Abstract: A lithographic printing plate precursor includes: a support having a surface, a contact angle of water droplet in air on which is 70° or more; and a photosensitive layer, wherein the support has, on a surface of the support, a compound having a functional group X, the functional group X is a functional group capable of forming a chemical bond with a compound having a functional group Y which can interact with the functional group X, when the functional group X is brought into contact with the compound having a functional group Y, to adsorb the compound having a functional group Y on the surface of the support so as to decrease the contact angle of water droplet in air on the surface of the support to 30° or less.

Abstract: A multilayer dry film resist includes two or more organic films which can be patterned; the multilayer dry film resist includes a base substrate, a first organic film disposed on the base substrate, and a second organic film disposed on the first organic film and including a photosensitizer.

Abstract: A method of manufacturing a color filter substrate is provided. The color filter substrate includes a substrate, a light-shielding layer, and a plurality of color filter patterns. The substrate has a plurality of annular trough areas, a plurality of central areas, and a light-shielding area positioned among the annular trough areas. Each of the annular trough areas has an inner edge connected to the central area and an outer edge connected to the light-shielding area. The light-shielding layer is disposed on the light-shielding area and extends from the outer edges of the annular trough areas to the top of the annular trough areas. The color filter patterns are disposed on the annular trough areas and the central areas, and the color filter patterns are in contact with a side surface and a part of the bottom surface of the light-shielding layer.

Abstract: Negative-working imageable elements such as lithographic printing plate precursors, include a free-radically polymerizable component, an initiator composition that is capable of generating free radicals sufficient to initiate polymerization of the free-radically polymerizable component upon exposure to imaging radiation in the presence of a radiation absorbing compound, a radiation absorbing compound, an aerobic free radical inhibitor, optionally a polymeric binder that is not a free radically polymerizable component, and an anaerobic free radical inhibitor. The molar ratio of the anaerobic free radical inhibitor to the aerobic free radical inhibitor is at least 1:1. This combination of inhibitors provides increased shelf life and good latent image stability particularly when the element includes a polymeric topcoat layer that functions as an oxygen barrier.

Abstract: Compounds of the formula (I), wherein A1 is formula (II); A2 is formula (III); A3 is formula (IV); A4 is formula (V); w, x, y and z independently of each other are an integer from 0-4, provided that the sum of x+y+z is an integer from 2-4, corresponding to the valency of Q; M1, M2, M3 and M4 for example are a direct bond, CO or O; Y for example is a direct bond or S; Q is a (x+y)-valent linking group; R1 is for example hydrogen, C1-C20alkyl or phenyl or naphthyl; R2 and R?2 for example are is hydrogen or C1-C20alkyl; R3, R4, R?3, R?4, R?3 and R?4 for example are hydrogen, halogen, phenyl, or C1-C20alkyl; and R24 is for example a direct bond; exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: A dithiane derivative, having a structure expressed by the following general formula 1: where R1 is —H, or —CH3, a polymer containing a monomer unit containing the dithiane derivative, a resist composition containing the polymer, and a method for manufacturing a semiconductor device using the resist composition.

Abstract: A printing plate having a substrate and a radiation sensitive, negative working, organic, polymerizable, photosensitive (PS) resin coating non-ionically adhered to the substrate such that the cohesion of the PS coating exceeds the adhesion of the PS coating to the substrate. The PS coating contains active components that participate in radiation induced polymerization, all of which active components are soluble in non-aqueous solvents and none of which active components are soluble or dispersible in any of the group of fluids consisting of water, fountain solution, ink, and press ink. The PS coating has sufficient cohesion and surface tack to adhere to and be mechanically pulled off the substrate by press ink as particulates without dissolution or dispersion into the press ink.

Abstract: Anti-reflective coating materials for ultraviolet photolithography include at least one absorbing compounds and at least one pH tuning agent that are incorporated into spin-on materials. Suitable absorbing compounds are those that absorb around wavelengths such as 365 nm, 248 nm, 193 nm and 157 nm that may be used in photolithography. Suitable pH tuning agents not only adjust the pH of the final spin-on composition, but also influence the chemical performance and characteristics, mechanical performance and structural makeup of the final spin-on composition that is part of the layered material, electronic component or semiconductor component, such that the final spin-on composition is more compatible with the resist material that is coupled to it. A method of making absorbing and pH tuned spin-on materials includes combining at least one organic absorbing compound and at least one pH tuning agent with at least one silane reactant during synthesis of the spin-on materials and compositions.

Abstract: A patterned composite ferroelectric layer, having ferroelectric electronic properties, on a substrate. Individual layers are each made of metal acrylate compounds, a photoinitiator compound and an acrylate crosslinking compound. The individual layers are stacked on the substrate to form a composite layer. A photomask is formed on the composite layer. Unmasked areas of the composite layer are irradiated with ultraviolet light. A solvent removes non-irradiated areas of the composite layer from the substrate. The patterned composite layer is heated in an oxygen atmosphere to cause a chemical reaction among the metal acrylate compounds and oxygen, a patterned composite ferroelectric layer being formed on the substrate.

