Abstract: Apparatuses, systems, and methods for main sketch and slim sketch circuits for address tracking. The main sketch circuit receives a row address and changes selected count values in a first storage structure based on hash values generated based on the row address. Those count values are compared to a first threshold, and if that threshold is exceeded, a slim sketch circuit also receives the row address and changes selected count values in a second storage structure based on hash values generated based on the row address. Based on the selected count values from the first storage structure, the second storage structure, or combinations thereof, the row address may be determined to be an aggressor address.

Abstract: An in-memory computation device and computation method are provided. The in-memory computation device, including a memory cell array, an input buffer, and a sense amplifier, is provided. The memory cell array includes a memory cell block. The memory cell block corresponds to at least one word line, and stores multiple weight values. Memory cells on the memory cell block respectively store multiple bits of each weight value. The input buffer is coupled to multiple bit lines, and respectively transmits multiple input signals to the bit lines. The memory cell array performs a multiply-add operation on the input signals and the weight values to generate multiple first operation results corresponding to multiple bit orders. The sense amplifier adds the first operation results to generate a second operation result according to the bit orders corresponding to the first operation results.

Abstract: An in-memory computing apparatus and a computing method thereof are provided. A memory array includes a shifted weight storage area that stores shifted weight values, a shift information storage area that stores the number of shift units, and a shift unit amount storage area that stores a shift unit amount. A shift restoration circuit restores a weight shift amount of a shifted sum-of-products according to the number of shift units of the shifted weight values and a column shift unit amount, so as to generate multiple restored sum-of-products.

Abstract: A memory card includes a plurality of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 time that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.

Abstract: A memory system includes: a memory controller suitable for: generating a normal refresh command and a target refresh command when a number of inputs of an active command reaches a certain number, and providing the active command, the normal refresh command, the target refresh command, and an address; and a memory device including a plurality of banks and suitable for: performing a target refresh operation on one or more word lines of at least one bank in response to the target refresh command, determining a row hammer risk level per bank by counting, within a periodic interval, a number of inputs of the target refresh command per bank based on the address, and performing a hidden refresh operation corresponding to the row hammer risk level per bank in response to the normal refresh command.

Abstract: A memory apparatus comprises: a sampling circuit for sampling an input address through a sampling method corresponding to a first selection signal among at least two sampling methods, a storage circuit for storing up to N number of addresses having different values among sampled addresses received from the sampling circuit, an arranging circuit for determining an output sequence of addresses stored in the storage circuit through an arranging method corresponding to a second selection signal among the two arranging methods, and setting, as a target address, an address outputted according to the output sequence, a selection control circuit for setting each of the first selection signal and the second selection signal based on a state of the storage circuit, and a refresh operation circuit for controlling a target refresh operation on a row of memory cells corresponding to the target address.

Abstract: Systems and methods for providing memory access commands to memory circuitry using a multi-clock cycle memory command protocol is described. A command decoder (or controller) of the memory circuitry may efficiently receive a memory access request (or a memory command) provided using multiple clock cycles. For example, the command decoder may receive a header and a first portion of address bits of target memory cells of the memory command in a first clock cycle and a second portion of the address bits of the target memory cells in a subsequent clock cycle. Accordingly, the memory circuitry may receive a memory command provided over multiple clock cycles with one header. Such memory commands may efficiently include a high number of address bits received using input circuitry of the memory circuitry.

Abstract: A memory includes: a random seed generation circuit suitable for generating a random seed including process variation information; a random signal generator suitable for generating a random signal that is randomly activated based on the random seed; and an address sampling circuit suitable for sampling an active address while the random signal is activated.

Abstract: A memory device includes a memory cell array, a random bit generator, a comparator and a refresh controller. The memory cell array includes a plurality of memory cells coupled to a plurality of word-lines. The random bit generator generates a random binary code having a predetermined number of bits. The comparator compares the random binary code and a reference binary code to output a matching signal based on a result of the comparison. The refresh controller refreshes target memory cells from among the plurality of memory cells based on addresses accessed by a memory controller during a sampling period randomly determined based on the matching signal and a refresh command from the memory controller.

Abstract: A system and method for operating a memory cell is provided. A non-volatile memory storage device includes an array of memory cells of differential or single-ended type. In an embodiment, a regulator is coupled to a sense amplifier. The regulator is configured to generate a voltage to gate terminals of one or two transistors of the sense amplifier. In the differential type, the voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a maximum current flowing in a memory cell being in a RESET state and a fixed current. In the single-ended type, the regulated voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a fixed current and the reference current generated by the reference current source across temperature.

