Abstract: A core, constituted by an amorphous undoped semiconductor (i type), which is formed on a lower clad layer, and a p-type layer and an n-type layer which are disposed on the lower clad layer with the core interposed therebetween and are formed in contact with the core are provided. The core is formed to be thicker than the p-type layer and the n-type layer. The p-type layer and the n-type layer are constituted by single crystal silicon.

Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.

Abstract: A multilayer photonic device is described, including an input region configured to receive an input signal, a multilayer stack optically coupled with the input region to receive the input signal, and an output region optically coupled with the multilayer stack to output an output signal. The multilayer stack can include a first metastructured dispersive region disposed in a first patterned layer of the multilayer stack and a second metastructured dispersive region disposed in a second patterned layer of the multilayer stack and optically coupled with the first metastructured dispersive region. The first metastructured dispersive region and the second metastructured dispersive region can together structure the multilayer stack to generate the output signal in response to the input signal.

Abstract: An optical sensing system including an optical interrogator is operative with an array of reflective sensors, each sensor providing a separable reflected spectral response parameter such as a unique Gaussian standard deviation or reflected response compared to other sensors in the same operating wavelength range. The optical interrogator provides narrowband swept or broadband continuous optical power source to the array of FBG sensors, and an optical interrogator generates a g(x) representation of power vs wavelength of the reflected optical power and decomposes the representation into the wavelength of the individual sensors, thereby allowing operation of two or more FBG sensors in the same operating wavelength range.

Abstract: A device coupon for use in a hybrid integration process with a silicon platform. The device coupon comprises: an input waveguide, including an input facet; an active waveguide, coupled to the input waveguide, the active waveguide including a III-V semiconductor based electro-optical device; and an output waveguide, configured to couple light between the active waveguide and an output facet. The input waveguide and output waveguide are passive waveguides.

Abstract: The present disclosure provides a rollable optical fibre ribbon (100) with intermittent bonding. The rollable optical fibre ribbon (100) includes a plurality of optical fibres. The plurality of optical fibres (102) are placed parallel to each other, wherein the plurality of optical fibres (102) adjacent to each other are bonded intermittently along a length by a plurality of bonded portions (104). The plurality of bonded portions (104) occupies 3 to 20% of an area of the rollable optical fibre ribbon of length 1 meter. An area of the plurality of bonded portions (104) is defined as an area projected by the plurality of bonded (104) portions on a plane passing through centres of the plurality of optical fibres (102) of the rollable optical fibre ribbon (100) and extending longitudinally.

Abstract: A hybrid cable includes a central strength member, residing in a center of the cable. At least two insulated conductors are abutting the central strength member. One or more buffer tubes are included in the cable, each with at least one optical fiber. One or more filler rods are optionally included in the cable. A shielding layer and jacket surround the elements. In one embodiment, four large insulated conductors and two filler rods abut the central strength member. A first water-blocking tape surrounds the four large insulated conductors, filler rods and central strength member to form an inner core. A concentric core surrounds the central core. The concentric core includes two insulated conductors, plural buffer tubes and a second water-blocking tape surrounding the two insulated conductors and the plural buffer tubes. The shielding layer surrounds the concentric core, and the jacket surrounds the shielding layer. A toning signal carrying medium may also exist outside of the shielding layer.

Abstract: An assembly of an active semiconductor component and of a silicon-based passive optical component includes a carrier; and the active semiconductor component and the passive optical component both arranged on the carrier. The active semiconductor component includes a first set of semiconductor layers comprising at least one first waveguide configured to guide, in a first section of the assembly, at least one first optical mode; a second set of semiconductor layers, the set being superposed and making contact with the first set of layers, and including at least one second waveguide configured to guide at least one second optical mode. At least some of the layers of the first set of layers and of the second set of layers are doped to form, in a first region of the component, a PIN diode. The at least one first waveguide and the at least one second waveguide are configured to allow evanescent coupling therebetween, in a second section of the assembly.

