test, and correct a crosstalk error of the test system according to the crosstalk calibration standard. The present application can realize accurate characterization and correction of crosstalk error in a high-frequency on-wafer S-parameter calibration process, and improve the accuracy of error correction in high-frequency on-wafer S-parameter measurement.

Abstract: A rotor (2) of a rotation angle sensor is configured by forming a band-shaped main body (31) of a magnetic steel sheet into a cylindrical shape so that a thickness direction of the band-shaped main body (31) is set as a radial direction. First undulations (32) are provided at a substantially constant pitch on one arc-shaped edge portion of the band-shaped main body (31), and second undulations (33) are provided at a substantially constant pitch on the other arc-shaped edge portion. A first stator (3) is disposed to face the first undulations (32) of the band-shaped main body (31) of the rotor (2), and a second stator (4) is disposed to face the second undulations (33).

Abstract: A system for inspection of electrical circuits, which electrical circuits include a multiplicity of conductors which are mutually spaced from each other, the system including a voltage driver operative to apply different electrical voltages to a plurality of conductors from among the multiplicity of conductors, which plurality of conductors are in spatial propinquity to each other, a sensor operative to sense at least one characteristic of a test region defined thereby with respect to the electrical circuits, the sensor lacking sufficient spatial resolution to distinguish between the locations of individual ones of the plurality of conductors and a defect indicator responsive to at least one output of the sensor for ascertaining whether a defect exists in the plurality of conductors.

Abstract: A probe card, a system for manufacturing a semiconductor device, and a method of manufacturing a semiconductor device are provided. A probe card includes a first probe configured to contact a first ground pad of a device under test, a reference resistor including a first terminal and a second terminal and connected to the first probe, and a second probe configured to contact a second ground pad of the device under test, wherein the second probe is further configured to be connected to a ground node for applying a reference potential, and the first terminal of the reference resistor is configured to be connected to the first probe and the second terminal of the reference resistor is configured to receive an input potential.

Abstract: An embodiment in accordance with the present invention provides an improved electrically conductive transmission line that is radio frequency (RF) safe. The present invention does not include any inductive coupling elements. Instead, multiple coils constructed from twisted pairs of wires are used to block the common mode of the received magnetic resonance (MR) signal that can cause heating, while passing the differential mode that is used for tracking and/or imaging. These twisted pair coils are easily manufactured out of a single length of twisted pair wire, but multiple segments could also be used. The twisted pair coils of the present invention are easier to manufacture than the pre-existing inductive coupling element-based transmission lines, and occupy less overall volume inside a medical device. The individual coils of twisted pairs are tuned to the resonant frequency of the MR scanner by the addition of appropriate capacitors.

Abstract: Molybdenum oxide is doped with vanadium, nobidium, tantalum or titanium to form a stable M5O14 theta phase crystal structure as a vapor sensitive material for detecting vapors of volatile organic compounds. That material is used between electrodes connected to a measuring device to measure a change in an electrical quality in the presence of a vapor of a volatile organic compound. Concentration of the vapor is measured to low part per million ranges.

Abstract: Embodiments described herein relate to a method for modifying transmission line characteristics. The method may include: making a first determination of a null frequency of an input signal to a transmission line; performing an analysis to make a second determination of a wavelength of the input signal using, at least in part, the null frequency; making a third determination, based on the analysis, of a half wavelength of the input signal; calculating, based on the half wavelength, a total stub length; and adding a trace to a stub associated with a via, wherein the stub and the trace are a length that is at least a portion of the half wavelength of the input signal.

Abstract: There is provided a testing wafer that simulates heat generation of an inspection target substrate. The testing wafer includes a heater pattern, a plurality of temperature sensors, and first and second electrode pads. The heater pattern is configured to heat the testing wafer having the same shape as a shape of the inspection target substrate. The temperature sensors are configured to respectively measure temperatures of multiple locations on the testing wafer. The first electrode pads are connected to the heater pattern and the second electrode pads are connected to the temperature sensors. The first and second electrode pads are installed to be in contact with probes of a probe card.

Abstract: In response to demands for stably and precisely estimating states, a rechargeable battery state estimation device includes a current detecting unit which detects a charge-discharge current of the rechargeable battery as a detected current; a voltage detecting unit which detects a voltage between terminals of the rechargeable battery as a detected voltage; an OCV estimation method SOC estimation unit which calculates an OCV estimation method state of charge, based on the detected current and the detected voltage; a current integration method parameter estimation unit which estimates a current integration method parameter including a capacity retention rate, based on the detected current and the OCV estimation method state of charge; and a corrected SOC estimation unit which calculates an estimated state of charge, based on the detected current, the OCV estimation method state of charge, and the current integration method parameter.

Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: An electronic assembly includes a board and a system mounted to the board. The system includes an impedance matching circuit coupled to a contactless component. A detection circuit operates to carrying out a process for detecting on the board of potential faults in the system mounted to the board. The detection circuit includes a circuit incorporated into the contactless component itself and configured to carrying out a first part of the process for detecting. A processing circuit of the detection circuit performs a second part of the process for detecting based on results of the first part.

Abstract: A method and system for detecting pin misalignment of ICs when being inserted into IC sockets includes a pressure sensing unit obtaining information as to pin insertion and pressure exerted by the pin and outputting the sensed information. A microprocessor receives the sensed information and obtains a pressure value correspondingly. Any misalignment of the pin is determined according to the pressure value so calculated.

Abstract: The present application relates to apparatus (400, 500) for measuring an impedance of an electrical load (300) that is configured to be coupled to a controlled current source (200). The apparatus (400, 500) comprises a first coupling node (402) configured to be coupled to a first terminal (302) of the load (300) and a second coupling node (404) configured to be coupled to a second terminal (304) of the load (300). The apparatus further comprises a transformer (406) having a primary winding (408) and a secondary winding (410) and a capacitance (412) connected in series between a first terminal (414) of the secondary winding (410) and the first coupling node (402). A second terminal (416) of the secondary winding (410) is connected to the second coupling node (404).

Abstract: A testing system and method for testing integrated circuits with radio frequency (RF) antennas is disclosed. The system includes an alignment plate for receiving a device under test (DUT) having an RF transmitting antenna, an enclosure surrounding but separated from the transmitting antenna, a receiving antenna in a telescopic enclosure, and a conversion circuit connected to the receiving antenna. The conversion circuit is configured to convert an RF output from the DUT to a direct current (DC) voltage. The DC voltage is used as a proxy for the RF output to test the DUT. When testing chips with RF ports, the chip or ports are surrounded by the enclosure which is non-radio reflective and includes antennas for receiving RF outputs disbursed around the enclosure, or a single antenna. If multiple receiving antennas are used, sequential testing can also detect directional transmission patterns to confirm that the direction is correctly calibrated.

Abstract: A testing system includes a load board that includes a first circuit board, a first external connector attached to the first circuit board, and a thermal module configured to hold a system-on-wafer structure including a connector and a socket, a connector structure including a second circuit board, wherein the second circuit board is electrically connected to the first external connector, and a second external connector configured to connect to the connector of the system-on-wafer structure, and a test structure configured to connect to the socket of the system-on-wafer structure, the test structure including a third circuit board and pins, wherein adjacent pairs of pins of the test structure are electrically coupled through the third circuit board to form a continuous conductive path extending alternately between the system-on-wafer structure and the adjacent pairs of pins of the test structure.

Abstract: An integrated microfabricated sensor includes a sensor cell having a cell body, a first window attached to the cell body, and a second window attached to the cell body. The cell body laterally surrounds a cavity, so that both windows are exposed to the cavity. The sensor cell contains a sensor fluid material in the cavity. The cavity has concave profiles at cell body walls, so that the cavity is wider in a central region, approximately midway between the first window and the second window, than at the first surface and at the second surface. The cell body walls of the cell body have acute interior angles at both windows. The cell body is formed using an etch process that removes material from the cell body concurrently at the first surface and the second surface, forming the acute interior angles at both the first surface and the second surface.

Abstract: A partial discharge (PD) transducer that includes a PD sensor configured to sense a PD event of an electrical system. At least one light emitting device (LED) is arranged in series with the PD sensor. The LED is configured to receive the electrical sensor signal from the PD sensor and to generate a light signal in response to the electrical sensor signal.

Abstract: The present disclosure discloses a current sampling method and a current sampling circuit. The method comprises: obtaining a detected temperature of each semiconductor switch device of a plurality of parallel semiconductor switch devices; determining that the plurality of parallel semiconductor switch devices are in a current equalization state based on the detected temperature of each semiconductor switch device; obtaining an equalized current flowing through a target semiconductor switch device in the current equalization state, the target semiconductor switch device being any one of the plurality of parallel semiconductor switch devices; determining a total current of a main circuit connected to the plurality of parallel semiconductor switch devices according to the equalized current.

Abstract: A battery module includes: a battery cell unit including a plurality of battery cells connected together in series or series-parallel; a cell monitoring unit configured to monitor temperatures and voltages of the battery cells; and a plurality of overtemperature/overvoltage detecting units of n systems (n: an integer greater than or equal to 2). The overtemperature/overvoltage detecting units of the n systems are configured to independently detect an overtemperature or an overvoltage of the battery cells as an abnormal state, and to mutually notify one another of results of the detection. Each of the overtemperature/overvoltage detecting units is configured to, upon being notified that the abnormal state is detected from another overtemperature/overvoltage detecting unit of another system in the battery module, operate on the assumption that the overtemperature/overvoltage detecting unit detects the abnormal state.