Abstract: A decorative component includes a plateable resin body portion that is light-transmissive. A thin intermediate layer of material is electrolessly deposited over the body portion. The intermediate layer is laser ablated to selectively remove the intermediate layer and expose the light transmissive portion. The part is then subjected to electroplating. The ablated areas do not receive the metal layers of the electroplating, thereby defining a pattern defined by the ablation. The laser ablation may define an outline, leaving the thin intermediate layer within the outline that is electrically isolated from areas outside of the outline. The electroplating process will not apply layers to the isolated areas, and the intermediate layer therein will dissolve, exposing the light transmissive body portion. An opposite side of the part is also exposed and transmissive, such that light will pass through the body portion and illuminate the pattern.

Abstract: Methods, apparatuses, and systems for making prepregs are disclosed. A method may include depositing a resin material onto a surface of a fiber bed and forming a number of discrete resin regions thereon. A distance between the resin regions may be measured to provide desired exposed portions of the surface to facilitate permeation of air through the exposed portions of the surface in a direction perpendicular to a plane of the fiber bed during a curing process of the prepreg.

Abstract: Single crystals of semiconductor material are produced by an FZ method, wherein a molten zone is created between a feed rod and a growing single crystal; the method involving melting feed rod material in a high frequency magnetic field of a first induction coil; crystallizing material of the molten zone on top of the growing single crystal; rotating the growing single crystal about an axis of rotation and changing the direction of rotation and the speed of rotation according to a predetermined pattern; and imposing an alternating magnetic field of a second induction coil on the molten zone, wherein the alternating magnetic field is not axisymmetric with respect to the axis of rotation of the growing single crystal.

Abstract: A silicon carbide wafer is provided, wherein within a range area of 5 mm from an edge of the silicon carbide wafer, there are no low angle grain boundaries formed by clustering of basal plane dislocation defects, and the silicon carbide wafer has a bowing of less than 15 ?m.

Abstract: Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a SORI value of 2.5 ?m or less, as measured with the back surface of the indium phosphide substrate facing upward.

Abstract: The present invention relates to a cover member including a transparent base having first and second main surfaces, an antifouling layer formed on at least a part of the first main surface, a printed layer formed on at least a part of the second main surface, and an adhered member adhered on an antifouling layer-side surface, in which when an adhered-member-contact-portion projected region is defined as a prescribed region in the second main surface, the printed layer is provided on at least a part of a near-boundary region defined as a region from a boundary of the adhered-member-contact-portion projected region to an inward at 1,000 ?m from the boundary, and no printed layer is provided on at least a part of an inner region defined as a region 500 ?m or more inside from the boundary of the adhered-member-contact-portion projected region.

Abstract: A seed crystal for single crystal 4H-SiC growth of the present invention is a disk-shaped seed crystal for single crystal 4H-SiC growth having a diameter of more than 150 mm and having a thickness within a range of more than or equal to 1 mm and less than or equal to 0.03 times of the diameter, in which one surface on which the single crystal 4H-SiC is grown is a mirror surface and an Ra of the other surface is more than 10 nm, and an absolute value of magnitude of waviness in a state where the seed crystal is freely deformed so that an internal stress distribution is reduced is less than or equal to 12 ?m.

Abstract: A method for manufacturing a floor panel having a substrate and a top layer. The top layer may have a decorative layer that includes a digital print and a transparent or translucent wear layer. The method may involve providing the substrate with the digital print by jetting one or more inks from a set of inks using a digital inkjet printer. The ink may include a binding agent and/or a primer or adhesion layer may be provided between the digital print and the transparent or translucent wear layer. The digital print may be performed directly on the substrate. The transparent or translucent wear layer may be laminated on top of the printed substrate.

Abstract: A foldable display device includes: a display panel; a window disposed on the display panel; and a functional member having an elastic modulus and being disposed between the display panel and the window or at least partially on the window, the functional member including a plurality of first discontinuities having a greater elastic modulus than the elastic modulus of the first functional member.

Abstract: A glass-based preform for a mirror of a heads-up display (HUD) system, including a glass-based substrate having a first major surface, a second major surface opposite to the first major surface, and a minor surface connecting the first and second major surfaces; a first chamfer at an edge of the first major surface, the first chamfer having a first end at an intersection of the first chamfer and the first major surface and having a second end at an intersection of the first chamfer and the minor surface; and a second chamfer at an edge of the second major surface, the second chamfer having a first end at an intersection of the second chamfer and the second major surface and having a second end at an intersection of the second chamfer and the minor surface. The first chamfer has a different size or shape from the second chamfer.

Abstract: A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

Abstract: Described herein are window retrofits including a monolithic silica aerogel slab having (i) an average haze value of <5% as calculated in accordance with ASTM standard D1003-13 and (ii) a U-factor of <0.5 BTU/sf/hr/° F., and a transparent polymer envelope sealed at an internal pressure of ?1 atmosphere, wherein the monolithic silica aerogel slab is encapsulated in the transparent polymer envelope. The monolithic aerogel slab can have a transmittance >94% at 8 mm thickness. The window retrofit can be bonded to a glass sheet.

Abstract: The present disclosure relates to the technical field of film sticking, more particularly to a sticking film, a film-sticking tool and a film-sticking assembly. The sticking film includes a tempered film for attaching to the screen of an electronic product, and a release film layer attached to the tempered film. The release film layer is an electrostatic layer, the release film layer and the tempered film are separated when pasting, and the side of the release film layer that is attached to the tempered film generates static electricity to attract dust on the screen. Thus, static electricity can be generated when the release film layer and the tempered film are separated, which can attract dust on the screen of electronic products and clean the screen, and avoids dust particles from scratching the screen due to direct wiping of the screen, resulting in damage to the performance of the screen.

Abstract: An example acoustic tile is disclosed having a structure with at least one layer. A plurality of openings are formed in the at least one layer of the structure. The openings are configured to direct sound waves hitting the structure in multiple different directions through the at least one layer to absorb a majority of the sound waves and inhibit the sound waves hitting the structure from reflecting off of the structure. In an example, the openings are juxtaposed, different sizes, different orientations, and/or different numbers of openings on separate layers.

Abstract: An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 ?m to 300 ?m, and an inclination angle due to the warpage of 0.0004° to 0.12°.

Abstract: Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

Abstract: Provided herein are multilayer damping laminates comprising at least one constraining layer and at least one discontinuous damping layer. At least one discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein the percent coverage of at least one discontinuous damping layer by one or more damping material regions is less than 99%. Also provided are systems and methods using the multilayer damping laminates.

Abstract: This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.