Abstract: A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.

Abstract: A digital system has a substrate having a top surface on which a waveguide is formed on the top surface of the substrate. The waveguide is formed by a conformal base layer formed on the top surface of the substrate, two spaced apart sidewalls, and a top conformal layer connected to the base layer to form a longitudinal core region. The waveguide may be a metallic or otherwise conductive waveguide, a dielectric waveguide, a micro-coax, etc.

Abstract: A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

Abstract: A metamaterial resonator structure having a size for resonating a predetermined frequency band. The resonator structure includes one or more dielectric slabs each having a top surface and a bottom surface. A conductive resonator element is configured on the top surface of each dielectric slab and has a crescent shape including a center portion and opposing rounded end portions defining a gap therebetween, where the center portion has a wider dimension then the end portions so that a width of the element gradually tapers from the center portion to the end portions, and where the conductive element has a diameter that is a fraction of a wavelength of the frequency band. Several dielectric slabs can be stacked on top of each other, where each slab has a different size and each conductive resonator element is a different size so that each resonator resonates a different portion of the frequency band.

Abstract: A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.

Abstract: A circuit structure and a mobile terminal having a circuit structure are disclosed. The circuit structure may include two transmission lines that extend in a first direction to transmit a signal, and a guard pattern provided between the two transmission lines. The guard pattern may include a plurality of slots each having an open end and a closed end in a second direction. The guard pattern arranged between the transmission lines may lower cross talk by adjusting mutual capacitance so as to improve signal quality.

Abstract: A coil component includes a magnetic body having a plurality of filter parts disposed on a substrate and spaced apart from each other in a thickness direction. A plurality of input terminals and output terminals are disposed on outer surfaces of the magnetic body. Each of the filter parts includes upper and lower coils disposed in the magnetic body and spaced apart from each other in the thickness direction. In one example, a number of turns of the upper and lower coils of one filter part is different from a number of turns of the upper and lower coils of another filter part adjacent thereto. In another example, the number of turns of the upper and lower coils of the one and the other filter parts are the same, but capacitances of the one and the other filter parts are different.

Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.

Abstract: A branching device (10) includes a switch (SW1), a fixed filter circuit (11), and a tunable filter (TF1). The switch (SW1) includes a common terminal (Ps11) and individual terminals (Ps12, Ps13). The fixed filter circuit (11) is connected to the individual terminal (Ps12) and has a fixed pass band. The tunable filter (TF1) is connected to the individual terminal (Ps13) and has a tunable pass band. The fixed filter circuit (11) includes filters (FIL1, FIL2) having different pass bands. The pass bands of the filters (FIL1, FIL2) correspond to frequency bands to be used in carrier aggregation.

Abstract: A microwave filter has a housing defining an inner cavity. A first resonator is positioned in a first portion of the inner cavity. A second resonator is positioned in a second portion of the inner cavity. A third resonator is positioned in a third portion of the inner cavity. The first resonator and the third resonator are cross-coupled via an iris. The second resonator is elongated and is coupled to the first resonator and the third resonator. The resulting microwave filter has a frequency response having a transmission zero in the lower stopband. A high-pass filter is realized without the use of a cross-coupling probe.

Abstract: A notch filter includes a dielectric substrate, a microstrip transmission line on the dielectric substrate, and a fork-shaped open-circuited stub embedded in the microstrip transmission line.

Abstract: An automatic RF filter tuning system and a method for manufacturing a filter using the same are disclosed. An RF filter tuning system for tuning an RF filter that includes a plurality of cavities having resonance elements and a cover having tuning areas that are positioned correspondingly to the resonance elements, includes a measuring unit configured to measure resonance characteristics of the cavity of the RF filter, a control unit configured to calculate a tuning value of the RF filter based on the resonance characteristics, and a tuning unit configured to tune the RF filter based on the tuning value calculated by the control unit. The tuning unit includes a striking unit configured to strike the tuning area of the cover of the RF filter, thereby adjusting the resonance value and tuning the RF filter.

Abstract: A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes.

Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.

Abstract: Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

Abstract: A band-PASS filter disposed on a printed circuit board comprises a first terminal, a second terminal, a first coupling portion, a second coupling portion and a connection portion. The first terminal and the second terminal are used to receive or output electromagnetic signals respectively. The first coupling portion and the second coupling portion are disposed between the first terminal and the second terminal to couple the electromagnetic signals. The connection portion is connected to the first coupling portion and the second coupling portion. The first terminal partly accommodates in a first coupling portion groove. The second terminal partly accommodates in a second coupling portion groove.

Abstract: A dielectric waveguide coupling system for launching and extracting guided wave communication transmissions from a wire. At millimeter-wave frequencies, wherein the wavelength is small compared to the macroscopic size of the equipment, transmissions can propagate as guided waves guided by a strip of dielectric material. Unlike conventional waveguides, the electromagnetic field associated with the dielectric waveguide is primarily outside of the waveguide. When this dielectric waveguide strip is brought into close proximity to a wire, the guided waves decouple from the dielectric waveguide and couple to the wire, and continue to propagate as guided waves about the surface of the wire.

Abstract: Rapid radio frequency (RF) microwave devices and methods are disclosed. According to an aspect, a waveguide includes a body having first and second components that are attachable together to form an interior having a surface. Further, the waveguide includes a conductive material formed on the interior surface and shaped to convey electromagnetic waves.