Patents Examined by Elvin G. Enad
  • Patent number: 10832850
    Abstract: A hand-held, water-cooled toroidal autotransformer assembly is formed from longitudinally-oriented electrically conductive radially spaced apart concentric pipes that are physically and electrically configured in series and arranged around a longitudinally-oriented toroidal magnetic core to form the windings of the autotransformer with the spaces between the longitudinally-oriented concentric pipes forming a flow path for a cooling fluid within the autotransformer.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: November 10, 2020
    Assignee: Radyne Corporation
    Inventors: Roberto Bernardo Benedicto Ovando, Thomas Cahill, Robert F. Adamczyk, John Justin Mortimer
  • Patent number: 10825597
    Abstract: A helical stacked integrated transformer formed by a first inductor and a second inductor includes a first helical coil that has a first outer coil and a first inner coil, a second helical coil that shares an overlapped region with the first helical coil and has a second outer coil and a second inner coil, and a connection structure that connects the first helical coil and the second helical coil. The first inner coil is located inside the first outer coil and the second inner coil is located inside the second outer coil. The first inductor includes a part of the first helical coil and a part of the second helical coil. The second inductor includes a part of the first helical coil and a part of the second helical coil.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: November 3, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 10825600
    Abstract: A coil component includes: a first coil layer; and a second coil layer disposed on the first coil layer, wherein the first coil layer includes a first insulating layer and a first coil conductor embedded in the first insulating layer, the second coil layer includes a second insulating layer and a second coil conductor embedded in the second insulating layer, the first and second coil conductors are electrically connected to each other by a through-conductor formed in the first insulating layer, and cavities vertically penetrating through the first and second coil layers are provided in core regions of the first and second coil layers, respectively.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Ho Cha, Sang Jae Lee, Jae Ha Kim
  • Patent number: 10818429
    Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 27, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Hua Liu
  • Patent number: 10818422
    Abstract: In a multilayer coil component, an end of a lower coil layer and an end of a connecting part are directly overlapped, and the end of the lower coil layer includes a contact edge positioned on a side of the connecting part and being in contact with the connecting part and a non-contact edge positioned on a side opposite to the connecting part and not being in contact with the connecting part. Then, the contact edge and the non-contact edge are not overlapped when viewed from a laminated direction. Consequently, a propagation distance of a crack becomes longer as compared with the case where an end face is parallel to the laminated direction, effectively suppressing advance of the crack. Suppressed advance of a crack in this manner makes the multilayer coil component provide a high component strength as a whole.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: October 27, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuusuke Nagai, Takashi Suzuki, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi, Takashi Endo
  • Patent number: 10818424
    Abstract: A coil component includes: a body in which a support member is disposed; and first and second coil conductors formed on first and second surfaces of the support member, respectively, the second surface of the support member opposing the first surface thereof, and including first and second lead portions extended to be exposed to the outside of the body, respectively. The first and second lead portions are formed in corner regions of the body.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Young Ghyu Ahn, Dong Hwan Lee, Jin Ho Ku
  • Patent number: 10811184
    Abstract: Provided is a reactor having a coil including a winding portion; a magnetic core including an inner core portion and an outer core portion; an inner resin portion with which a space between the winding portion and the inner core portion is filled; and an end surface interposed member is interposed between an end surface of the winding portion and the outer core portion and includes a through hole into which the inner core portion is inserted and a resin filling hole communicating with an interior of the winding portion between the winding portion and the outer core portion. The outer core portion includes at least one recessed portion on the circumferential edge portion of the inner end surface opposing the end surface of the inner core portion, and the recessed portion is recessed inward with respect to the end surface of the inner core portion.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: October 20, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shinichiro Yamamoto, Seiji Shitama
  • Patent number: 10811181
    Abstract: In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Scott Andrew Parish, Christopher Featherstone
  • Patent number: 10811177
    Abstract: A magnetic laminating structure and process for preventing substrate bowing include a first magnetic layer, at least one additional magnetic layer, and a dielectric spacer disposed between the first and at least one additional magnetic layers. The magnetic layers are characterized by defined tensile strength. To balance the tensile strength of the magnetic layer, the dielectric layer is selected to provide compressive strength so as to counteract the tendency of the wafer to bow as a consequence of the tensile strength imparted by the magnetic layer(s).
