Abstract: The voltage application probe and the voltage measurement probe are connected to the voltage application pad and the voltage measurement pad of the semiconductor device. The voltage application pad and the voltage measurement pad are connected by the conductor, measuring the voltage applied to the voltage application pad through the voltage measurement probe. The voltage compensation circuit in the voltage development device operates to make the voltage applied to the voltage application pad equal to the set voltage for the voltage development device. Even when the resistance between the voltage application probe and the voltage application pad increases, the accurate setting voltage is applied to the voltage application pad.

Abstract: Provided is a test apparatus including a test head main body 130 that communicates a signal with the device under test 200, a prober 110 on which the device under test 200 is mounted, and a probe card 300 positioned between the test head main body 130 and the prober 110, where the probe card 300 includes: a plurality of probe pins 320 provided on a surface thereof facing the prober 110 and electrically connected to a terminal of the device under test 200; a plurality of test head pads 330 provided on a surface thereof facing the test head main body 130 and electrically connected to spring pins 129 on the test head main body 130 and to the probe pins 320; and prober pads 340 provided on a surface thereof facing the prober 110 and electrically connected to the plurality of probe pins 320.

Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

Abstract: An embodiment of a voltage-measuring circuit includes: a first resistor connected to a first measurement node; a second resistor connected to the first resistor and a second measurement node; a configuration switch configured to, in response to a control signal, selectively interconnect the first and second resistors, during enable and disable phases of the control signal respectively, into and out of either a parallel or a series configuration; and a control and measurement circuit configured to provide the control signal, receive a first measurement voltage from the first and second measurement nodes during the enable phase, and receive a second measurement voltage from the first and second measurement nodes during the disable phase.

Abstract: A method for testing an MR element includes a step of obtaining a ferromagnetic resonance frequency f0 of the MR element to be tested by applying an external magnetic field in a track-width direction to the MR element, a step of calculating a stiffness magnetic field Hstiff from the obtained ferromagnetic resonance frequency f0 using a predetermined formula, a step of obtaining a relationship of a stiffness magnetic field Hstiff with respect to an external magnetic field applied in the track-width direction from the applied external magnetic field and the calculated stiffness magnetic field Hstiff, a step of obtaining a uniaxial anisotropic magnetic field Hk of a free layer of the MR element from the obtained relationship of the stiffness magnetic field Hstiff with respect to the external magnetic field applied, and a step of judging whether the MR element is good product or not by comparing the obtained uniaxial anisotropic magnetic field Hk with a predetermined threshold.

Abstract: A test probe is provided. The test probe includes a group of shielding boards and two probe pins. The group of shielding boards has two opposite surfaces. The group of shielding boards includes at least two insulation boards and at least one metal board. The metal board is formed between the two insulation boards. The two probe pins are formed on the two surfaces of the group of shielding boards and have a distance between each other.

Abstract: A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test data and generates response data. A signal representing the response data is transmitted to the interface device through electromagnetically coupled structures on the device under test and the interface device.

Abstract: A detecting system for detecting the connection of two connectors includes a number of first and second linking lines. The detecting system includes a number of first detection switches, a number of pull-down resistors, a number of second detection switches, a number of pull-up resistors, and a detection module. Each first linking line is grounded via each first detection switch and each pull-down resistor in series. The terminals of the pull-down resistors connected to the first detection switches are defined as first detecting ends. Each second linking line is electrically coupled to a high potential via each second detection switch and each pull-up resistors in series. The detection module with a threshold value preset is configured for comparing the voltage value at the first detecting ends with the threshold value, and outputting a result to determine whether the first linking lines are electrically connected to the second linking lines respectively.

Abstract: A liquid crystal display includes; a plurality of pixels, each of which comprises a switching element having a control terminal and an input terminal connected to a corresponding gate line of a plurality of gate lines and a corresponding data line of a plurality of data lines, respectively, at least one test pixel comprising at least one test switching element having a control terminal connected to a corresponding at least one gate line of a plurality of gate lines, and a sensing unit which measures a leakage current flowing through the test pixel and to control compensation driving of a threshold voltage of a switching element of a pixel according to the measured leakage current.

Abstract: A reel shaft sensor is provided for a barcode printer and is applied to a reel shaft of the barcode printer. The reel shaft sensor device includes a plurality of magnetic elements and at least one magnetic sensor. The reel shaft has an end to which a connection member is mounted for coupling the interior of a housing of the barcode printer. The magnetic element is arranged inside the connection member and the magnetic sensor is installed inside the housing of the barcode printer and corresponding in position to the connection member. The magnetic sensor detects a magnetic signal from the magnetic elements that rotates with the reel shaft to determine the rotational speed and angular position of the reel shaft. The device is a small-size, magnetism operating shaft sensor.

Abstract: The present invention provides a current measuring apparatus having an improved structure to inhibit the possible adverse effect of a current in a different phase and the possible generation of an induced electromotive force caused by a measurement target current, enabling the measurement target current to be accurately detected even with the small size of the apparatus.

Abstract: A process or apparatus for testing a plurality of semiconductor dies on a semiconductor wafer utilizing a tester configured to test the dies in groups can include controlling as a logical whole provision of first test signals through a plurality of first communications channels to first probes organized into a plurality of N first probe die groups each configured to contact a different one of the dies of the wafer. One of the first communications channels can be a first common communications channel connected to probes in X of the N first probe die groups but not to probes in Y of the N first probe die groups. X can be at least two and Y can be at least one. The process can also include controlling as a logical whole provision of second test signals through a plurality of second communications channels to second probes organized into a plurality of second probe die groups each configured to contact a different one of the dies of the wafer.

Abstract: In one embodiment, a power supply controller is configured to operate in a test mode that facilitates measuring the value of an output signal of an error amplifier of the power supply controller.

Abstract: In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.

Abstract: A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Abstract: An inspection method includes performing an inspection by applying a probe to pads of a contact check pattern located, together with a chip pattern, on a wafer, and performing an inspection by applying the probe to pads of the chip pattern if a result of the inspection using the contact check pattern is within a predetermined range. A pattern having the same size as that of the chip pattern, differing in external appearance from the chip pattern, and having the same pads as those of the chip pattern is used as the contact check pattern.

Abstract: In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

Abstract: Provided are a substrate of a probe card for installing a plurality of probes thereon to inspect an object by contacting the probes to the object, and a method for repairing the substrate. The substrate includes main channels electrically connected to the probes; and at least one spare channel for replacing the main channels when at least one of the main channels is damaged. Therefore, when some of the main channels of the probe substrate are damaged, the damaged main channels can be repaired using the spare channels and then the probe substrate can be reused, thereby reducing costs required for unnecessary replacement.