Abstract: A projection coined onto a metal sheet, preferably an aluminum sheet, for projection welding the sheet to an adjacent metal sheet. The projection has a thickness greater than the thickness of the sheet on which it is formed. The wall of the projection surrounds a first recess and a second recess is formed in a side of the sheet opposite the projection from which the metal cold flows to form the projection. A welding gun assembly having an improved low interia, fast response to the collapse of the projection welding the sheet having the projection to the adjacent sheet.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.

Abstract: Rotary tools 340A and 340B are disposed to weld along two joining lines. For this purpose spaced welding lines the two rotary tools are inserted and into respective welding joints moved at the same time along their respective welding lines. At a position P1 of a portion of a window 210, the rotary tool 340A is retreated from the welding joint so that the tool 340 A continues to move friction stir welding on that welding joint is stopped although the welding. At a position P3, the rotary tools 340B are gradually withdrawn from their respective welding joints while they continue to move along the welding line. At a position P4, the moves of the rotary tools 340A and 340B is stopped, the rotary tool 340B is made to retreat and the joining is made to stop. Next, the rotary tools 340A and 340B are inserted and the move are started again. An insertion amount of the rotary tool 340B is larger than an insertion amount during the stop of the move of the rotary tool.

Abstract: In a method for manufacturing a metallic or ceramic body constructed in layers from a real body elements, the a real body elements are cut out of a body material connected to a support material. Subsequently, the a real body elements are sequentially connected to a respective last applied layer of a real body elements of the body to be manufactured by a physical or chemical connecting process. After connection with the last applied layer, the support material is removed from the a real body elements.

Abstract: The invention relates to a welding assembly for joining together workpieces (1, 2) along a joint between said pieces by means of friction stir welding. The welding assembly comprises a welding probe (9) intended to be advanced along said joint during the welding operation. The welding probe comprises a body (10) and a pin (20), the body being arranged to be pressed against the upper faces of the workpieces during the welding operation whereas the pin is arranged to be moved along said joint during the welding while being rotated and pressed against said workpieces. The pin (20) and the body (10) are also so arranged relative to one another as to be mutually movable, allowing said pin and said body to perform different movement patterns relative to one another.

Abstract: An improved bushing mold is disclosed for an apparatus for welding a battery terminal post to a battery bushing. The battery terminal post is electrically connected to a battery plate disposed within a battery case and the battery bushing is secured to a battery case cover with the bushing having a central bushing aperture for receiving the battery terminal post therein when the battery case cover is located on the battery case. The bushing mold comprises an electrically conductive mold body having an insulating mold insert. The mold insert comprises a first and a second insert portion with the second insert portion being replaceable independent of the first insert portion.

Abstract: The present invention relates to a method of soldering a semiconductor chip to a substrate, such as to a capsule in an RF-power transistor, for instance. The semiconductor chip is provided with an adhesion layer consisting of a first material composition. A solderable layer consisting of a second material composition is disposed on this adhesion layer. An antioxidation layer consisting of a third material composition is disposed on said solderable layer. The antioxidation layer is coated with a layer of gold-tin solder. The chip is placed on a solderable capsule surface, via said gold-tin solder. The capsule and chip are exposed to an inert environment to which a reducing gas is delivered and the capsule and chip are subjected to a pressure substantially beneath atmospheric pressure whilst the gold-tin solder is heated to a temperature above its melting point.

Abstract: An mounting apparatus for mounting an electrical component onto a substrate of an electrical assembly. The mounting apparatus employs a compensating element to facilitate the component mounting operation. The compensating element includes a spring member and a damping member. The spring member applies an optimal contact pressure for securely mounting said component without damaging the component. The damping element acts to damp the spring member during so as to effectively reduce a spring force that acts on the mounting apparatus during the component delivery stage.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: The present invention contemplates a method of fabricating a ring or disk having select regions reinforced with a metal matrix composite material. In one embodiment the method includes forming the ring or disk of a high strength iron-cobalt metal matrix composite material. The ring or disk is formed by joining a plurality of metallic members with a composite member located between the metallic members. The metallic members and the composite member form a preassembly, which is subjected to a thermal and pressure cycle so as to cause a metallurgical bonding of the metallic members.

