Patents Examined by Erin Saad
  • Friction pull plug and material configuration for anti-chatter friction pull plug weld
    Patent number: 9452491
    Abstract: A friction pull plug is provided for use in forming a plug weld in a hole in a material. The friction pull plug includes a shank and a series of three frustoconical sections. The relative sizes of the sections assure that a central one of the sections defines the initial contact point between the hole's sides. The angle defined by the central one of the sections reduces or eliminates chatter as the plug is pulled into the hole.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: September 27, 2016
    Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Justin Anderson Littell
  • Dual walled titanium tubing and methods of manufacturing the tubing
    Patent number: 9446483
    Abstract: Within examples, a method of manufacturing a double-walled titanium conduit is described. Example methods include stitch welding multiple concentric sheets to form a stitch layer, providing the stitch layer between an inner wall and an outer wall of the double-walled titanium conduit, circumferentially seam welding the inner wall and the outer wall to the stitch layer to create a welded assembly, die forming the welded assembly at temperature and pressure to form inner structures between the multiple concentric sheets according to stitch welding lines and to enable a diffusion bond process among the inner wall, the stitch layer, and the outer wall, and removing the double-walled titanium conduit from the die.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: September 20, 2016
    Assignee: The Boeing Company
    Inventor: Charles William Rust
  • Integrate rinse module in hybrid bonding platform
    Patent number: 9446467
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: September 20, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Device and method for bonding substrates
    Patent number: 9443820
    Abstract: A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space. The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: September 13, 2016
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Bernhard Rebhan
  • Increasing solder hole-fill in a printed circuit board assembly
    Patent number: 9427828
    Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: August 30, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen M. Hugo, Matthew S. Kelly
  • Brazing method
    Patent number: 9427817
    Abstract: According to this brazing method, a first base member having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a brazing foil, and a second base member having a surface are arranged in this order so that the non-plated surface of the first base member and the surface of the second base member are faced with each other. The first base member and the second base member are brazed by using the brazing foil. The cost of providing a diffusion barrier layer between the first base member and the brazing foil is thereby reduced.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: August 30, 2016
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kosuke Nishikawa, Tetsuya Morifuji, Kyozo Mizuno, Nobuki Negoro
  • Preconditioned bus bar interconnect system
    Patent number: 9431644
    Abstract: A method is provided for interconnecting the batteries in a battery pack in a manner that is designed to minimize damage and contamination of the contact surfaces of the interconnect and the battery terminal, thereby minimizing connection resistance and increasing interconnect reliability.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: August 30, 2016
    Assignee: ATIEVA, INC.
    Inventor: Martin Forest Eberhard
  • Low-stress TSV design using conductive particles
    Patent number: 9433100
    Abstract: A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: August 30, 2016
    Assignee: Tessera, Inc.
    Inventors: Charles G. Woychik, Kishor Desai, Ilyas Mohammed, Terrence Caskey
  • Method for connecting wire material and twisted wire, and stator of electric motor or generator
    Patent number: 9419490
    Abstract: The present invention is directed to connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. A twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: August 16, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Daiki Kajita, Nobuaki Nakasu, Hiroshi Hamano, Yoshimi Mori, Takeshi Matsuo
  • Friction stir weld plugs and methods of using thereof
    Patent number: 9409253
    Abstract: In one aspect of the disclosure, an article for filling an opening in an object includes a plug having a body, a first flange, and a second flange. The plug has a trailing end. The first flange is in contact with the body and extends away from the body. The second flange is in contact with the first flange and extends away from the first flange and the body. The second flange is configured to deform toward the body upon installation of the plug into the opening. This deformation of the second flange rotationally and translationally secures the plug in the opening and consolidates the plug in the opening.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: August 9, 2016
    Assignee: The Boeing Company
    Inventors: Mike P. Matlack, Amy M. Helvey, Randy A. Card
  • Method for the brazing of parts made from a composite material, incorporating a slug in the bond
    Patent number: 9403240
    Abstract: A method of assembling together by brazing first and second parts made of composite material, each of the first and second parts having an assembly face for brazing with the assembly face of the other part, the method including making at least one perforation in the assembly face of the first part; interposing capillary elements between the assembly faces of the first and second parts made of composite material; placing the first and second parts facing each other while inserting a peg in each perforation of the first part; placing a brazing composition in contact with a portion of the capillary elements; and applying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: August 2, 2016
    Assignees: HERAKLES, COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
    Inventors: Thomas Revel, Eric Conete, Eric Philippe, Guilhem Roux, Philippe Bucci
  • Electronic component mounting apparatus and the same method thereof
    Patent number: 9398736
    Abstract: A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: July 19, 2016
    Assignee: SHINKAWA LTD.
