Abstract: A device and a method for applying cover sheets to cross-bottoms of tubular sections made of a plastic material. The device includes conveyor devices for transporting the tubular sections and for depositing the cover sheets on the cross-bottoms in a deposit area. The device includes a hot gas device with a gas heater and a nozzle connected to the gas heater and oriented toward the deposit area for the cover sheets so when gas is supplied to the gas heater, the gas flows along a flow path from the gas supply through the gas heater and the nozzle into the deposit area. The hot gas device has a hot gas reservoir with an internal volume for the temporary storage of hot gas, the flow path running through the hot gas reservoir. A gas mass flow ({dot over (m)}1, {dot over (m)}2, {dot over (m)}ges) of gas supplied to the gas heater is adjustable by a control.

Abstract: An apparatus, system and method for adhesive fixturing include UV light sources in alignment with gripper pins communicating through a fixture. A bus connector operably connects the UV light sources to a control box of the workcell. The control box controls the illumination of the UV light sources through the bus connector.

Abstract: Systems and methods are provided for controlling welding. One embodiment is a method for controlling welding. The method includes initiating induction welding by operating an induction coil along a weld interface of a first composite part comprising a matrix of thermoplastic reinforced by fibers, in order to join the first composite part to a second composite part, determining a measured magnetic field strength at a location distinct from the induction coil, and determining a welding temperature at the weld interface of the first composite part based on the measured magnetic field strength.

Abstract: In an accordance with an exemplary embodiment, an energy director is provided for use in ultrasonic welding, the energy director including: a first raised region extending upward from a surface of a base of a component to be welded; and a second raised region extending upward from the first raised region; wherein the first raised region is disposed underneath the second raised region, such that when material of the second raised region melts, the material of the first raised region is not melted and maintains an adhesive bond line thickness.

Abstract: A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.

Abstract: The invention relates to a method and to an apparatus for producing a plug-through connection arrangement of a plurality of electrical cables (1a-1d) and/or fluid-conducting hoses, having a sheathing (2) consisting of a plastic, which extend, arranged adjacently spaced apart from each other, through associated openings (3a-3d) of a plastic component (4), comprising the following steps: providing (A) the plastic part (4) with the pre-produced plurality of openings (3a-3d), installing (B) the electrical cables (1a-1d) and/or fluid-conducting hoses through the associated openings (3a-3d), such that the outer wall of the sheathing (2), which consists of plastic, comes into contact with the inner wall of the respective openings (3a-3d) of the plastic component (4), thermal welding (C) of the electrical cables (1a-1d) and/or fluid-conducting hoses to the plastic component (4) in the region of the respective opening (3a-3d), in order to produce an integrally sealing component bond, wherein at least two laser beam un

Abstract: A welding station for an installation for manufacturing packages with pads, the welding station including a plurality of longitudinal welding heads. Each welding head is configured to weld to one another two superposed sheets as said sheets advance in a first direction and may include a welder to apply heat on an action area. Each welding head has a main body, a first traction belt wound in the main body and a second traction belt wound to said main body, parallel to the first traction belt and separated from the first traction belt by a separation gap in a second direction which is transverse to the first direction. The action area is arranged in said separation gap, between both traction belts. Each of the longitudinal welding heads is configured to be able to be moved along the second direction.

Abstract: A method of making an aircraft blade is provided. The method comprises the steps of: assembling two or more fibre-reinforced thermoplastic composite parts into a blade assembly; and welding the fibre-reinforced thermoplastic composite parts together utilising an additional thermoplastic located at least at locations where the parts will abut when assembled. The additional thermoplastic has a melting or softening temperature lower than a melting temperature of each of the fibre-reinforced thermoplastic composite parts being assembled. The step of welding comprises heating the blade assembly to a temperature above the melting/softening temperature of the additional thermoplastic and below the melting temperature of each of the fibre-reinforced thermoplastic composite parts so as to melt/soften the additional thermoplastic and thereby weld the fibre-reinforced thermoplastic composite parts together to form the aircraft blade.

Abstract: The invention relates to a modification process for modifying a biaxially oriented pipe, comprising a) providing a biaxially oriented pipe made by stretching a tube made of a thermoplastic polymer composition in the axial direction and in the peripheral direction, b) placing an insert within an end portion of the pipe, wherein the outer periphery of the cross section of the insert substantially matches the inner periphery of the cross section of the pipe and c) heating the end portion such that the end portion axially shrinks while the inner periphery of the cross section of the end portion is substantially maintained, to obtain a modified biaxially oriented pipe with a thickened end portion.

Abstract: A method of directly joining a polymer to a metal along a joint interface through the formation of C—O-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create C—O-M chemical bonds between the metal and the polymer.