Abstract: An insulated slag collection bed for a laser-equipped machine tool. The bed substantially insulates the machine tool base from thermal damage due to the laser beam of the machine tool. Typically the laser beam in a machine tool will have significant energy density in planes below the workpiece, and in some conditions the energy density will be sufficient to damage the machine base. The present invention protects the machine base by providing a slag collection bed which serves as a shield to absorb remnant laser energy which would otherwise strike the machine base. The shield is thermally insulated from the machine base so as to protect the machine base from the temperature rise in the shield resulting from absorbing the remnant laser energy. If, over time the shield is damaged or worn, means are provided for ready replacement of both the shield and the insulation.

Abstract: A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections between the bonding zones and between conducting lines of the two millimeter elements. The device includes a coplanar line. Such a process and device may find particular application to millimeter circuits implementing conducting lines of the microstrip type.

Abstract: The method of this invention for assembling vehicle brake shoes includes the use of linear friction welding. Two generally planar web members having arcuate edges are precisely aligned. Each of the web members preferably includes a series of projections along an outer arcuate edge. A table member that has a curvature corresponding to the outward arcuate edge of the web members is placed in contact with the projections along the outer arcuate edge of the web members. The webs and the table are moved relative to each other, under load, to cause an increase in temperature within the metal material of the webs and the table. After the temperature is sufficiently increased, but before the material reaches its melting temperature, the relative motion is stopped and the web members are precisely aligned with the table member. Then the load is increased and the table is forced against the web members. The projections are then deformed, a flash results, and the web members are fixedly joined to the table member.

Abstract: A method and apparatus for permanently joining two or more metallic vehicle frame components using magnetic impulse welding techniques. The vehicle frame may include a pair of similar or dissimilar tubular side rail members in multiple sections joined together by a plurality of transversely extending tubular or “C” of “U” shaped cross members. A plurality of similar or dissimilar material brackets are joined to the side rails and/or cross members to facilitate the attachment of other portions of the vehicle to the vehicle frame. These components are joined via an overlap joint between two individual side rail sections, a cross member section and a side rail section, or a bracket and a side rail section or a cross member section. The first component and the second component, if tubular side rails, are sized so that they may be disposed telescopically with clearance.

Abstract: A method for bonding a gyroscope component to a gyroscope body using the solid liquid Inter Diffusion (SLID) process. The resulting bond structure has a larger operating range than the bonding-materials used to create to bond. Mating material layers may be added to the bond to improve bonding between the bonding materials and the component and between the bonding materials and the gyroscope body.

Abstract: A suspension assembly for a magnetic head reduces isolation forces caused by swaging the suspension to an actuator arm of a disk drive. The suspension is formed with a first end, and a second end having an inner periphery which defines an opening. Tabs extend from the inner periphery into the opening. A base plate with a cylindrical hub is welded to the tabs and the hub extends through the inner periphery. Multiple isolation welds formed on the suspension cooperate with the tabs to isolate forces and limit force propagation when the hub is swaged to the actuator arm.

Abstract: A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is conducted after welding, there is no generation of particles or dust. The method provides superior resistance to fluorine system gases. During fluoride passivation treatment, hydrogen is added to the gas (the back shield gas) flowing through the materials to be welded. In one embodiment of the welding method, the thickness of the fluoride passivated film in a predetermined range from the butt end surfaces of the materials to be welded is set to 10 nm or less, followed by subsequent welding. Furthermore, the fluoride passivation retreatment method, includes the steps of heating at least the welded parts following welding and flowing a gas containing fluorine gas in the interior portion of the parts.

Abstract: A method for forming high frequency connections between a fragile chip and a substrate is described, wherein metal is selectively deposited on a surface of a chip and a surface of a substrate, and corresponding patterns of electrically conductive bumps are selectively evaporated on the surface of the chip and the surface of the substrate over the metal layers, to form a pattern of electrically conductive bumps having spongy and dendritic properties, placing the chip in aligned contact with the substrate where each electrically conductive chip bump mates with each corresponding electrically conductive substrate bump, and selectively applying heat and pressure to the chip and substrate causing each chip bump to fuse together with each corresponding substrate bump to form an electromechanical bond.

Abstract: A method of manufacturing a clad product in which a metallic substrate material is extruded and a cladding material is then brought into intimate contact with the heated extrudate before the extrudate has had an opportunity to cool to room temperature. The cladding material is compressed against the heated extrudate, thereby bonding the cladding material to the substrate material and forming the clad extruded metallic product. The clad extruded metallic product is then cooled to room temperature.