Abstract: A turret-lathe coolant system is disclosed for selectively directing a stream of coolant to an interface between a workpiece on a turret lathe and a cutting tool positioned by a turret to cut the workpiece. In the preferred embodiment, the system includes a coolant-discharge assembly secured to the turret, wherein the assembly has a plurality of semi-rigid coolant tubes that are affixed to coolant-distribution ports, to distribute coolant fluid to a plurality of cutting tools on the turret. A coolant plunger is affixed within the coolant-discharge assembly that includes coolant-discharge outlets that pass coolant fluid from within an interior chamber in the plunger through adjacent distribution ports in the assembly.

Abstract: A method of grinding ferrules for ribbon type optical fibers wherein the method comprises the steps of locating the end surfaces of the ferrules with respect to a grinding surface of a grinding member, reciprocatingly turnably displacing the ferrules along an arched locus, and grinding the end surfaces of the ferrules with the grinding wheel. To practice the method, an apparatus including a ferrule holding member, a supporting member having the ferrule holding member turnably supported thereon, a driving unit in form of an electric motor including a reduction gear, a connecting rod bridged between the driving unit and the ferrule holding member to reciprocably turn the ferrule holding member, a grinding member mounted on a frame of the apparatus, a grinding position adjusting unit, a compression spring for normally biasing the supporting member in the upward direction, and a base board mounted on the frame of the apparatus for turning the supporting member about an intermediate position thereof.

Abstract: A contact structure is formed atop a semiconductor wafer at a level whereat it is desired to terminate polishing of a layer overlying the contact structure. When the contact structure becomes exposed to a polishing slurry, an electrical characteristic, such as resistance or impedance, is registered by measuring apparatus. In one embodiment, two or more contact structures are formed atop the wafer, vias are formed through the wafer, and the vias are filled, thereby providing a conductive path from the contact structures to the back side of the wafer. The measuring apparatus probes the filled vias on the back side of the wafer. A change in resistance/impedance indicates that the contact structures have become exposed during polishing, and polishing is terminated. In another embodiment of the invention, one or more contact structures are formed atop the wafer. The measuring apparatus is connected to a probe in the polishing slurry, and to the wafer itself, such as to the back side of the wafer.

Abstract: A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.

Abstract: The rotary form tool for finish machining tooth flanks of longitudinally curved teeth of a rough machined bevel gear blank of a hypoid or non-hypoid gear pair, comprises a tool body having the configuration of a hypoid helical bevel gear. Each tooth of the tool body is helically curved and has a longitudinally concave tooth flank and a longitudinally convex tooth flank. At least one tooth flank of the longitudinally concave tooth flanks and the longitudinally convex tooth flanks are coated with an abrading medium.

Abstract: A honing mandrel having an elongated body with a passageway extending along the length thereof including at least one open sided portion, the mandrel including an abrasive assembly positioned for radial movement in the open sided passageway portion having a radial outer surface formed of an abrasive material and a radial inner portion including spaced surfaces acutely angularly oriented relative to the axis of the mandrel body, cooperatively engageable surfaces on the abrasive assembly and on the body to prevent relative axial movement but not relative radial movement therebetween, and an operator member positioned in the passageway for axial movement therein, the operator member having surface portions thereon acutely angularly oriented relative to the axis of the mandrel body and positioned to make surface-to-surface slidable engagement with respective ones of the inner surfaces on the abrasive assembly whereby axial movements of the operator member in one direction relative to the abrasive assembly will pr

Abstract: A hand-held grinding device 1, 50, 60 for sharpening the cutting edge 3 of a chisel 4 comprises a housing 5 in which a grinding wheel 6 is mounted and a handle member 7 defining a guide channel 20 for directing the cutting edge 3 to the wheel 6. The grinding wheel 6 is mounted on a shaft 10 with a free end 8 for mounting in the chuck 9 of a power tool 19. The guide channel 20 has a rear end entry 22 and an end exit 21 adjacent to the grinding surface of the wheel 6. The cutting edge 3 of a chisel 4 to be sharpened is urged against the grinding wheel 6 by spring biassing elements 25, 26 extending into the guide channel 20. A forward bridge 30 is provided above the exit 21 and a rearward bridge member 35 is provided above the end entry 22.

Abstract: Undersized cooling holes for air cooling a gas turbine component or the like, are formed at low cost, and are later enlarged to increase the flow rate of cooling air therethrough by blowing a mixture of abrasive grit through the holes to enlarge them. Air without the grit is thereafter passed through the holes and the resulting increased flow rate is measured to see if it is at a satisfactory level. If it is not, the process is repeated until the desired accurate flow rate is achieved.

Abstract: A manual sanding tool has a block for holding a sheet of sand paper and a housing which may be attached to the block. The block has two ridges, each with a convex top surface. The two ridges are proximate opposed sides of the block; a shaft projects from the block inwardly of, and adjacent to, each ridge. An inverted box shaped member associated with each ridge has an elongate slot which receives the shaft such that the box member may be wiped over the top of the ridge to a position on the back surface of the block. In wiping over the top surface of the ridge, the box shaped member pulls on the end of any sandpaper between it and the ridge in order to tighten the sandpaper on the block. A nut may then secure the box shaped member in place on the back surface of the ridge. A passageway through a clip attached to the housing may receive a smaller diameter hook. The hook terminates in a socket for receiving a pole.

