Abstract: An electronic component mounting machine includes a storage section configured to store viscous fluid, a head section configured to hold an electronic component having a bump and to immerse the bump of the electronic component in the viscous fluid, an irradiation section configured to irradiate the bump, to which the viscous fluid has been transferred, with light, an imaging section configured to capture an image of the bump irradiated with light from the irradiation section, and a control device. The control device executes detection processing for detecting a transfer amount of the viscous fluid transferred to the bump based on image data captured by the imaging section, determination processing for determining whether the transfer amount is good or bad, and transfer processing for transferring the viscous fluid to the bump in accordance with the transfer amount being less than a predetermined threshold.

Abstract: The feeder includes a first sprocket provided in an insertion section, having engagement protrusions, engageable with engagement holes of a carrier tape, formed on only a part of the outer circumference, and a second sprocket arranged side by side with the first sprocket, on the supply section side of the first sprocket, having engagement protrusions formed over the entire circumference. A control device of the feeder restricts contact between the engagement protrusions of the first sprocket facing the carrier tape and the carrier tape after the engagement protrusions of the second sprocket disengage from the carrier tape in an unloading process of conveying the carrier tape to the insertion section side.

Abstract: A quick connect assembly includes a connector housing and fluid connectors that fluidly couple an ink assembly and a print assembly. The quick connect assembly also includes conductive connectors that conductively couple hardware circuitry in the ink assembly with hardware circuitry in the print assembly. First and second portions of the connector housing mate with each other to couple the fluid connectors and to couple the conductive connectors. The first and second housing portions mate with each other by rotating the first housing portion and/or the second housing portion relative to the other of the first housing portion and/or the second housing portion.

Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

Abstract: A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.

Abstract: In a component insertion machine for inserting a component with a lead into a board, when the lead is cut by lead cutting device having a fixed blade 60 and a movable blade prior to insertion, the component is moved to a position where the lead approaches or contacts the fixed blade, at which position the movable blade is operated to cut the lead.

Abstract: A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

Abstract: A method and system for manufacturing potted electronic assemblies are described. Embodiments of the method and system may provide a potting compound having a first coefficient of thermal expansion different from a second coefficient of thermal expansion for a circuit board, provide a fiber reinforcement having a third coefficient of thermal expansion selected so that when the potting compound is combined with the fiber reinforcement the combined coefficient of thermal expansion is closer to the second coefficient of thermal expansion than the first coefficient of thermal expansion is to the second coefficient of thermal expansion, and apply the fiber reinforcement and the potting compound to the circuit board.

Abstract: A processing method for a tip end of a tape is a method of processing a tip end of a component storage tape before attaching the component storage tape to a component feeding device. The processing method for a tip end of a tape includes a lifting step and a folding step. At the lifting step, a lifting process of lifting the tip end of the cover tape off the carrier tape is carried out such that a part of a tip edge of the cover tape is separated from the carrier tape. At the folding step, the lifted tip end of the cover tape is folded along a fold to form a triangular fold piece.

Abstract: A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.

Abstract: A method of fabricating a stretchable and flexible electronic device includes forming each of the functional layers is by: (i) forming on an elastomer substrate a conductive interconnect pattern having islands interconnected by bridges; (ii) applying a conductive paste to the islands; (iii) positioning at least one functional electronic component on each island; and (iv) applying heat to cause the conductive paste to reflow. An elastomer encapsulant is formed over the functional electronic components and the conductive interconnect pattern on each of the functional layers. The elastomer encapsulant has a Young's modulus equal to or less than that of the substrate. The encapsulant includes a pigment to increase absorption of laser light. At least one via is laser ablated, which provides electrical connection to any two functional layers. The via is filled with solder paste to create a bond and electrical connection between the functional layers.

Abstract: A mounting device, comprising: a mounting section on which a feeding unit is installed to supply components by feeding a packaging member where the components are packaged at predetermined intervals; a mounting head configured to pick up a component from the packaging member; an imaging section configured to image the packaging member; and a control section configured to obtain a packaging pitch based on a reference pattern of the packaging member with the packaged components, the reference pattern being acquired based on a pre-pickup image which is a captured image of the packaging member before picking up a component, and a post-pickup image which is a captured image of the packaging member after picking up the component.

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

Abstract: The invention relates to a contact system for contacting an aluminium braid (7) to a contact element (1) comprising—an electrically conducting cable (4); —the aluminium braid (7) comprising a plurality of aluminium wires, which is arranged to run at least in sections between a primary isolation (6) and a secondary isolation (8) of the electrically conducting cable (4); —die contact element (1) which can be pushed onto the electrically conducting cable (4) having an outer sleeve (3) and an inner sleeve (2) which can be inserted therein.

Abstract: A component mounting machine including a head provided with multiple nozzles to pick up the components; a raising and lowering device to individually raise and lower the multiple nozzles; a moving device to move the head relative to the board in a plane perpendicular to a raising and lowering direction of the nozzles; and a control device to perform, as a pickup operation for causing the nozzle to pick up a component, a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components using that nozzle, and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components simultaneously using the multiple nozzles.

Abstract: An electronic component mounting device including a component tape in which a cover tape is adhered to a carrier tape accommodating multiple electronic components at a predetermined pitch; a tape feeder for feeding the component tape from a tape reel, with having a peeling mechanism for peeling the cover tape from the carrier tape at a component supply position; a mounting head configured to take out electronic components from the carrier tape at the component supply position and mount the electronic components on a board; and a tape collection portion in which a static charge elimination member is provided along a discharge path of the carrier tape from which the electronic components have been taken out, the discharge path being through a discharge duct from the tape feeder to a collection box.

Abstract: A tool for demating multi-pin connectors includes a first fork including an inner fork member and an outer fork member operatively connected for relative movement parallel to a longitudinal fork axis. A second fork is spaced apart from the first fork wherein the second fork includes an inner fork member and an outer fork member operatively connected for relative movement parallel to the longitudinal fork axis. A handle connects the first fork to the second fork. The handle includes an outer handle member fixedly connecting the outer fork members of the first and second forks, and the handle includes an inner handle member fixedly connecting the inner fork members of the first and second forks. Relative movement of the inner and outer handle members causes relative movement of the inner and outer fork members of the first and second forks for demating multi-pin electrical connectors from sockets.

Abstract: A work management system includes a part resupply management unit that manages a plan of part resupply work and a collection management unit that collects waste material data and manages the collection work to be executed in future. The part resupply management unit includes a resupply target specifying unit that specifies a resupply time zone and a target mounting machine, and a work planning unit that extracts a plurality of the target mounting machines with the resupply time zones overlapping each other and that creates a work plan to make a patrol of the target mounting machines and execute the resupply work at the target mounting machines. When a need of the collection work to be executed has arisen at the target mounting machine, the work planning unit creates a work plan to execute both the resupply work and the collection work for the target mounting machine.