Abstract: A fan includes a frame, a stator, a rotor and a magnetic member. The frame comprises a base. The stator is connected to the frame. The rotor has a shaft. The magnetic member, corresponding to the shaft, is disposed on the base to attract the shaft. The magnetic member and the shaft are spaced apart with the base disposed therebetween. The magnetic member may be disposed outside or inside the frame or on the stator.

Abstract: Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200° C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.

Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract: An impeller, which is driven by a stator, includes a conducting shell, a hub and a plurality of blades. The conducting shell covers at least one side of the stator. The hub covers the conducting shell. At least one air gap is formed between the hub and the stator. A top portion of the hub has an opening to partially expose a top portion of the conducting shell. At least one airflow passage is formed between an inner wall of the hub and an outer surface of the conducting shell. The airflow passage has at least one inlet connected with the opening and at least one outlet connected with the air gap. The blades are disposed around the circumferences of the hub.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: In an exemplary embodiment, a method for a magnetic sensor includes forming a first conductive layer over a substrate containing circuitry, forming a dielectric layer over the first conductive layer, forming a second conductive layer over the dielectric layer such that the first conductive layer, the dielectric layer, and the second conductive layer form a first capacitor, and providing first and second terminals, wherein the first terminal is coupled to the first conductive layer and the second terminal is coupled to the second conductive layer.

Abstract: A water stopping apparatus for causing a water stopping material to penetrate exposed core wires of a sheathed wire forming a wire harness includes a pair of dies which can abut against each other in a mutually opposed condition, thereby forming a pressurizing space in which an exposed portion of the core wires of the wire harness can be mounted, a filling portion for filling a water stopping material in the pressurizing space in which the exposed portion of the core wires is mounted, and a pressurizing portion for supplying pressurized gas into the pressurizing space to pressurize the same.

Abstract: Metal parts can be economically fabricated by a metal stamping that comprises preforming a piece of wire to have a shape corresponding to the 2-dimensional configuration of a desired product workpiece, flattening the wire to form a metal blank, and subjecting the metal blank to metal stamping to obtain the desired product workpiece. The process can significantly reduce the amount of scrap material and thereby reduce manufacturing costs.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.

Abstract: A method for electrically connecting disk drive suspension assembly elements including positioning a first component having a first terminal with an edge adjacent to a second component having a second terminal and applying solder to form a solder joint over the edge of the first terminal and onto the second terminal. Heat to melt the solder is provided from a source that is physically remote from the components.

Abstract: A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: A servo track writer (STW) clockhead radius jig is disclosed. One embodiment provides a hard disk drive assembly including a base having a cutaway portion to provide visual access therein. In addition, a disk is mounted in the hard disk drive assembly, this disk having an indicator thereon to indicate a required radius setting for a clockhead.

Abstract: The method manufactures a nozzle plate, and comprises: a patterned resist formation step of forming a patterned resist on a flat surface of a matrix substrate, the patterned resist having a shape corresponding to a diameter of nozzle holes in a nozzle plate to be formed, the patterned resist having a thickness corresponding to a length of the nozzle holes; a nozzle length regulating member placement step of placing the nozzle length regulating member having a flat surface onto the patterned resist in such a manner that the flat surface of the nozzle length regulating member faces the flat surface of the matrix substrate across the patterned resist; and a nozzle plate formation step of forming the nozzle plate by plating with the patterned resist between the flat surface of the matrix substrate and the flat surface of the nozzle length regulating member.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.

Abstract: In a method of producing a conductor pattern on a substrate and, in particular, of producing RFID labels, the conductive base material and the substrate material are initially provided, further the conductive base material is punched to obtain a conductor pattern and a residual base material. The conductor pattern is connected to the substrate material, and the residual base material is removed.

Abstract: An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.

Abstract: A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface, by supporting the electronic component with the support surface so that the electronic component does not come into contact with the inlet and so that a part of a surface of the electronic component adjacent to the support surface is exposed out of the support surface and by attracting a region of the electronic component exposed out of the support surface toward the inlet; and electrically coupling the electrode and a conductive pattern with the electronic component fixed to the supporter.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.