Abstract: A technique for chemi-mechanical polishing of semiconductor wafers using ultrasonic energy is disclosed. A transducer is mounted in the polishing system, either to a platen to which the polishing pad is mounted, or to a carrier to which the semiconductor wafer is mounted. In either case, relative vibratory motion is established between the wafer and the polishing pad. The transducer may also be mounted within the reservoir containing the platen, carrier and polishing slurry, to agitate the slurry itself. By vibrating the polishing pad relative to the wafer, polish rate and repeatability are enhanced, the polishing process is less sensitive to pad use history, and the pad is somewhat self-conditioning.

Abstract: A scissors sharpening apparatus includes a motor driven sharpening member having an abrasive surface. A magnetic guide is arranged to position the scissors blade at a fixed angle relative to the principle plane of the abrasive surface in such a manner that the magnet of the guide has the axis of its poles oriented nominally perpendicular to the flat face of the blade and nominally parallel to the principle plane of the abrasive surface.

Abstract: An improved honing head construction having one or more honing stone assemblies arranged around a rotatable mandrel body that includes a central body portion and pair of opposed end plate forming together a scroll feed up assembly operable for radially moving the honing assemblies during rotation of the mandrel for such purposes as adjusting the honing diameter, honing pressure and material removal rate, the scroll feed up assembly comprising helical scroll feed grooves located adjacent to each opposite end of the mandrel body and arranged to be positioned as mirror images of one another, each honing assembly having a pair of pin members arranged in axially aligned pairs and extending radially inwardly into radial extending bores in mandrel body, each of the Pin members having at least one tooth cooperatively engageable with one of the respective helical grooves such that all of the honing assemblies move radially in concert when the end plates are rotated relative to the central body portion.

Abstract: A method and apparatus for finishing the surface of a work article is disclosed wherein the article is transferred to a polishing head of a polishing machine by a multi-joint industrial robot. The polishing head may extend or retract in the direction of movement of the work article toward the polishing machine such that the force exerted on the work article by the polishing head may be kept generally constant throughout the polishing operation.

Abstract: A light-weight roller for rolling covering to uniformly distribute adhesive between the floor covering and floor, and to remove bubbles from therebetween. The roller utilizes removable, adjustable diameter rollers and has an adjustable handle to provide a variable rolling force on the floor covering depending upon the weight applied by the installer. The device is capable of applying floor coverings in a toe-kick space and in removing bubbles from beneath the floor covering.

Abstract: An apparatus for grinding pipe comprises a tool body and means for rotating and advancing the tool body longitudinally through a pipe to be ground. At least one grinding tool is mounted on the tool body carrying a grinding element and adapted to extend outwardly to contact and grind the internal surface of the pipe when the tool body is inserted therein. Force transmitting means, transmits the pressure of a fluid contained in a tool body cavity to each grinding tool to extend the tools and apply a grinding force to the pipe. After grinding the internal surface of the pipe, the pipe is heated to a burn-out temperature, and then sandblasted on its internal surface to produce a surface for receiving a coating material.

Abstract: Provided is a coated cutting tool having a coating and a substrate. The coating includes at least one CVD layer which may have a residual tensile stress and at least one layer having a high residual compressive stress. The outermost layer of the coating is preferably the one containing residual compressive stresses. The substrate is a composite having hard refractory grains.

Abstract: A machine adapted to be maneuvered across a surface, typically a floor, in order to remove an unwanted coating such as asbestos and adhesive from the floor. An impeller hurls an abradent such as metal shot at an angle against the floor abrading the material which then rebounds along with the abradent up into a return channel where the abradent shot and the abraded material are separated. The shot is returned to the impeller. The abrasion takes place in a downward facing cavity. A wetting spray outside the cavity in advance of the forward end of the machine wets the surface in advance of the abrasion and creates a mist within the cavity which cools the flow of material rebounding from the surface. The presence of the mist greatly abates the dispersion of the abraded material permitting it to be discharged into a collecting drum without contaminating the ambient air.

Abstract: A distributed polishing head assembly (17) has a flexible membrane (14), and a plurality of periodic polishing pads (12) that are attached to the flexible membrane (14). The polishing pads (12) are made from a flat semiconductor wafer that has been sawed into small pieces. The polishing head is rubbed against a semiconductor wafer (10) in order to planarize the wafer (10).

Abstract: An automated free abrasive apparatus for machining substantially similar workpieces on one side. In the apparatus a plurality of substantially similar workpieces are oriented and arranged in a lay flat configuration. Thereafter transport elements transfer the oriented laid flat workpieces to an indexing table which is movable vertically and horizontally to transport the workpieces to a machining area wherein the workpieces are machined. The orientation and machining or lapping of the workpieces is accomplished automatically without the need for an operator feeding each workpiece into the machining operation.

Abstract: A rotary polishing tool comprises a disk-shaped polishing portion corresponding to a workpiece and a disk-shaped substrate which is positioned on the rotary center of the polishing portion for supporting the polishing portion. The substrate is provided with a mounting hole through which a driving shaft is passed on the rotary center. The substrate is made of metal and is provided with a plurality of holes, and there is provided a rubber layer which is interposed between the polishing portion and the substrate and vulcanized and bonded to the polishing portion and the substrate to fix the polishing portion and the substrate to each other.