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bruce B. Doris, Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 10804021
    Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10796835
    Abstract: Embodiments of electronic devices, such as integrated circuit (IC) packages are disclosed. In one embodiment, an electronic device includes a first substrate and a second substrate. The first substrate has a first substrate body and a first inductor portion integrated into the first substrate body. Additionally, the second substrate comprises a second substrate body and a second inductor portion integrated into the second substrate body. The second substrate is mounted on the first substrate such that such that the second inductor portion is positioned over the first inductor portion and such that the second inductor portion is electrically connected to the first inductor portion so that the first inductor portion and the second inductor portion form a three dimensional (3D) inductor. By using two substrates, the 3D inductor can be increased in height while still allowing the substrates to be miniaturized and standardized for an IC package.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: October 6, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Michael F. Zybura, George Maxim, Dirk Robert Walter Leipold, John August Orlowski, Baker Scott
  • Patent number: 10796841
    Abstract: A magnetic component has a variable inductance over a range of DC bias currents. The component includes a bobbin with a coil positioned around a passageway between first and second end flanges. First and second E-cores have respective middle legs positioned in the passageway with end surfaces of the middle legs juxtaposed within the passageway and spaced apart by a first magnetic gap. An I-bar is positioned in the passageway parallel to and spaced apart from respective first longitudinal surfaces of the middle legs to form a second magnetic gap between the I-bar and the longitudinal surface of the middle leg of the first E-core and to form a third magnetic gap between the I-bar and the longitudinal surface of the middle leg of the second E-core. The magnetic component provides higher inductances for lower bias currents and provides lower inductances for higher bias currents.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 6, 2020
    Assignee: Universal Lighting Technologies, Inc.
    Inventors: Donald Folker, Mike LeBlanc, Thomas M. Poehlman
  • Patent number: 10796842
    Abstract: A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: October 6, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Yi-Min Huang, Chih-Siang Chuang, Yung-Cheng Chang
  • Patent number: 10790080
    Abstract: A transformer device includes first, second, and third windings, located in an insulating substrate by conductive vias joined together by conductive traces. Positions of the conductive vias are arranged so as to optimize the isolation properties of the transformer, and to improve the coupling of the transformer by increasing the leakage inductance and reducing the distributed capacitance. The transformer device is compact and is weakly coupled. The weak coupling between the windings reduces the likelihood of the transformer malfunctioning, particularly when used in a self-resonant converter circuit.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: September 29, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Quinn Kneller
  • Patent number: 10784034
    Abstract: A core structure includes a first magnetic cover, a second magnetic cover, and at least two winding columns and at least one common side column provided between the first magnetic cover and the second magnetic cover and opposite to each other. The side wall of the common side column towards the at least two winding columns is provided with at least one first protrusion which extends towards the gap formed between the two adjacent winding columns.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: September 22, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Haijun Yang, Zengyi Lu, Weilong Xia, Guodong Yin, Jinfa Zhang
  • Patent number: 10784040
    Abstract: A transmission line includes three wires formed on a substrate. Each of the transmission lines transmits a three-level signal. A common-mode choke coil is inserted into the transmission line. The common-mode choke coil includes three coils coupled to one another and three pairs of outer electrodes, each of the three pairs being connected to the corresponding two ends of the coils. The outer electrodes of the common-mode choke coil are connected to the transmission line such that the three coils are serially inserted into the respective three wires.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: September 22, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kota Takayama, Yoshihiro Imanishi, Shingo Uda
  • Patent number: 10784038
    Abstract: Disclosed herein is a common mode filter that includes a winding core part including first to third winding areas and first and second wires wound in a same direction around the winding core part and crossing each other in the third winding area. The first wire is aligned and wound in the first and second winding areas, and the second wire is aligned and wound on the first wire in the first and second winding areas, whereby a plurality of winding blocks are formed. The winding blocks include a first winding block positioned in the first winding area and second and third winding blocks positioned in the second winding area. The second wire constituting the second winding block and the second wire constituting the third winding block are separated from each other.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: September 22, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuma Komaya, Miki Kusakabe, Tomokazu Tsuchiya
  • Patent number: 10777348
    Abstract: A winding layer pitch compensation for an air-core reactor which has at least two radially spaced apart concentric winding layers, includes a first set of strip-shaped star sheets, each of which is configured to be arranged radially below or above the winding layers and which are provided with at least one receiving slot along an edge extending from that edge, a second set of strip-shaped compensation sheets, each of which is provided with at least one insert slot along an extending from another edge, where a compensation sheet can be inserted into each receiving slot of a star sheet in a formfitting manner, where the star sheet engages into the insert slot of the compensation sheet in a formfitting manner, and where the slot depths of at least two receiving slots of the set of star sheets are different.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: September 15, 2020
    Assignee: Siemens Aktiengesellschaft
    Inventor: Otto Haslehner
  • Patent number: 10770217
    Abstract: Mounting kit for a throttle with a toroidal core, wherein an insulating element which passes through the opening in the toroidal core is provided. The mounting kit includes a first half shell and a second half shell for accommodating the toroidal core, a baseplate, and a latching means and/or guide means to connect the first half shell, the second half shell, the insulating element and the baseplate to one another.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: September 8, 2020
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventor: Hassan Aarab
  • Patent number: 10770220
    Abstract: A planar transformer layer is provided. The planar transformer comprises distinct electrical connections and thermal connections. An assembly of layers for a planar transformer is also provided. An electronic energy conversion equipment item for a satellite provided with at least one planar transformer is also provided.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: September 8, 2020
    Assignee: THALES
    Inventors: Philippe Vandeplassche, Thierry Scalais