Abstract: A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.

Abstract: A package assembly (18) that is selectively coupled to a burn-in apparatus (228P) during a burn-in process includes a pin-out (20) having an array of contacts (22) including a set of first contacts (222F) and a set of second contacts (222S). The first contacts (222F) are required for the burn-in process, and are each adapted to be in contact with a corresponding contact member (232P) of the burn-in apparatus (228P) during the burn-in process. The second contacts (222S) are not required for the burn-in process. The second contacts (222S) do not contact any of the contact members (232P) during the burn-in process. The contact members (232P) are arranged at a first pitch. In various embodiments, the array of contacts (22) is arranged at a second pitch that is smaller than the first pitch.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

Abstract: A test head for testing a DUT includes a probe card having a plurality of DUT probes, the probes being in contact with the DUT during the testing; an instrument carrier, the instrument carrier being located above the DUT during the testing; and a SMU mounted on the carrier for each of the probes, each SMU being operably connectable to a respective probe, wherein the carrier is moved with respect to the probe card to permit replacement of the probe card.

Abstract: A transfer system includes an energy meter, a transfer switch, an automatic disconnect device, and a detector. The energy meter includes an input structured to receive a first power source, and a power output. The transfer switch includes a first input electrically connected to the power output of the energy meter, a second input, an output, and a mechanism structured to transfer one of the first and second inputs to the output of the transfer switch. The automatic disconnect device includes a first input structured to receive a second power source, a second input, an output, and a mechanism structured to electrically connect or disconnect the first input and the output of the automatic disconnect device responsive to the second input. The detector is structured to detect presence of the energy meter and output a corresponding signal to the second input of the automatic disconnect device.

Abstract: A test structure for electromigration and related method are disclosed. The test structure may include an array of a plurality of multilink test sets, each multilink test set including a plurality of metal lines positioned within a dielectric material and connected in a serial configuration; each multilink test set being connected in a parallel configuration with the other multilink test sets, the parallel configuration including a first electrical connection to a cathode end of a first metal line in each multilink test set and a second electrical connection to an anode end of a last metal line in each multilink test set.

Abstract: Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.

Abstract: Disclosed are a connector for measurement of electric resistance, by which necessary electrical connection is surely achieved even when a circuit board to be inspected is large in area and has a great number of small-sized electrodes to be inspected, and measurement is surely performed with high precision, and which can be produced at a low cost, and an electric resistance-measuring apparatus and an electric resistance-measuring method for circuit boards, which make use of this connector. The connector for measurement of electric resistance has a first electrode sheet, an anisotropically conductive elastomer sheet arranged on a back surface of the first electrode sheet and having through-holes formed corresponding to the electrodes to be inspected, and a second electrode sheet arranged on a back surface of the anisotropically conductive elastomer sheet.

Abstract: An operating method for a prober apparatus is disclosed which includes controlling the temperature of at least one part of the prober apparatus. Another operating method for a prober apparatus includes production and transfer of thermal energy between means for the exchange of heat and at least one component of the prober apparatus, wherein the production, the transfer or the production and the transfer of thermal energy is controlled. A prober apparatus includes at least one heat exchange element disposed in a spatial relation to at least one probe tool support so as to have an impact on the temperature thereof.

Abstract: An electronic element testing apparatus for use with a number of probes. Each probe has a lower pole and an upper pole. The apparatus includes: a first plate having a first side and a second side, the first side having an array of lower pole regions disposed thereabout, each lower pole region configured to receive a lower pole of a probe; and a plurality of signal conductor regions disposed proximate the array of lower pole regions, each signal conductor region arranged to provide a non-cable electrical path between a lower pole region and a switching circuit. The switching circuits are operable to sequentially connect each electronic element to a testing circuit via the upper and lower poles.

Abstract: An apparatus for a power bus includes an inductive power harvesting unit structured to provide a first power output arising from current flowing in the power bus, an energy storage unit structured to store energy from the first power output and to provide a second power output, and a selector structured to select one of the first and second power outputs and to provide a third power output from the selected one. A processor is powered from the third power output of the selector. The selector is further structured to normally provide the third power output from the first power output of the inductive power harvesting unit. The processor is structured to determine that the first power output of the inductive power harvesting unit is inadequate and to cause the selector to provide the third power output from the second power output of the energy storage unit.

Abstract: Measuring module for the measurement of an object (6), having a measuring chamber (4), with a contact element (5a, 5b), wherein the object to be measured (6) is thermally connected to a first contact surface (9a) of the contact element (5a, 5b), and having a cold head (1b, 2b, 2c) that can be thermally connected to a second contact surface (9b) of the contact element (5a, 5b), wherein the contact element (5a, 5b) consists of material with high thermal conductivity, characterized in that the cryo-refrigerator (1a, 2a) together with the cold head is housed in a refrigerating chamber (3) that is physically separated from the measuring chamber (4) and can be evacuated separately from the latter, and the contact element (5a, 5b) is thermally insulated from the outside wall of the measuring module, is part of a separating wall between the measuring chamber (4) and the refrigerating chamber (3), and makes a local thermal connection between the measuring chamber (4) and the refrigerating chamber (3), and with a conta

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: It is an object of the present invention to realize sure electrical connection between a contactor and an object to be inspected without influenced by heat, a reduction in the pre-heating time, and an enhanced throughput. A probe card of the present invention includes a contactor, a printed wiring board, an interposer provided between the contactor and the printed wiring board to have the both in elastic and electrical contact with each other, a coupling member integrating these, and a reinforcing member reinforcing the printed wiring board integrated via the coupling member.

Abstract: A display panel is provided, which includes: a plurality of gate lines; a plurality of data lines intersecting the gate lines; a plurality of switching elements connected to the gate lines and the data lines; a plurality of pixel electrodes connected to the switching elements; a plurality of driving signal lines transmitting a plurality of driving signals; a plurality of test pads for test signals disposed near an edge of the panel; and a gate driver generating and applying gate signals to the gate lines responsive to the driving signals transmitted from the driving signal lines.

Abstract: A support block has a first face, a second face opposed to the first face, and first and second through holes communicating between the first face and the second face, and is formed with resin material. The first face, the second face, and the first and second through holes are covered with an electrically conductive plated coating. First and second probes are electrically connected to terminals of a device to be tested provided on a side of the first face and to terminals connected to a testing apparatus provided on a side of the second face. The first probe is provided in the first through hole and is electrically connected to the plated coating on the first through hole, the second probe is provided in the second through hole and is electrically connected to the plated coating on the second through hole.

Abstract: A current transformer detects a sine-wave alternating current having a maximum effective current value Imax(Arms) and a frequency f(Hz) and a half-sine-wave rectified current having a maximum peak value Ipeak(Aop) and a frequency f(Hz) in a primary winding, consisting of at least one magnetic core with one turn of primary winding and at least one multiple turns of secondary winding to which a detecting resistor is connected.

Abstract: A short detection circuit to detect a short condition in a backlight module, wherein the backlight module comprises a WLED circuit having a first terminal connected to an output voltage and second terminal connected to a driver IC. The short detection circuit comprises: a PMOS, a NMOS, a load and a detection module. The gate of the PMOS receives a first voltage and the source of the PMOS connects to the second terminal; the gate of the NMOS receives a reference voltage, the drain of the NMOS connects to the drain of the PMOS and the source of the NMOS connects to a detection terminal. The voltage of the detection terminal becomes a high state when the WLEDs have a short condition; and the detection module is connected to the detection terminal, when the voltage of the detection terminal becomes a high state, the detection module detects a short condition.

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.