    Inventors: Satoru Nagai, Yukitaka Sonoda
  • Method and apparatus to construct metal securement member for an aircraft
    Patent number: 9394062
    Abstract: The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 19, 2016
    Assignee: THE BOEING COMPANY
    Inventors: Brad L. Kirkwood, Paul S. Gregg, Gerald D. Miller, Jeff D. Will, David W. Evans
  • Methods and systems for aligning tooling elements of ultrasonic bonding systems
    Patent number: 9393641
    Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: July 19, 2016
    Assignee: Orthodyne Electronics Corporation
    Inventors: Jonathan Michael Byars, Garrett Leigh Wong
  • Method of joining a chip on a substrate
    Patent number: 9393633
    Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: July 19, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Pascal P Blais, Paul F Fortier, Kang-Wook Lee, Jae-Woong Nah, Soojae Park, Robert L Toutant, Alain A Warren
  • Method of manufacturing surface mount device
    Patent number: 9392702
    Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: July 12, 2016
    Assignee: FUJITSU COMPONENT LIMITED
    Inventors: Takeshi Okuyama, Toshihiro Kusagaya, Tohru Yamakami
  • Semiconductor device manufacturing method
    Patent number: 9385103
    Abstract: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weight having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: July 5, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shinji Sano, Tatsuo Nishizawa
  • Movable backing system
    Patent number: 9381597
    Abstract: Thus relates to a movable backing system for clamping plate-shaped backing work pieces for friction agitation welding and friction stir welding and to a friction agitation or stir welding system. The movable backing system comprises an upper unit to be arranged above the backing work pieces to support the backing work pieces, a lower unit to be arranged below the backing work pieces to support the backing work pieces, and a connecting means connecting the upper and the lower unit to be arranged in a gap between the backing work pieces to be welded.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: July 5, 2016
    Assignee: AIRBUS OPERATIONS GMBH
    Inventor: Dirk Stermann
  • Implantable medical device feedthroughs and housings
    Patent number: 9381590
    Abstract: Embodiments are generally directed to a feedthrough for an implantable medical device. The feedthrough comprises an insulator having one or more conductors extending therethrough that is hermetically connected (joined) to a housing of the implantable medical device. More specifically, the housing includes an aperture and the insulator is configured be positioned in the aperture. Braze material is configured to be positioned in one or more indentations in at least one of the housing or the insulator such that the braze material is disposed in the indentations between the insulator and the housing.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: July 5, 2016
    Assignee: Cochlear Limited
    Inventors: Anthony Powell, Graham Ball, Melvyn Clarke, Charles Roger Aaron Leigh, Grahame Walling, Kenny Crichton
  • Fin stock material
    Patent number: 9377249
    Abstract: A fin stock material from an 3xxx-series aluminum alloy and including at least 0.5% to 2.0% Mn, and furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to 0.5%, Se 0.03% to 0.5%, Y 0.03% to 0.05%, Th 0.03% to 0.05%, and the sum of these elements being 0.5% or less, with the remainder including aluminum and tolerable impurities. Also provided is a method for manufacturing a heat exchanger assembly incorporating such a fin stock material.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: June 28, 2016
    Assignee: ALERIS ROLLED PRODUCTS GERMANY GMBH
    Inventors: Adrianus Jacobus Wittebrood, Steven Kirkham, Achim Burger, Klaus Vieregge