Patents Examined by Carl J. Arbes
  • Patent number: 11515767
    Abstract: An apparatus for pre-assembling a winding for an electric machine stator or rotor includes a plurality of hairpins with two legs having non-circular cross-section, a ring including a plurality of slots and an outer containment ring acting in containment along the perimeter of the ring. An inner cam block and an outer cam block, surrounding and radially facing the inner cam block, are arranged opposite to the exit face of the ring. The cams are adapted to be crossed, in use, by the two legs when they cross the ring at the same time; the cams open into a free circular space between the two cam blocks. A method for pre-assembling a winding set for an electric machine stator or rotor is also provided. Hairpins are inserted in sequence in the slots of the apparatus. A finished winding set positioned in the free circular space is obtained by successive rotations of the ring.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: November 29, 2022
    Assignee: TECNOMATIC SPA
    Inventors: Giovanni Ruggieri, Sergio Tancredi, Maurilio Micucci, Giuseppe Ranalli
  • Patent number: 11516915
    Abstract: A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 29, 2022
    Assignee: Intel Corporation
    Inventors: Zhichao Zhang, Tao Wu, Gaurav Chawla, Jeffrey Lee
  • Patent number: 11509106
    Abstract: A punchdown tool for fitting wires into connectors including a housing with a front side, a back side, a front end, a rear end opposite the front end, a leading surface on the front end, and an interior defined between the front and back sides. The punchdown tool also includes a drive mechanism with a hammer, an anvil, and a drive spring. The drive mechanism is positioned in the interior of the housing adjacent the front end. The punchdown tool further includes a circuit board positioned in the interior of the housing adjacent the rear end with a controller. The punchdown tool also includes a light positioned on the leading surface of the housing that is electrically coupled to the controller and at least one battery positioned in the interior of the housing for supplying power to the light and the circuit board.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: November 22, 2022
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Alexander J. Paulsen, James A. Cemke, Jr., Eric J. Williams
  • Patent number: 11503719
    Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: November 15, 2022
    Assignee: Vitesco Technologies GmbH
    Inventors: Gregory Drew, Thomas Riepl, Detlev Bagung
  • Patent number: 11499859
    Abstract: A capacitive level-sensor device, for detecting the level of a medium contained in a container, is configured for being installed on the outside of the container, in a position substantially resting against a wall of the container that is made at least in part of an electrically insulating material. The circuit support has, in a sensing region thereof, at least one first plurality of first capacitive elements, which comprise at least one first array of first electrodes, preferably set at a distance apart from one another along a level-detection axis, the first electrodes being made of an electrically conductive material and being arranged at least in part in a position corresponding to at least one first side of a supporting structure of the circuit support.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: November 15, 2022
    Assignee: ELTEK S.p.A.
    Inventors: Mauro Zorzetto, Giorgio Martinengo
  • Patent number: 11502484
    Abstract: An installation tool and methods for installing a splice kit for a heating cable is provided. The installation tool includes a body, a first channel, and a first cavity. The first channel is defined in the body and configured to retain a first insulating tubing of the splice kit. The first cavity is within the first channel and configured to retain a first connector of the splice kit. The body is configured to retain the first insulating tubing and the first connector in a predetermined formation during installation of the first insulating tubing and the first connector to the heating cable, and the body is further configured to be removed from the first insulating tubing and the first connector following installation of the first insulating tubing and the first connector to the heating cable.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: November 15, 2022
    Assignee: nVent Services GmbH
    Inventors: William Edward Jarvis, Wesley Dong
  • Patent number: 11490955
    Abstract: A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The system includes a photolithography module that is configured to etch one or more pockets on a seal surface of the seal plate. A vacuum module is configured to raise, transfer and lower a spacer from a location remote from the pocket(s) on the seal plate to the pocket on the seal plate(s). An adhesive dispensing module is configured to dispense an adhesive into the pocket on the seal plate. An optical module is configured to monitor a volume of the adhesive dispensed within the pocket and monitor placement of the spacer within the pocket.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: November 8, 2022
    Assignee: Covidien LP
    Inventors: Kim V. Brandt, Allan G. Aquino
  • Patent number: 11489393
    Abstract: A stator assembly of a hairpin winding motor capable of improving the performance of the winding motor and the insulation performance of a hairpin coil, and includes a stator core through which a plurality of slots pass in a circumferential direction; and a plurality of hairpin coils respectively fastened to and interconnected with the slots to form a coil winding. The hairpin coil includes a head portion bent in a U shape and exposed to the outside of the stator core, and a pair of leg portions configured to extend in parallel from both ends of the head portion to be inserted into a specific slot and the slot spaced apart from the specific slot by one pole pitch and of which end portions are exposed to the outside of the stator core.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: November 1, 2022
    Assignee: HYUNDAI MOBIS Co., Ltd.