Abstract: The invention relates to a method for the production of a laminated core comprising a stack of metallic plates, in which: —a metallic sheet (2, 3) is chosen, having a first main face (4, 8) and a second main face (6, 9) which are coated with a sub-layer comprising at least one material selected from epoxides and polyepoxides, —a layer (12, 20) with a thickness of less than 500 ?m of a precursor composition selected from partly epoxides and at least partly cross-linked polyepoxides is placed in contact with said sub-layer, —a layer (16, 22) with a thickness of less than 500 ?m of a curing composition comprising at least one crosslinking agent is placed in contact with said sub-layer, —said metallic sheet is punched, —the metallic plates are then superposed to each other.

Abstract: According to an embodiment of the present disclosure, a method for manufacturing a 3D structure includes: making a plurality of single piece molds having a same surface shape as a portion of a surface of the 3D structure; making a plurality of exterior members having the same surface as the portion of the surface of the 3D structure by using the respective single piece molds; and forming the 3D structure by connecting the plurality of exterior members.

Abstract: A system (300) for closing mailers includes a forming funnel (320) and a fusing device (310). The forming funnel includes funneling surfaces that receive an opening of a mailer in an insertion direction (302) and constrain the opening of the mailer after the opening of the mailer is inserted. The funneling surfaces are arranged to continue constraining the opening of the mailer as the mailer moves in a sliding direction (304). The fusing device includes a slot that receives the constrained opening of the mailer from the forming funnel. The fusing device applies pressure and heat to the opening of the mailer as the opening of the mailer moves through the slot. The pressure and the heat applied by the fusing device cause portions of the opening to fuse together to close the mailer.

Abstract: One or more embodiments of the present invention provide an adhesion method that provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles whose shell layers have a cyano group in a specific amount, and blocked urethane.

Abstract: The seal plate assembly of this invention includes a base plate, an insulator pad positioned on the base plate, an electric heater pad positioned on the insulator pad and a pair of seal plates positioned on the electric heater pad, all of which have registering vacuum openings formed therein. The base plate, insulator pad, heater pad and seal plates are bolted together. The seal plates have spaced-apart cavities formed therein. A support plate is positioned in each of the cavities with each of the support plates having a length and width which is less than the length and width of the respective cavity to create a vacuum space at the perimeter of the support plates. The support plates are spaced above the bottom of the cavities.

Abstract: Described herein are various embodiments directed to rotor devices, methods, and systems. Embodiments of rotors disclosed herein may be used to characterize one or more analytes of a fluid. A method may include bonding a first layer and a second layer using two-shot injection molding. The first layer coupled to the second layer may collectively define a set of wells. The first layer may be substantially transparent. The second layer may define a channel. The second layer may be substantially absorbent to infrared radiation. A third layer may be bonded to the second layer using infrared radiation. The third layer may define an opening configured to receive a fluid. The third layer may be substantially transparent. The channel may establish a fluid communication path between the opening and the set of wells.

Abstract: An induction sealing device for induction welding of a packaging material is disclosed. In some embodiments, the induction sealing device comprises an inductor coil configured to induce an alternating current in a metal foil of the packaging material for inductive heating thereof. The induction sealing device can further comprise a magnetic insert encapsulating the inductor coil apart from an outer portion of the inductor coil, and the outer portion can be arranged towards the packaging material to be sealed. In some embodiments, the magnetic insert is configured to interact with the packaging material to be sealed via at least one interactive surface. In some embodiments, the induction sealing device comprises a connection unit. The connection unit can comprise a parallel connection configured to connect to the inductor coil and to an AC power source. A corresponding method of manufacturing an induction sealing device is also disclosed.

Abstract: The disclosure provides a method for forming an information carrying card or a core layer of an information carrying card using a radiation curing, and an apparatus configured to provide such a radiation curing. The method includes providing a carrier layer that defines at least one cavity, providing an inlay layer supporting at least one electronic component, and positioning at least a portion of the inlay layer in the at least one cavity. The method further comprises dispensing a radiation crosslinkable polymer composition over the inlay layer, and irradiating the radiation crosslinkable polymer composition.

Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

Abstract: An apparatus for wafer bonding includes a transfer module and a plasma module. The transfer module is configured to transfer a semiconductor wafer. The plasma module is configured to apply a first type of plasma to perform a reduction operation upon a surface of the semiconductor wafer at a temperature within a predetermined temperature range to convert metal oxides on the surface of the semiconductor wafer to metal, and apply a second type of plasma to perform a plasma operation upon the surface of the semiconductor wafer at a room temperature outside the predetermined temperature range to activate a surface of the semiconductor wafer.