Abstract: A large surface area ultrasonic block horn includes one or more shaped elements having a node at a mid-point of the shaped element that is narrower than opposed ends of the shaped element.

Abstract: An aluminum clad member is produced by: disposing a joining assistance member at a joint interface between an Al core member and an Al skin member, which joining assistance member being formed by crossing Al wires with each other in longitudinal and lateral directions to form a grid, and having a structure in which spot-like thick portions having a thickness of 0.2-3.2 mm are formed at intersections of the Al wires and arranged in the longitudinal and lateral directions so as to be spaced apart from each other by a distance of 0.2-13 mm; and performing a hot rolling operation with respect to the thus obtained stack of the Al core member, the Al skin member and the joining assistance member, by partially fixing together those members at their peripheral portions or without fixing together those members, such that the joint interfaces is communicated with an ambient air.

Abstract: A vibration dampening device for the manufacture by rotational friction welding of a turbomachine rotor including a first disc and a second disc each having a hub with an internal surface is provided. The device includes a first clamping device configured to be positioned coaxially to the hub of the first disc and having a pair of radially opposite jaws suited to come into contact with the internal surface of the hub of the first disc.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.

Abstract: The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.

Abstract: A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.

Abstract: A modular soldering station includes a first platform having a liquid reservoir and a solder dispenser, a power supply assembled to the first platform and configured to power a soldering iron, and a second platform assembled to one of the first platform or the power supply and having a fluid absorbent medium fluidly coupled to the liquid reservoir.

Abstract: A welded stent and stent delivery system, with a stent including a first strut having a first strut nickel titanium alloy layer and nickel titanium soluble core, the first strut nickel titanium alloy layer being disposed around the first strut nickel titanium soluble core; and a second strut having a second strut nickel titanium alloy layer and nickel titanium soluble core, the second strut nickel titanium alloy layer being disposed around the second strut nickel titanium soluble core, the second strut nickel titanium alloy layer being connected to the first strut nickel titanium alloy layer with a weld. The first and second strut nickel titanium alloy layers are made of a nickel titanium alloy, the first and second strut nickel titanium soluble cores are made of a nickel titanium soluble material, and the weld is made of an alloy of the nickel titanium alloy and the nickel titanium soluble material.

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Abstract: A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.

Abstract: A method and apparatus manufactures a closed structure part without flange having a curvature and welded edges along a longitudinal direction of the part and further having a varying cross-sectional shape, from two metal plates. Each of two metal plates provided with a curvature along the longitudinal direction of the plate and provided with both ends in a width direction of the plate, are press-formed such that a folding line is formed at positions corresponding to a non-welded bent edge in a cross section of the part, and stacked on each other vertically such that their bulging sides face outward. Their left ends and right ends in the width direction are mutually welded along the longitudinal direction to form welded edges.

Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.

Abstract: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase percentage in the member to be bonded (3) is from 5 to 35%.

Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

Abstract: A method of shaping a metallic honeycomb panel using a continuous drive sheet. The metallic honeycomb panel may have a perforated upper sheet, a non-perforated lower sheet, and a metal honeycomb core fixed between the upper and lower sheets. The method may include the steps of designing and manufacturing the drive sheet using finite element analysis (FEA) and criteria regarding shaping of the metallic honeycomb panel, then welding the drive sheet to the lower face of the lower sheet. The drive sheet may cover all of the lower face of the lower sheet and may have varying thicknesses determined based on the criteria and the FEA. The method may also include the steps of heating the drive sheet and metallic honeycomb panel to a creep forming or hot-stretch forming temperature and urging the metallic honeycomb panel and drive sheet into a male or female die mold to be shaped.

Abstract: A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.