Abstract: Composite laminated adhesive tape coiled endlessly in roll form, comprising a central tape and first and third fastening tapes each disposed at respective ends thereof, with the surface of said fastening tapes being provided, at least partly, with pressure-sensitive adhesive, wherein in cross section the composite laminated adhesive tape coiled endlessly in roll form is folded in Z-form, with the top, slanted and bottom bars of the Z-shape being formed by separate first, second and third tape sections of first fastening tape, second central tape and third fastening tape, respectively.
Type:
Grant
Filed:
October 1, 1992
Date of Patent:
August 10, 1993
Assignee:
Minnesota Mining and Manufacturing Company
Abstract: A labeling machine is provided for the automatic transfer of labels with a pressure sensitive adhesive from a release backing to the surface of a package containing a product or to the surface of a product (hereinafter referred to as the "product". The labeling machine comprises a product transport system, a label transport system and a label transfer system. The product transport system moves the product into a labeling position. The label transport system moves labels which are on a backing from a supply reel, through a label stripper to separate the labels from the backing, and the backing continues to a takeup reel. The label transfer system picks up the labels stripped by the label stripper on a vacuum platen and applies the labels to the products being so identified.
Type:
Grant
Filed:
September 30, 1991
Date of Patent:
August 3, 1993
Assignee:
Ithaca Industries, Inc.
Inventors:
Paul R. Southwell, Walter C. Miller, Jr., Harold A. McKew, Jr.
Abstract: A thermal protection coating for a surface having a reinforcement embedded in a thermally insulative material as a main layer. This layer is formed from a succession of refractory fibrous reinforcements parallel to each other and inclined at an angle to the surface being protected. Insulative layers are located between the reinforcements. An insulating sublayer is located between the surface and the main layer and is compatible with the main layer and the surface.
Type:
Grant
Filed:
September 24, 1992
Date of Patent:
August 3, 1993
Assignee:
Aerospatiale Soiete Nationale Industrielle
Abstract: A method and apparatus for wrapping the liner of a tape, which has been peeled from the backing of a tape, around a pipe or other object in the same operation that the backing is applied. The apparatus includes a frame having at least two spaced apart bars which direct the path of the liner to an offset position which is parallel to and behind the portion of the backing which is currently being applied to the pipe. The liner is then wrapped around the pipe over the backing which has been wrapped around the pipe just in advance of the liner. The liner may also be perforated or otherwise treated before application to the pipe.
Abstract: A support beam supports a box type beam on which there is located, essentially tangentially to the shell surface of a guide roll coordinated with it, a contact surface for the adhesive tape. Perpendicular to the contact surface, a holding slot for the adhesive tape is provided on the box-shaped beam. The adhesive tape protrudes out of this holding slot with a considerable part, of which the cover foil is removed. A blowing device or blowing channels with blowing orifices bend the part of the adhesive tape protruding out of the slot upward so that, with the support beam approaching the guide roll, this part of the adhesive tape practically is in contact with the contact surface. In this way, adhesive tape can be fastened on the web end wrapping around the guide roll.
Abstract: Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.