Abstract: Embodiments of the invention relate to a method of functional materials deposition using a polymer template fabricated on a substrate. Such template forms an exposed and masked areas of the substrate material, and can be fabricated using polymer resists or Self-assembled monolayers. Deposition is performed using an applicator, which is fabricated in the shape of cylinder or cone made of soft elastomeric materials or laminated with soft elastomeric film. Functional materials, for example, metals, semiconductors, sol-gels, colloids of particles are deposited on the surface of applicator using liquid immersion, soaking, contact with wetted surfaces, vapor deposition or other techniques. Then wetted applicator is contacted the surface of the polymer template and rolled over it's surface. During this dynamic contact functional material is transferred selectively to the areas of the template. Patterning of functional material is achieved by lift-off of polymeric template after deposition.

Abstract: A negative-working lithographic printing plate precursor have an outermost imageable layer that includes an oxygen scavenger and shelf-life stabilizer that is represented by either Structure (I) or Structure (II) below: HOOC—Ar—N(R1)(R2)??(I) HOOC—R5—N(R6)(R7)??(II) wherein Ar is a phenylene or naphthylene group, R1 and R2 are independently alkyl, alkenyl, alkynyl, phenyl, phenoxy, —R5OH, —CH2—C(?O)—R3, or —CH2—C(?O)O—R4 groups, R3 is hydrogen or an alkyl or phenyl group, R4 is an alkyl or phenyl group, R5 is an alkylene group, R6 and R7 are independently hydrogen or an alkyl, —R5OH, —R5C(?O)—R8, or —R5C(?O)OR9 group, R8 is hydrogen or an alkyl group, and R9 is an alkyl group, provided that the oxygen scavenger has no more than one carboxyl group.

Abstract: This invention relates to iodonium salts, acetal copolymers and polymer binders comprising functional groups capable of undergoing cationic or radical polymerization, their method of preparation and their use in the preparation of coating solutions and coatings. This invention also relates to coatings containing the iodonium salts, acetal copolymers and/or polymer binders and to negative working lithographic printing plates comprising these coatings.

Abstract: A positive resist composition including a polymeric compound (A1) having a structural unit (a0) represented by general formula (a0-1) (R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, R2 represents a divalent linking group, R3 represents a cyclic group containing —SO2— within the ring skeleton thereof) and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group, an acid-generator component (B) and a fluorine-containing polymeric compound (F1) having a structural unit containing a base dissociable group.

Abstract: A multi-layer, positive-working lithographic printing plate precursor can be imaged with infrared radiation and processed in a single step using a single processing solution that has a pH greater than 6 and up to about 11. This single processing solution both develops the imaged precursor and provides a protective coating that need not be rinsed off before lithographic printing.

Abstract: A resist protective coating material is provided comprising a polymer having a partial structure of formula (1) wherein R0 is H, F, alkyl or alkylene, and R1 is fluorinated alkyl or alkylene. In a pattern-forming process, the material forms on a resist film a protective coating which is water-insoluble, dissolvable in alkaline developer and immiscible with the resist film, allowing for effective implementation of immersion lithography. During alkali development, development of the resist film and removal of the protective coating can be simultaneously achieved.

Abstract: Embodiments of the invention relate to methods useful in the fabrication of nanostructured devices for optics, energy generation, displays, consumer electronics, life sciences and medicine, construction and decoration. Instead of nanostructuring using colloids of particles, special vacuum deposition methods, laser interference systems (holography), and other low-throughput limited surface area techniques, we suggest to use nanotemplate created by novel nanolithography method, “Rolling mask” lithography. This method allows fast and inexpensive fabrication of nanostructures on large areas of substrate materials in conveyor-type continuous process. Such nanotemplate is then used for selective deposition of functional materials. One of embodiments explains deposition of functional materials in the exposed and developed areas of the substrate. Another embodiment uses selective deposition of the functional material on top of such template.

Abstract: A graphene oxide (GO) target is exposed to light having power sufficient to initiate a deoxygenation reaction of the GO target. The deoxygenation reaction of the GO target transforms the GO target to graphene.

Abstract: Devices having a thin film or laminate structure comprising hafnium and/or zirconium oxy hydroxy compounds, and methods for making such devices, are disclosed. The hafnium and zirconium compounds can be doped, typically with other metals, such as lanthanum. Examples of electronic devices or components that can be made include, without limitation, insulators, transistors and capacitors. A method for patterning a device using the materials as positive or negative resists or as functional device components also is described. For example, a master plate for imprint lithography can be made. An embodiment of a method for making a device having a corrosion barrier also is described. Embodiments of an optical device comprising an optical substrate and coating also are described. Embodiments of a physical ruler also are disclosed, such as for accurately measuring dimensions using an electron microscope.

Abstract: In a method of forming patterns of a semiconductor device, a semiconductor substrate defining photoresist patterns formed over a target etch layer is provided. An auxiliary layer is formed over the semiconductor substrate and the photoresist patterns. The auxiliary layer formed on a surface of the photoresist patterns is denatured into first auxiliary patterns. A photoresist film is formed over the semiconductor substrate, the first auxiliary patterns, and the auxiliary layer. The auxiliary layer formed below the photoresist film is denatured into a second auxiliary pattern. Here, the auxiliary layer remains only between the photoresist patterns. Etch mask patterns, including the photoresist patterns and the auxiliary layer, are formed by removing the photoresist film and the first and second auxiliary patterns.

Abstract: A semiconductor device is manufactured by a method including processes of trimming and molding resist patterns. A resist layer formed on a substrate is exposed and developed to form the resist patterns. The resist patterns are trimmed using a first gas plasma to change the profiles of the resist patterns. Widths of the trimmed resist patterns are increased using a second gas plasma to form processed resist patterns.