Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract: A brazing process, a braze assembly, and a brazed article are disclosed. The brazing process includes applying a braze material to an article within a vacuum chamber while the vacuum chamber is substantially evacuated. The braze assembly is capable of applying a braze material to an article within a vacuum chamber while the vacuum chamber is substantially evacuated. The brazed article is devoid of re-formed oxides.

Abstract: A method for forming a joint between a tube and a sheet includes forming an anvil at least within the tube, and welding the tube to the sheet in the presence of the anvil. The anvil includes an anchor which is placed within the tube near or at the joint to be formed. At least one washer is placed over the end of the anchor that is near the joint to be formed. A threaded fastener is then placed into the anchor to securely hold the anchor within the tube and to provide a backing substantial enough so that a friction stir weld can be formed. The threaded fastener and the washer can be used as a guide for the friction stir weld. Once the weld is completed, the anvil can be removed. The weld can be further processed to remove burrs and other material.

Abstract: A method for manufacturing a closed structure part has a closed section using a blank made from a metal plate by pressing the blank using a press forming die and fixing a pair of joint ends of the blank to each other, the method including a pre-forming step of processing the blank into an interim part having a closed section corresponding to the closed structure part, a closing step of, after the pre-forming step is completed, moving the joint ends of the interim part toward each other and urging, against one of the joint ends, a concave flange processing portion formed on one of a pair of press forming surfaces of the press forming die at the edge end adjacent to the other press forming surface, and a press joining step of, after the closing step is completed, further moving the press forming die in a pressing direction, bending the one of the joint ends using a pressing force applied from the flange processing portion so that the joint end overlaps the outer surface of the other join end and a latch flange

Abstract: A friction stir processing apparatus comprises a tool, a processing head retaining the tool, a support table retaining the workpiece, and a cylinder unit biasing the support table toward the tool. The tool having a probe projecting from a shoulder surface, for performing friction stir processing on a workpiece made of a metal material. The processing head is pressing the tool against the workpiece so as to relatively shift the tool in a processing direction. The friction stir processing apparatus comprises load control means for controlling to constantly keep the bias force of the cylinder unit so as to constantly keep pressurizing force of the tool pressing the workpiece. It is thus possible to perform friction stir processing with excellent quality even when the workpiece has a different thickness or is made of a different material.

Abstract: A method is provided for producing a pipe from a band which has a layer of a first metal and a layer of a second metal, the layers being metallurgically bonded to one another over the entire length of the band. Along the two longitudinal edges of the band, the first metal is removed from the second metal in strips which run over the entire length of the band. The band is formed into the open-seam pipe with the first metal located on the outside, and the abutting edges of the layer of the second metal are welded to one another forming a pipe which is closed all the way round. In the region of the weld seam, a layer of the first metal is then deposited on the second metal to produce a pipe with a layer of the first metal which is closed all the way round.

Abstract: An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.

Abstract: The present invention is a vacuum insulated panel (VIP) for increasing the thermal insulation surrounding a structure or volume, and a novel method for manufacturing the VIP. The VIP comprises at least two pieces of thin metal foil welded together adjacent the edges of said metal foil, said thin metal foil material defining the exterior of a sealed and gas evacuated vacuum enclosure; and a vacuum insulation panel core located between said at least two pieces of welded thin metal foil material, said vacuum insulation panel core located inside said sealed and gas evacuated vacuum enclosure.

Abstract: A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.

Abstract: A heat exchanger has a corner metal temperature attenuator that may attenuate a localized stack wise temperature gradient. The corner metal temperature attenuator may locally reduce or eliminate the source of large amplitude temperature swings near the end of the stack of passages which are correlated with the areas of greatest low cycle fatigue (LCF) damage. The corner metal temperature attenuator may locally block the inlet flow to every other (alternating) passage in the stack, beginning with the second passage inward from each end of the stack. The width of the blocked flow at any passage can be minimized using existing analytical methods to determine the threshold at which the metal damage index (DI) falls below a predetermined threshold at that location. Since the damage index naturally attenuates toward the passage stack midplane, the width of the blocked flow may also be reduced moving toward the stack midplane and eventually may go to zero blockage for all remaining alternating passages.

Abstract: The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to

Abstract: A method for producing a metal container includes providing first and second metals. The first metal has a first melting point, and the second metal has a second melting point higher than the first melting point. The first metal is adapted to form an engagement portion. The second metal is in the form of a container having a bottom plate. The first metal has first and second faces. The bottom plate has an outer face. The method further includes positioning the first metal on the bottom plate and heating the first and second metals until the first metal turns into a semi-molten state. The method further includes rotating and compressing a mold onto the first face in order to distribute the semi-molten first metal along the outer face to form the engagement portion. The method further includes removing the mold and engaging a heating member with the engagement portion.

Abstract: A method of bonding a first component (10) comprising a titanium-containing alloy to a second metal component (12), wherein a coating layer (14,16) is applied to each of the first and second components in the region to be bonded. The coating layers (14,16) comprise a precious metal. An intermediate metallic layer (18) is interposed between the coating layer (14) of the first component and the coating layer (16) of the second component. The respective coating layers are held in contact with the intermediate layer (18) and the coating layers and the intermediate layer are heated to initiate melting of at least one of said layers so as to form a bond between the first and second components by brazing.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A continuous hot bonding method for producing a bi-material strip with a strong bond therebetween is provided. The method comprises sanding a first strip formed of steel; and applying a layer of first particles, typically formed of copper, to the sanded first strip. The method next includes heating the first strip and the layer of the first particles, followed by pressing a second strip formed of an aluminum alloy onto the heated layer of the first particles. The aluminum alloy of the second strip includes tin particles, and the heat causes the second particles to liquefy and dissolve into the melted first particles. The first particles and the second particles bond together to form bond enhancing metal particles, which typically comprise bronze.

Abstract: Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.

Abstract: A thermal barrier tile (34) with a braze layer (46) co-sintered to a ceramic layer (48) is brazed to a substrate (26) of a component for fabrication or repair of a thermal barrier coating (28) for example on a gas turbine ring segment (22, 24). The tile may be fabricated by disposing a first layer of a metal brazing material in a die case (40); disposing a second layer of a ceramic powder on the metal brazing material; and co-sintering the two layers with spark plasma sintering to form the co-sintered ceramic/metal tile. A material property of an existing thermal barrier coating to be repaired may be determined (90), and the co-sintering may be controlled (93) responsive to the property to produce tiles compatible with the existing thermal barrier coating in a material property such as thermal conductivity.

Abstract: A method of providing a mold with a conformal cooling passage includes rough machining a mold cavity generally corresponding to a molded part shape using CAD data. Conformal cooling slots are cut in the mold cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mold part shape using the CAD data.

Abstract: In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.