    Inventor: Yong Ho Kim
  • Patent number: 11482822
    Abstract: A wiring method during which an electrical cable is connected, the cable including one or more conductive wires, to an electrical apparatus, such as a drive computer unit for assisted steering, by means of a non-sealed connector which includes a male portion placed in a junction box and connected to the electrical apparatus, and a female portion connected to the electrical cable, as well as retaining members for fixing the female portion on the male portion in order to create an electrical junction between the respective conductive terminals of the portions, the connector is then covered, after connection, with an enrobing polymer material which forms a sealed shell which protects the electrical junction at least from water.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 25, 2022
    Assignee: JTEKT EUROPE
    Inventors: Patrice Brochot, Pascal Pauly, Laurent Rey
  • Patent number: 11483936
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 25, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yuichi Yanaka
  • Patent number: 11477903
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: October 18, 2022
    Assignee: Sparton DeLeon Springs, LLC
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 11470737
    Abstract: A casing assembly having at least one configuration for blocking extraneous material and including first shell part and second shell part. First shell part includes contact portion and first recess portion. Second shell part includes step portion and protrusion portion. Step portion is in contact with contact portion of first shell part and forms decorative slot exposed to outside with contact portion. First recess portion is located on side of contact portion that is located away from decorative slot. Protrusion portion is located on side of step portion that is located away from decorative slot and located in first recess portion. Protrusion portion has top surface facing toward first recess portion, first recess portion has bottom surface, and idle cavity is formed between top surface of protrusion portion and bottom surface of first recess portion.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: October 11, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih-Ming Lai, Yu Chi Peng
  • Patent number: 11457550
    Abstract: A component-mounting device includes a base, a board positioner which positions a board, a feeder carriage which is attachable to and detachable from the base, a part feeder which supplies a component, a mounting head which mounts the component on the board positioned by the board positioner, a nozzle replacement table which holds a replacement nozzle attached to or detached from the mounting head, a replacement table holder which holds the nozzle replacement table at a predetermined holding position within a movable range of the mounting head, and a placing table on which the nozzle replacement table is placed before the replacement table holder holds the nozzle replacement table. The component-mounting device delivers the nozzle replacement table between the replacement table holder and the placing table in a state where the feeder carriage is connected to the base.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: September 27, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tadashi Endo, Yasuyuki Ishitani, Koji Watanabe
  • Patent number: 11453823
    Abstract: The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: September 27, 2022
    Assignee: InkTee Co., Ltd.
    Inventors: Kwang-Choon Chung, Byung Woong Moon, Su Han Kim, Jae Rin Kim
  • Patent number: 11451001
    Abstract: A device for inserting wires into a wiring harness connector includes a light source and an assembly to cause rear illumination of a particular pin cavity of a plurality of pin cavities of the wiring harness connector by light from the light source. Rear illumination of the particular pin cavity indicates the particular pin cavity where a selected wire is to be inserted into the wiring harness connector based on an identification of the selected wire.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: September 20, 2022
    Assignee: The Boeing Company
    Inventors: Jason G. DeStories, James R. Crocco, Michael R. Mercer
  • Patent number: 11445623
    Abstract: This disclosure provides a field termination assembly (FTA) providing for ease of mounting to a support rail. The FTA is easily mounted to a base which is secured to a support rail. The housing includes one or more slots each configured to receive a respective adaptor module configured to be inserted into the slot. Each adaptor module may be configured to perform at least one function related to an associated input or output signal.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: September 13, 2022
    Assignee: Honeywell International Inc.
    Inventors: Dawa Pakimo, Dinesh Kumar KN, Jaison Cherian, Hemanth Vijaykumar, Chandrashekar Thayumanavan, Shripurnabodh Deshpande, Karma Bhutia, Vishwanath Balakrishna
  • Patent number: 11445628
    Abstract: One disclosed method includes defining an electrical trace on a first substrate; physically coupling an electronic component to the first substrate, wherein a portion of the electrical trace completely encircles the electronic component; overlaying a second substrate onto the first substrate, the overlaying causing the second substrate to completely cover the portion of the electrical trace and the electronic component; electrically coupling an electrical power source to the electrical trace to generate a current in the electrical trace; melting the second substrate using heat generated by the current through the electrical trace; and fusing the second substrate to the first substrate to generate a hermetic seal around the electronic component.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: September 13, 2022
    Assignee: VERILY LIFE SCIENCES LLC
    Inventors: Jeff Clarkson, Roseann Ahlin
  • Patent number: 11445603
    Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: September 13, 2022
    Assignee: Hamilton Sundstrand Corporation
    Inventors: David Perley, Kenneth J. Trotman
  • Patent number: 11437789
    Abstract: An attachment tool for attaching a tie tube to a wire includes a body and a first engagement portion extending away from the body. The first engagement portion releasably engages a first end of the tie tube for attachment of the first end of the tie tube to the wire. A second engagement portion extends away from the body and releasably engages a second end of the tie tube for attachment of the second end of the tie tube to the wire after attachment of the first end of the tie tube to the wire. A coupling structure is connected to the body, the coupling structure coupling to a hot stick.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 6, 2022
    Assignee: PREFORMED LINE PRODUCTS CO.
    Inventors: Jacob Palmer, Cameron Clines
  • Patent number: 11439026
    Abstract: A method for manufacturing a printed circuit board includes forming a through hole in an insulating layer of the printed circuit board, filling the through hole by plating to form a plating layer on the insulating layer, and removing the plating layer from the insulating layer; and forming a circuit pattern on the insulating layer.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung-Soo Kim, Jin-Won Lee