Abstract: A stacked dies include a substrate, a lower chip and an upper chip. A plurality of upper wires have the bent portion at the bonding pad of the substrate to reduce the height and increase the strength of the wire so as to increase the reliability of the product and to increase the space between the lower wire and the upper wire for reduction cross talk. A method of making low profile upper wire connection comprising steps of: after an upper wire is connected to a first bonding point, a capillary is moved straight up a first distance, and then the capilairy is moved away from a second bonding point thus making a first reverse action to bend the wire in an appropriate angle so as to form the first bent point. The capillary is again raised a second distance and moved downward a second reverse action to bend the upper wire by an appropriate angle so as to form the second bent point.

Abstract: By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.

Abstract: In a die-bonding machine for picking up a number of semiconductor pellets arranged in the form of a pellet array, one by one, to place a picked-up semiconductor pellet on a predetermined position, when an estimated X-direction coordinate position of the semiconductor pellet to be picked up in relation to the pellet supporting and displacing mechanism is assumed as being "x" by considering a center point of the pellet supporting and displacing mechanism as the origin of the coordinates in the X direction, the pellet supporting and displacing mechanism and the pellet picking-up and carrying mechanism are displaced so that an X-direction coordinate position PX of the pick-up position takes a position expressed by the following equation (1) and an X-direction coordinate position CX of the center point of the pellet supporting and displacing mechanism takes a position expressed by the following equation (2):PX=Ax (1)CX=-(1-A)x (2)where 0<A<1.

Abstract: A cylindrical helical seamed metal tube wherein the seam thereof is at an angle of between 1 and 25 degrees with respect to the axis of the tube. A method of making the tube comprises the steps of continuously feeding the metal strip into a tubing former to form the metal strip into a helical tube with the leading and trailing edges juxtaposed, the feeding such that the strip longitudinal axis is at a substantially constant acute angle with respect to the tube longitudinal axis of between 1 and 25 degrees. After the tube is substantially formed, applying pressure on at least the leading edge, leading portion, trailing edge and trailing portion in the direction of the cylindrical wall such that same substantially conform to the cylindrical wall. The juxtaposed leading and trailing edges are fused together to form a fused seam, and maintained in a juxtaposed position until the seam cools sufficiently to maintain the juxtaposed position. An apparatus for making the tube is also provided.

Abstract: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions.

Abstract: The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.

Abstract: Method for repairing defective soldered joints, in which in a first method step a soldering material handling device is placed with a soldering material removal device at a soldering material defect point and a defective soldering material deposit is loosened from the connection with a soldering material carrier and removed, and in which in a second method step a soldering material unit from a soldering material application device of the soldering material handling device is applied to the soldering material carrier and connected to the soldering material carrier, the application device being placed at the soldering material defect point.

Abstract: The method is directed to attaching spherical and/or non-spherical contacts to a substrate having mounting pads arranged in a predetermined array. The method includes the steps of positioning the substrate over a fixture, and positioning a stencil over the substrate. The stencil has openings arranged in the predetermined array, and is held and aligned by the fixture in such a position that the openings of the stencil are aligned with the mounting pads of the substrate. Soldering paste is applied onto the stencil so as to fill the openings of the stencil wherein a dab of paste is left in the openings of the stencil. Next, a contact loading plate is positioned over the substrate, the plate having openings arranged in the predetermined array. The plate is held and aligned by the fixture in such a position that the openings of the plate are aligned with the mounting pads of the substrate. The openings of the is contact loading plate are then filled with contacts.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.

Abstract: A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is elimina

Abstract: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions.

Abstract: A heat suppressing wrap is provided for suppressing the transfer of thermal energy along a pipe during a thermal joining operation, such as a high temperature, open flame welding, brazing or soldering operation. The heat suppressing wrap is a blended fabric cloth made of at least 50% cotton that is saturated with a liquid solution of a heat, fire and smoke inhibiting agent, and preferably, a fire fighting agent. The fire fighting agent is preferably a fire fighting foam, and most preferably, is PYROCAP B-136.TM. fire fighting foam manufactured by PYROCAP International, Inc. of Woodbridge, Va. Short lengths of the wrap are rolled and placed in a container with the liquid solution so that the cloth wraps remain saturated with the fire fighting agent. The wraps are then positioned, and preferably wrapped, over the pipe adjacent a pipe joint to greatly reduce the transfer of thermal energy along the pipe generated by the thermal joining operation.