Abstract: A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula--(R.sub.4).sub.nwherein R.sub.4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20.degree. C. of from 0.001 to 500 poises.

Abstract: An article is disclosed containing a Langmuir-Blodgett film assembly comprised of at least one oriented polymer layer of monomolecular thickness containing repeating units comprised of a hydrophilic group linking two hydrophobic groups each containing at least two crosslinking moieties.