Abstract: Capacitor assembly, comprising a printed circuit board comprising a first conductive trace and a second conductive trace, and a first row of capacitors comprising a plurality of surface mounted capacitor elements. Each of the plurality of surface mounted capacitor elements comprises a pair of outer electrodes, one of the pair being mounted to the first conductive trace and defining a first junction, and the other one being mounted to the second conductive trace defining a second junction. The first junction and the second junction define a first capacitor longitudinal axis. The first conductive trace has a first current flow direction with a first oblique angle relative to the first capacitor longitudinal axis.

Abstract: A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.

Abstract: According to various embodiments, an electronic device may include: a housing including a first space; a slide structure including a first surface directed in a first direction and a second surface directed in a second direction opposite the first direction, and slidably combined with the housing; a bendable member connected to the slide structure, and at least partly accommodated in the first space in a slide-in state and forming a same plane as the slide structure in a slide-out state; a flexible display supported by the bendable member and the slide structure; a first substrate disposed in the first space; at least one electronic component disposed in a second space between the first surface of the slide structure and the flexible display; and at least one electrical connection member electrically connecting the flexible display to the first substrate.

Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.

Abstract: A transmission line includes a first structure including a first flexible resin base material, and a first ground conductor thereon, a second structure including a second flexible resin base material, and a first signal line and an interlayer connection conductor in or on the second resin base material, a first spacer between the first and second structures, and a first metal joining material joining the first and second structures with the first spacer interposed therebetween. A first hollow portion is between the first and second structures with the first spacer interposed therebetween. The first signal line and the first ground conductor face each other in a joining direction with the first hollow portion interposed therebetween. The first resin base material and the second resin base material are not in contact with each other. The first metal joining material has a melting point lower than that of the interlayer connection conductor.

Abstract: According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

Abstract: Provided is an array substrate. The array substrate includes at least one pad group disposed in a peripheral region of a base substrate, wherein the at least one pad group includes a sector pad group in which the pads are distributed in a sector shape. Therefore, the bonding yield between the array substrate and the circuit board is increased.

Abstract: An electronic textile system and a docking assembly for the electronic textile system. The system includes a textile substrate, an input device attached to the textile substrate, and a docking assembly attached to the textile substrate for removably receiving a controller device. The docking assembly includes a first electrical interface for mating with a second electrical interface of the controller device. The system includes an electrical conductive pathway network integrated in the textile substrate for electrically coupling the input device and the first electrical interface. The input device may transmit to the controller device electronic signals representing input data when the controller device is received by the docking assembly.

Abstract: A photoelectric fiber includes a fiber including a core through which light is guided; an electrical unit formed continuously with the fiber, the electrical unit being configured to house a photoelectric conversion chip including a photoelectric conversion element; and an external electrode formed on a front surface of at least one of the fiber or the electrical unit, wherein the photoelectric conversion chip is optically connected to the core and electrically connected to the external electrode.

Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Abstract: An electronic device is provided. The electronic device includes a flexible printed circuit board comprising a housing, a first printed circuit board disposed in an inner space of the housing, a second printed circuit board disposed so as to be spaced apart from the first printed circuit board, a connection part electrically connecting the first printed circuit board and the second printed circuit board and connected to the second printed circuit board, and a coupling part including a bent part extending from the connection part and capable of being at least partially bent.

Abstract: A voltage regulator module is provided. The switch circuit assembly includes two switch circuits and an input capacitor. Respective input terminals of the two switch circuits are connected with each other in parallel. The input capacitor is electrically connected with the respective input terminals of the two switch circuits in parallel and disposed between the two switch circuits. The plurality of conductive members have a first conductive member, a second conductive member and a third conductive member. The first conductive member and the third conductive member are configured to deliver an electric energy. The second conductive member is configured to deliver a signal. One end of each conductive member is electrically connected with corresponding switch circuit, and the other end of the first conductive member and the third conductive member is electrically connected with the load. The switch circuit assembly and the magnetic assembly are stacked with each other.

Abstract: A semiconductor package can include a unitary substrate defining a first region and a second region. A first interposer can be mounted on the unitary substrate in the first region, and a first die can be mounted on the first interposer. A second interposer can be mounted in the second region on the unitary substrate, and a second die can be mounted on the second interposer.

Abstract: Embodiments disclosed herein include forksheet transistor devices having a dielectric or a conductive spine. For example, an integrated circuit structure includes a dielectric spine. A first transistor device includes a first vertical stack of semiconductor channels spaced apart from a first edge of the dielectric spine. A second transistor device includes a second vertical stack of semiconductor channels spaced apart from a second edge of the dielectric spine. An N-type gate structure is on the first vertical stack of semiconductor channels, a portion of the N-type gate structure laterally between and in contact with the first edge of the dielectric spine and the first vertical stack of semiconductor channels. A P-type gate structure is on the second vertical stack of semiconductor channels, a portion of the P-type gate structure laterally between and in contact with the second edge of the dielectric spine and the second vertical stack of semiconductor channels.

Abstract: A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Abstract: A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

Abstract: A splitter for allowing a hardline cable to be connected to the spotter as an input and a connector to be connected to the splitter as an output includes a housing portion. The housing portion includes an input portion; the input portion is configured to receive a hardline input cable; the housing portion includes an output portion; the input portion includes an engagement portion configured to engage a hardline back nut; the sputter is configured to connect to the hardline input cable; and the connection of the splitter to the hardline input cable is configured to allow the splitter to be installed on the hardline input cable without additional hardware to connect the splitter to the hardline input cable.

Abstract: An apparatus and method to reliably attach an electronic module to a textile. The overall mechanical assembly of the invention includes: (a) light pipe, (b) top enclosure, (b) magnet, (c) main electronics which contains (d) the main PCB, (e) battery and (f) other electronic components, (g) bottom enclosure, which holds (h) the connector PCB, (i) module dock, (j) top textile PCB which are located above the (j) textile band and under the (k) textile pocket and the (l) bottom textile PCB and (m) fabric and laminate padding, which are located below the textile band. The invention is physically embodied by an electronic module, comprising at least one printed circuit board (PCB), comprising at least one conductive circuit and at least one electronic component; a metallic rivet, grommet or eyelet to mechanically and electrically connect the; and a textile substrate with at least one electrically conductive circuit.

Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.

Abstract: An electronic device is provided. The electronic device comprises an interposer disposed between first circuit board and second circuit board, and including an opening area and for accommodating the at least one electronic component, and the interposer comprises a board including an inner surface that faces the opening area and an outer surface that faces an opposite direction to the inner surface, wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first concave areas, and a side conductive member disposed on the first concave areas and the first concave areas of the outer surface, and formed along the convexo-concave form of the outer surface.