Abstract: A hinge structure for pivotally mounting a first telecommunications element to a second telecommunications element includes a hinge pin provided on the first element and a hinge pin receiver provided on the second element. The hinge pin defines a notch separating the pin into two pin halves. The hinge pin receiver defines two sets of opposing surfaces, the two sets separated by a divider, the divider configured to be accommodated by the notch when the hinge pin is inserted into the hinge pin receiver, wherein each opposing surface set defines a slot for receiving each pin half.

Abstract: A photonic Y-splitter includes a substrate, first optical waveguides disposed in the substrate on a first layer, the first optical waveguides may be flared at a first end and inverse tapered toward a second end and may be substantially mirror images of one another, and a second optical waveguide disposed in the substrate on a second layer, above the first layer, the second optical waveguide being centered over the first optical waveguides and longitudinally arranged between the first end and the second end.

Abstract: There is a manufacturing error even if an RGB coupler is appropriately designed, and thus a problem that it is difficult to achieve the function as designed with good yield arises. To solve this problem, an optical circuit with a first waveguide in which light in a zero-th order mode is guided and a second waveguide having a larger width than the first waveguide, in which light in a primary mode is guided in which the first and second waveguides at least include a first curved portion in a curve shape curved toward the first waveguide while maintaining a combination of waveguide widths satisfying mode conversion conditions is provided.

Abstract: Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.

Abstract: An optical-electrical conductor assembly is provided that includes an optical waveguide that has an outer organic jacket layer and a functional layer system disposed on the outer jacket layer of the optical waveguide. The functional later has a base layer portion with a single layer or a sequence of layers and an electrically conductive layer disposed on the base layer portion. The electrically conductive layer has a single layer or a sequence of layers.

Abstract: A temperature correcting pressure gauge which has a diaphragm having at least one surface coupled to a source of pressure to be measured, the diaphragm first surface having a first FBG from a first optical fiber attached in an appropriately sensitive region of the diaphragm, a FBG from a second optical fiber attached to the opposite surface from the first FBG, the first and second FBGs reflecting or transmitting optical energy of decreasing or increasing wavelength, respectively, in response to an applied pressure. The first and second FBGs have nominal operating wavelength ranges that are adjacent to each other but are exclusive ranges and the FBGs also have closely matched pressure coefficients and temperature coefficients.

Abstract: A fusion splicer includes: a device main body including a heater that heats a pair of optical fibers that each include a glass part and a coated part; a pair of glass holders each including a groove on which the respective glass part is disposed; a pair of first clamps that each clamp the respective glass part against the respective glass holder; a pair of second clamps that each clamp the respective coated part from above; a third clamp that is fixed to the device main body and that restricts movement of at least one of the optical fibers in a closed state; and a windproof cover that covers the heater, the glass holders, the first clamps, the second clamps, and the third clamp.

Abstract: The invention provides an optical coupling, comprising: a first coupling portion and a second coupling portion, the first and second coupling portions configured to mate in kinematic constraint via a first mounting interface and at least two further mounting interfaces, wherein: the first coupling portion comprises a first mounting element and the second coupling portion comprises a socket, and the first mounting element is receivable in the socket at the first mounting interface such that the first mounting interface constrains lateral displacements of the first coupling portion relative to the second coupling portion when mated; and at least one optical channel for transmitting abeam of light along an optical axis through the optical coupling, the optical channel comprising complementary light-transmitting ports in the first and second coupling portions, wherein the optical axis is not laterally removed from the first mounting interface by more than half the distance between the first mounting interface and

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes an edge coupler having a longitudinal axis, a first ring resonator, and a second ring resonator. The first ring resonator has a first center point that is spaced from the longitudinal axis of the edge coupler by a first perpendicular distance. The second ring resonator has a second center point that is spaced from the longitudinal axis of the edge coupler by a second perpendicular distance.

Abstract: A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.

Abstract: Disclosed are an intelligent bionic human body part model detection device and a method for manufacturing same. The device comprises: a bionic human body part model (1); and multiple optical fiber grating sensing units (5) which are integrated on an optical fibre and arranged at multiple pre-determined positions of the bionic human body part model (1). The device can improve the accuracy of the detection of pressure applied to the intelligent bionic human body part model.

Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.