Abstract: A serializer includes data input circuits configured to receive N-number of pieces of data in parallel, where N is an even number, data connection circuits configured to receive internal clock signals having different phases in different arrangements, and data output circuits configured to output the N-number of pieces of data in sequence in a single cycle of each of the internal clock signals, wherein the data connection circuits operate the data output circuits such that the data output circuits, in response to the internal clock signals, output corresponding data of the N-number of pieces of data in an enable period in the single cycle and have a high impedance state in a disable period in the single cycle.

Abstract: A lookup table circuit constituting a programmable logic device includes: a memory cell array including a plurality of memory cells, each having a resistive memory element; a selection circuit connected to the memory cell array and configured to output, to the memory cell array, a single cell-select signal or two or more cell-select signals for selecting a single memory cell or two or more memory cells among the plurality of memory cells, based on input of a plurality of logic signals; and a read circuit connected to the memory cell array and configured to read data from the single memory cell or the two or more memory cells selected by the single cell-select signal or the two or more cell-select signals, among the plurality of memory cells. The selection circuit is separated from a path along which the read circuit is configured to read data from the memory cell array.

Abstract: A method of operating a memory device including receiving a multilevel signal having M levels transmitted by an external controller through a clock receiving pin, where M is a natural number greater than 2, and decoding the multilevel signal to restore at least one of Data Bus Inversion (DBI) data, Data Mask (DM) data, Cyclic Redundancy Check (CRC) data, or Error Correction Code (ECC) data may be provided. The multilevel signal is a clock signal transmitted by the external controller, and is a signal swinging based on an intermediate reference signal that is an intermediate value between a minimum level and a maximum level among the M levels.

Abstract: Apparatuses and techniques are described for detecting latent defects in a memory device by considering both physical segment and logical segment fail bits in an erase operation. The erase operation involves performing a series of erase loops until the memory cells pass an erase-verify test. The passing of the erase-verify test is based on counting memory cells in different logical segments which fail the verify test and determining that the count is less than a logical segment threshold for each logical segment. Subsequently, the technique involves counting memory cells in each physical segment which fail the erase-verify test and determining whether the count is less than a physical segment threshold. If the count is equal to or greater than the physical segment threshold for one or more of the physical segments, the block of memory cells is marked as being bad.

Abstract: A semiconductor device includes a first pad, a comparison circuit, and a control circuit. A first voltage may be applicable to the first pad. The comparison circuit may include a first input terminal connected to the first pad, a second input terminal to which a second voltage is applicable, and an output terminal configured to output a comparison result between the first voltage and the second voltage. The control circuit may be configured to output, external to the semiconductor device, a signal based on the comparison result.

Abstract: A hammer refresh row address detector includes a control logic unit that receives a row address applied along with an active command, to increase a hit count stored in a corresponding entry when the row address is present in candidate aggressor row addresses stored in n entries. The control logic determines a candidate aggressor row address stored in an entry in which the hit count equals a threshold value to be a target aggressor row address. The control logic generates a victim row address adjacent to the target aggressor row address as a hammer refresh row address to accompany a hammer refresh command. The control logic increases the miss count value when the row address is not present in the candidate aggressor row addresses stored in the n entries and no hit count within the n entries is identical to the miss count value.

Abstract: Methods, systems, and devices for voltage adjustment based on, for example, pending refresh operations are described. A memory device may periodically perform refresh operations to refresh volatile memory cells and may at times postpone performing one or more refresh operations. A memory device may determine a quantity of pending (e.g., postponed) refresh operations, such as by determining a quantity of refresh intervals that have elapsed without receiving or executing a refresh command, among other methods. A memory device may pre-emptively adjust (or cause to be adjusted) a supply voltage associated with the memory device or memory device component based on the quantity of pending refresh operations to prepare for the current demand associated with the performing the one or more pending refresh operations. For example, the memory device may increase a supply voltage associated with one or more components to prepare for performing multiple pending refresh operations.

Abstract: A semiconductor memory device includes: an input control circuit suitable for providing an active address which is input together with an active command, as an input address; a plurality of latches suitable for sequentially storing, as a latch address, the input address according to input control signals and outputting the latch addresses as a target address according to output control signals; a plurality of counters respectively corresponding to the latches and each suitable for increasing, when the active address matches the latch address stored in the latch, a counting value corresponding to the latch; and a refresh controller suitable for dividing the counters and the latches into a plurality of groups based on the counting values and generating, in response to a refresh command, reset signals for initializing the counters included in one group of the groups.

Abstract: Methods, systems, and devices for differential amplifier schemes for non-switching state compensation are described. During a read operation, a first node of a memory cell may be coupled with an input of differential amplifier while a second node of the memory cell may be biased with a first voltage (e.g., to apply a first read voltage across the memory cell). The second node of the memory cell may subsequently be biased with a second voltage (e.g., to apply a second read voltage across the memory cell), which may support the differential amplifier operating in a manner that compensates for a non-switching state of the memory cell. By compensating for a non-switching state of a memory cell during read operations, read margins may be increased.

Abstract: A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.