Abstract: Provided a light emitting device including a reflective layer including a plurality of nanostructures that are periodically two-dimensionally arranged, a planarization layer disposed on the reflective layer, a first electrode disposed on the planarization layer, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer, wherein the planarization layer includes a conductive material that is transparent with respect to light emitted by the organic emission layer, and wherein the planarization layer is disposed on upper surfaces of the plurality of nanostructures such that an air gap is provided between adjacent nanostructures of the plurality of nanostructures.

Abstract: A power converter package includes a leadframe including first and second die pads, and supports connected to first leads, and second leads. A first semiconductor die including first bond pads is on the first die pad, and a second semiconductor die including second bond pads is on the second die pad. A transformer stack includes a top magnetic sheet and a bottom magnetic sheet on respective sides of a laminate substrate that includes a coil within, and coil contacts. A silicon block is attached to the bottom magnetic sheet and edges of the laminate substrate are attached to the supports. Bond wires are between the first bond pads and the second leads, the second bond pads and the second leads, and the first and second bond pads and the coil contacts. Mold encapsulates the respective semiconductor and the transformer stack. A bottom of the silicon block is exposed from the mold.

Abstract: A method of manufacturing a display apparatus includes: forming a display element layer above a lower substrate, where the display element layer includes first to third display elements; forming an encapsulation layer on the display element layer; forming first partition walls on the encapsulation layer to define first to third color regions, where the first to third color regions overlap the first to third display elements, respectively, in a view in a direction perpendicular to the lower substrate; forming second partition walls on the first partition walls; forming a quantum dot layer, which includes forming a second color quantum dot layer in the second color region and forming a third color quantum dot layer in the third color region; and removing the second partition walls.

Abstract: Provided are a light-emitting device, an electronic apparatus including the same, and a method of manufacturing the light-emitting device, wherein the light-emitting device includes: a first electrode, a second electrode facing the first electrode, and an interlayer between the first electrode and the second electrode, wherein the interlayer includes an emission layer and an electron transport layer, the electron transport layer is between the emission layer and the second electrode, and the electron transport layer includes an electron transport particle, the electron transport particle includes a core and a shell covering the core, the core includes an oxide, a chalcogenide, or any combination thereof, and the shell includes a chalcogenide, the chalcogenide of the core being the same as or different from the chalcogenide of the shell.

Abstract: A display device includes: a substrate including an opening area, a display area surrounding the opening area, and a non-display area between the opening area and the display area; a first insulating layer arranged on the substrate and including a first recess in the non-display area; an organic pattern layer arranged on an upper surface of the first insulating layer in the non-display area and including a side wall in contact with a first side wall of the first recess; and a display element arranged on the first insulating layer to overlap the display area and including a first electrode, an emission layer, and a second electrode, wherein the first electrode includes a first layer, a second layer, and a third layer, and the first layer includes at least one of titanium (Ti), titanium nitride (TiN), molybdenum (Mo), and amorphous silicon (a-Si) to which a dopant is added.

Abstract: The present invention relates to an organic compound, an organic electroluminescent material, and an organic electroluminescent element. The structural formula of the compound is shown in formula (I). When the organic compound of the present invention is used for preparing an organic electroluminescent element, the electron mobility, thermal stability, and luminescent characteristics are excellent; and the organic compound can be applied to an organic layer of the organic electroluminescent element. The organic compound of the present invention has a relatively good film-forming property; and when same is applied to an electron transport layer and an electron transport auxiliary layer, an organic electroluminescent element, which has a lower driving voltage, a higher light emission efficiency, and a longer service life than existing electron transport materials, can be manufactured, and thus, a full-color display panel with having improved performance and a prolonged service life can be manufactured.

Abstract: A display device is disclosed, which may reduce an interval between subpixels and maximize a light emission area. The display device comprises a substrate provided with a first subpixel and a second subpixel arranged to adjoin the first subpixel, a first electrode provided in each of the first subpixel and the second subpixel on the substrate, including a first material, and an oxide insulating film provided to cover at least a portion of a side of the first electrode and made of a second material. The first material is a metal material, and the second material is an oxide of the first material.

Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.

Abstract: A light-emitting device and a method of manufacturing the same. The light-emitting device includes a body portion, and a light-emitting portion arranged in the body portion and configured to emit light to the outside. The light-emitting portion includes a plurality of pixels. At least two of the pixels are configured to emit pieces of light having different wavelengths from each other.

Abstract: A color-converting substrate including light-emitting areas and a light-blocking area surrounding the light-emitting areas, the light-emitting areas including first light-emitting areas configured to emit a same color light and spaced apart from each other by the light-blocking area, a partition wall including a first opening continuously overlapping the first light-emitting areas and a first portion of the light-blocking area disposed between the first light-emitting areas, a first color-converting layer including a wavelength-converting material and disposed in the first opening to overlap the first light-emitting areas and the first portion of the light-blocking area, and a color filter layer including a portion configured to block a first color light emitted through the first light-emitting areas, the color filter layer overlapping the first color-converting layer and the first portion of the light-blocking area.

Abstract: A display device having a non-display region is provided. The display device includes a first conductive line to which a voltage is applied and a second conductive line which is at least partially overlapped with the first conductive line. There is a distance between the first conductive line and the second conductive line in a normal direction of the display device is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: New organometallic complexes having bis- or tris-heteroleptic ligands and large aspect ratio in one direction and their use in OLEDs to enhance the efficiency is disclosed.

Abstract: A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pat gstern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.

Abstract: A method of encapsulating a display substrate and a counter substrate, an encapsulated display panel, a display apparatus, and a counter substrate are provided. The encapsulated display panel includes a display substrate; a counter substrate facing the display substrate; and a sealant filled in a space between the display substrate and a counter substrate. The display substrate in a peripheral area has a plurality of protruding parts and a plurality of recessing parts, resulting in an uneven surface topography. The counter substrate in at least a portion of the peripheral area has a counter surface topography substantially complementary to the surface topography of the display substrate. The counter substrate in the peripheral area has a plurality of counter protruding parts.

Abstract: A display device may include a substrate including a display area and a bending area, a buffer layer disposed on the substrate, a first dummy pattern disposed in the bending area on the buffer layer; a first insulating layer disposed on the buffer layer, the first insulating layer exposing an upper surface of the first dummy pattern, a second insulating layer disposed on the first insulating layer, the second insulating layer having an opening exposing an upper surface of the first dummy pattern, a second dummy pattern disposed on the first dummy pattern, and a transmission line disposed on the second dummy pattern.

Abstract: A nitride-based semiconductor device includes a buffer, a first nitride-based semiconductor layer, a shield layer, a second nitride-based semiconductor layer, S/D electrodes, and a gate electrode. A first nitride-based semiconductor layer is disposed over the buffer. A shield layer is disposed between the buffer and the first nitride-based semiconductor layer and includes a first isolation compound that has a bandgap greater than a bandgap of the first nitride-based semiconductor layer, in which the first isolation compound is made of at least one two-dimensional material which includes at least one metal element. A second nitride-based semiconductor layer is disposed on the first nitride-based semiconductor layer and has a bandgap less than the bandgap of the first isolation compound and greater than the bandgap of the first nitride-based semiconductor layer. The pair of S/D electrodes and the gate electrode are disposed over the second nitride-based semiconductor layer.

Abstract: A display device includes a first substrate where a display area and a non-display are defined, wherein a plurality of pixels are arranged at the display area and the non-display area surrounds the display area; a dam surrounding the display area and arranged at the non-display area; an organic light emitting diode provided in the display area; an encapsulation film disposed on the organic light emitting diode; a buffer layer disposed on the encapsulation film; an insulating film disposed on the buffer layer; a pad area arranged outside the dam, wherein the buffer layer and the insulating film extend from the display area to the pad area; a link line disposed between the dam and the first substrate; and a routing line provided on the insulating layer between the display area and the pad area.

Abstract: An organic light-emitting diode (OLED) display panel and a display device are provided. The OLED display panel includes a substrate, a driving circuit layer, a luminous functional layer, a first coupling layer, and a second coupling layer. The second coupling layer includes a first coupling portion, a second coupling portion, and a third coupling portion respectively corresponding to red, green, and blue pixels. A thickness of the first coupling portion is greater than or equal to a thickness of the second coupling portion, and greater than a thickness of the third coupling portion. The thickness of the second coupling portion is greater than or equal to the thickness of the third coupling portion.